Process Development Manager Jobs (NOW HIRING)

Position summary

• The Packaging Development Engineer will design, develop, qualify, and optimize packaging and assembly processes for semiconductor devices and sensors (including MEMS, ICs, ASICs, discrete sensors). This role leads prototype-to-production process development, reliability qualification, supplier development, and implementation into manufacturing. The engineer will balance electrical/mechanical/thermal performance, cost, manufacturability, and reliability to support Amphenol’s product roadmaps.

Key responsibilities

• Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation
• Define manufacturing process flows, tooling, materials specifications, and control plans for prototypes and high-volume production.
• Lead Design for Reliability/Manufacturing (DfX/DfM) reviews with product design, test, and manufacturing teams.
• Create and execute DOE (design of experiments) to optimize process windows and yield; analyze results using statistical tools (e.g., Minitab/JMP).
• Author and maintain process documentation: process sheets, work instructions, SPC/CPK reports, FMEA, PPAP/APQP packages (for automotive customers).
• Partner with suppliers and contract manufacturers to qualify equipment, processes, materials (epoxies, solders, plating chemistries), and subcontractor processes; perform supplier audits as needed.
• Plan and oversee reliability and environmental qualification testing (thermal cycling, HAST, temperature humidity bias, mechanical shock, vibration, solderability, thermal shock); interpret results and drive corrective actions.
• Perform and coordinate failure analysis (SEM, X-ray/CT, C-SAM, cross-sectioning) and root-cause investigations.
• Transfer processes to internal and external manufacturing sites where needed; support production ramps and troubleshoot yield/quality issues at manufacturing locations.
• Ensure compliance with industry standards and customer requirements (JEDEC, IPC, ISO 9001/AS9100/IATF 16949 as applicable), plus RoHS/REACH and other regulatory needs.
• Mentor junior engineers and technicians; present technical status to stakeholders and customers.

Required qualifications

• BS in Materials/ Electrical/Mechanical Engineering (MS preferred), 3+ years in semiconductor or sensor packaging/process development
• 2+ years of hands-on experience in semiconductor or sensor packaging, assembly process development, or failure analysis.
• Demonstrated experience with die attach, wire bonding, flip-chip, molding/encapsulation, soldering , singulation and metallization/plating processes.
• Practical knowledge of reliability test protocols and failure-analysis techniques.
• Strong statistical analysis skills and experience with DOE; comfortable using Minitab or JMP.
• Experience preparing process documentation, FMEA, control plans, and PPAP/APQP packages (especially for automotive/aerospace customers).
• Excellent written and verbal communication skills; strong cross-functional collaboration.

Preferred experience and skills

• Familiarity with SEM, X-ray/CT, C-SAM, microsectioning, and metallographic microscopy.
• Knowledge of ESD/cleanroom practices and contamination control.
• Project management experience; PMP or Six Sigma certification a plus.
• Prior experience working with suppliers across APAC/EMEA and supporting process transfer globally.

Technical tools & equipment (examples)

• Software: Minitab/JMP, Excel, Word, Powerpoint
• Lab/process tools: wire bonders, flip-chip bonders, die bonders, reflow ovens, mold presses, plasma cleaning  tools, , pick-and-place, X-ray/CT, SEM, C-SAM, environmental chambers for thermal/humidity testing.

Success metrics (KPIs)

• Time-to-qualify new package/processes (target per product/project).
• First-pass yield and overall manufacturing yield improvements.
• Reliability pass rates vs. customer requirements.
• Number and criticality of customer field failures attributable to packaging/process development .
• Successful transfers to internal/external production sites within schedule and budget.
• Cost-per-unit improvements from design/process optimization.

Working conditions & travel

• Typical R&D/lab environment with occasional exposure to cleanroom and manufacturing floor.
• Global travel to supplier sites, contract manufacturers, and customer locations as needed — typically up to 10–25%

Diversity, safety & compliance

• Follow Amphenol’s EHS and quality policies; contribute to a culture of safety and continuous improvement.
• Support company diversity and inclusion initiatives.