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Remote Asic Rtl Design Engineer Jobs (NOW HIRING)

K2 Space

Principal ASIC Package Design Engineer

$200K - $280K/yr

The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...

K2 Space

Senior ASIC Package Design Engineer

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

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How much do remote asic rtl design engineer jobs pay per year?

As of May 31, 2026, the average yearly pay for remote asic rtl design engineer in the United States is $150,195.00, according to ZipRecruiter salary data. Most workers in this role earn between $131,500.00 and $180,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Remote ASIC RTL Design Engineer, and why are they important?

To thrive as a Remote ASIC RTL Design Engineer, you need a solid background in digital design, computer engineering, and hardware description languages like Verilog or VHDL, often supported by a relevant degree. Proficiency with industry-standard EDA tools such as Synopsys, Cadence, or Mentor Graphics, as well as experience with simulation, synthesis, and version control systems, is crucial. Strong problem-solving, self-motivation, and effective remote communication skills distinguish top performers in this role. These skills ensure accurate, efficient design cycles and effective collaboration across distributed teams, leading to successful chip delivery.

What are some common challenges faced by Remote ASIC RTL Design Engineers, and how can they be addressed?

Remote ASIC RTL Design Engineers often face challenges such as coordinating with distributed teams across different time zones and ensuring effective communication during complex design phases. To address these issues, it’s important to establish clear documentation practices, utilize collaboration tools like version control and video conferencing, and schedule regular check-ins with team members. Additionally, staying proactive in seeking feedback and clarifying design specifications helps ensure alignment and reduces misunderstandings. Building strong virtual relationships with verification and backend teams can also streamline the handoff process and overall project flow.

What is a Remote ASIC RTL Design Engineer?

A Remote ASIC RTL Design Engineer is a professional who specializes in designing the Register Transfer Level (RTL) code for Application-Specific Integrated Circuits (ASICs) while working remotely. Their main responsibilities include creating and verifying digital circuit designs using hardware description languages such as Verilog or VHDL. These engineers collaborate with hardware teams to ensure functionality, performance, and power requirements are met, all while operating from a location outside of a traditional office setting. They often use remote collaboration tools and simulation software to review and validate designs before fabrication.

What is the difference between Remote Asic Rtl Design Engineer vs Remote Digital IC Design Engineer?

AspectRemote Asic Rtl Design EngineerRemote Digital IC Design Engineer
Primary FocusRegister Transfer Level (RTL) design for ASICsDigital integrated circuit design at the IC level
Skills & CertificationsHDL (Verilog/VHDL), EDA tools, verificationHDL, circuit simulation, verification, FPGA experience
Work EnvironmentASIC design teams, hardware developmentIC design teams, semiconductor industry
Industry UsageUsed in ASIC development for various applicationsUsed in digital IC manufacturing and prototyping

Both roles involve digital design and HDL skills, but the Remote Asic Rtl Design Engineer focuses on RTL coding for ASICs, while the Remote Digital IC Design Engineer covers broader digital IC design, including FPGA and chip-level work. They share similar credentials and work environments, often overlapping in semiconductor companies.

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Principal ASIC Package Design Engineer

K2 Space

Remote

$200K - $280K/yr

Full-time

Medical, Dental, Vision, Life, PTO

Posted 16 days ago

Job description

K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors including Altimeter Capital, Redpoint Ventures, T. Rowe Price, Lightspeed Venture Partners, Alpine Space Ventures, and others - with an additional $500M in signed contracts across commercial and US government customers - we're mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space.
The rise of heavy-lift launch vehicles is shifting the industry from an era of mass constraint to one of mass abundance, and we believe this new era demands a fundamentally different class of spacecraft. Engineered to survive the harshest radiation environments and to fully capitalize on today's and tomorrow's massive rockets, K2 satellites deliver unmatched capability at constellation scale and across multiple orbits.
With multiple launches planned through 2026 and 2027, we're Building Bigger to develop the solar system and become a Kardashev Type II (K2) civilization. If you are a motivated individual who thrives in a fast-paced environment and you're excited about contributing to the success of a groundbreaking Series C space startup, we'd love for you to apply.
The Role
We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role owns the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp. You will operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.
Responsibilities
  • Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
  • Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
  • Establish organizational package design standards, methodologies, and best practices.
  • Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
  • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
  • Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
  • Own package-level SI/PI strategy, including high-speed digital interfaces (e.g., SerDes, JESD, Interlaken), power delivery network (PDN) design, and decoupling strategy
  • Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
  • Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
  • Drive material selection, substrate technology choices, and assembly process optimization.

Qualifications
  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
  • 10+ years of experience in ASIC package design, with deep expertise in FC-BGA.
  • Proven experience delivering high-pin-count, high-performance ASIC packages into production.
  • Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Experience working directly with OSATs and substrate vendors.
  • Knowledge of packaging qualification and test methodologies.

Nice to Have
  • Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
  • Background in high-speed digital or mixed-signal SoCs.
  • Familiarity with aerospace, space, or high-reliability electronics.
  • Experience defining packaging strategy from early architecture through first silicon and volume ramp.
  • Demonstrated history of building or scaling package design methodology within an organization.

Compensation and Benefits:
  • Base salary range for this role is $200,000 - $280,000 + equity in the company
  • Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
  • Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks

If you don't meet 100% of the preferred skills and experience, we encourage you to still apply! Building a spacecraft unlike any other requires a team unlike any other and non-traditional career twists and turns are encouraged!
If you need a reasonable accommodation as part of your application for employment or interviews with us, please let us know.
Export Compliance
As defined in the ITAR, "U.S. Persons" include U.S. citizens, lawful permanent residents (i.e., Green Card holders), and certain protected individuals (e.g., refugees/asylees, American Samoans). Please consult with a knowledgeable advisor if you are unsure whether you are a "U.S. Person."
The person hired for this role will have access to information and items controlled by U.S. export control regulations, including the export control regulations outlined in the International Traffic in Arms Regulation (ITAR). The person hired for this role must therefore either be a "U.S. person" as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license.
Equal Opportunity
K2 Space is an Equal Opportunity Employer; employment with K2 Space is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

About K2 Space

Sourced by ZipRecruiter

Industry

Guided missile and space vehicle manufacturing

Company size

11 - 50 Employees

Headquarters location

Los Angeles, CA, US

Year founded

2022

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