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Wirebond Operator Level 2 - Swing Shift
Integra Technologies. Milpitas, CA

Wirebond Operator Level 2 - Swing Shift

Integra Technologies.
Milpitas, CA
Expired: over a month ago Applications are no longer accepted.
  • $18 to $20 Hourly
  • Full-Time
Job Description

POSITION SUMMARY (Briefly describe the purpose of the position)

Run automatic or manual bonding machines that bonds gold or aluminum wire to integrated circuit dies to connect circuitry to package leads.

KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE (List in order of importance)

  • Set up and operate all wire bond machine with aluminum and gold ball.
  • Perform wire pull and ball shear test per traveler applicable specification.
  • Perform capillary and bonding wedge change.
  • Operate a variety of equipment, including high-powered microscopes, with speed and accuracy.
  • Follow job traveler instructions with accuracy.
  • Identify and report process deviations to supervisor.
  • Meet quality goals, safety requirements, and follow company policies.
  • Flexibility to perform other duties as assigned.

JOB REQUIREMENTS INCLUDE (List as required or preferred)

Education: High school diploma or equivalent required.

Knowledge/Skills:

Level 1:

  • Understand the requirements of Electrostatic Discharge control methods and materials.
  • Track documents and jobs in real time basis in Epicor system.
  • Able to adjust microscope magnification 10x to 45x, and 50x to 200x and proper focusing on lenses.
  • Able to generate Discrepancy Report (DR) when needed
  • Understand the handling and processing of job for defense articles, every die is accounted for and must be returned to the customer
  • Responsible to ensure data recording on lot travelers is accurate
  • Understand Wire Bond Bill of Materials and applications
  • Perform wire bond basic visual and microscope inspections
  • Setup Destructive and Non-Destructive wire pull machine based on testing and certified specifications.
  • Recall Plasma Program and verify N2 gas usage
  • Understand 3rd optical criteria’s certified specifications and capillary change
  • Operate wedge bonder H & K, Ball Bonder ASM Eagle 60, Ball Bonder ASM Extreme, Ball Bonder K & S ICONN Plus

Level 2:

  • Operate Manual Ribbon bond
  • Setup and recall program Wedge Bonder K&S 1472 and Wedge Bonder H&K
  • Setup and recall program Ball Bonder ASM Eagle 60, Ball Bonder ASM Extreme and Ball Bonder K&S ICONN Plus

PHYSICAL REQUIREMENTS INCLUDE

In an average workday, employee must (check one frequency for each task):

Task

None

Occasional

Frequent

Constant

Stand

Walk

Sit

Bend/stoop

Climb

Reach above shoulders

Squat/crouch/kneel

Push/pull

Lift

Usual amount

☐ <10 lbs

☐ 11-25 lbs

☒ 26-50 lbs

☐ 51+ lbs

Carry

Usual amount

☐ <10 lbs

☐ 11-25 lbs

☒ 26-50 lbs

☐51+ lbs

Employee must use hands for repetitive action such as (please check all):

Task

Right

Hand

Left

Hand

Simple grasping

☒ Yes

☐ No

☒ Yes

☐ No

Firm grasping

☐ Yes

☒ No

☐ Yes

☒ No

Fine manipulation

☒ Yes

☐ No

☒ Yes

☐ No

WORKING CONDITIONS INCLUDE

In an average workday, employee is exposed to (check one frequency for each task):

Task

None

Occasional

Frequent

Constant

General shop conditions

General office environment

Humid, extreme hot/cold temps (non-weather)

Outdoor weather conditions

Fumes or airborne particles

Fluorescent lights

Moving, mechanical parts

Toxic chemicals

Loud noise intensity levels

Risk of electrical shock

Travel for job



Address

Integra Technologies.

Milpitas, CA
95035 USA

Industry

Manufacturing

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