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Semiconductor Packaging Engineer Jobs (NOW HIRING)

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Semiconductor Packaging Engineer Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production ...

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Semiconductor Packaging Engineer Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production ...

Cybercoders

Electronics Packaging Engineer

Belmar, NJ · On-site

$110K - $150K/yr

Electronics Packaging Engineer Location: Wall Township, NJ Job Type: Full-Time Salary: $110K ... Design and develop electronic and semiconductor packaging solutions from concept through production

Micross

Package Design Engineer | Semiconductor

Durham, NC · On-site

$128K/yr

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. * 8 to 10 years of experience in semiconductor packaging design, modeling, and ...

Micross

Package Design Engineer | Semiconductor

Apopka, FL · On-site

$119K/yr

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. * 8 to 10 years of experience in semiconductor packaging design, modeling, and ...

Mastech Digital

Packaging Engineer

Salem, NH · On-site

$130K/yr

Qualifications: - BS in Mechanical Engineering, Materials Science, or related field with 8+ years in semiconductor or photonics. - Strong knowledge of packaging techniques (die attach, wirebonding ...

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Semiconductor Packaging Engineer information

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How much do semiconductor packaging engineer jobs pay per hour?

As of Jun 12, 2026, the average hourly pay for semiconductor packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are the key skills and qualifications needed to thrive as a Semiconductor Packaging Engineer, and why are they important?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What does a Semiconductor Packaging Engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are some common challenges Semiconductor Packaging Engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.
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Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in the United States as of June 2026, with employment types broken down into 86% Full Time, 4% Part Time, 9% Contract, and 1% Nights. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.
Semiconductor Packaging Engineer

Semiconductor Packaging Engineer

Sigma Design

Redmond, WA • On-site

$115K - $145K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 25 days ago

Job description

Semiconductor Packaging Engineer

Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production services to diverse clients around the globe. Sigma Design believes in hiring, developing, and recognizing the best. We offer competitive compensation, a 401(k) with up to 4% company match, quarterly bonus program, 15-days of accrued PTO and 9 company paid holidays. In addition, Sigma Design has multiple options for medical insurance and dental insurance. We also offer voluntary benefits: vision, long-term disability, and life insurance. 
Position Details:
  • This position will be In-Office
  • $115,000 - $140,000 annually
  • This is a contract position with an expected duration of 12 months and the opportunity to be extended. 

Primary Function:
The Semiconductor Packaging Engineer is responsible for developing, executing, and optimizing semiconductor and advanced packaging assembly and integration processes. This role supports the design, fabrication, and validation of advanced electronic packaging solutions for heterogeneous, flexible, and stretchable electronic systems, while collaborating across research, hardware, and manufacturing teams to improve device performance, reliability, and scalability.
Essential Job Functions - Responsibilities:
  • Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing.
  • Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices.
  • Design and oversee internal, external, and hybrid manufacturing workflows to accelerate development, integration, and scale-up of advanced electronic packaging technologies.
  • Develop new methods and processes to close technology gaps, improve device performance, and increase manufacturing yield through process innovation and optimization.
  • Design and execute experiments (DOE), analyze experimental results, and apply findings to improve packaging processes, device performance, and yield.
  • Execute hands-on fabrication workflows using advanced packaging and assembly equipment, identify in-line process issues, and propose solutions or workarounds to improve manufacturing performance.
  • Collaborate closely with researchers, hardware engineers, system integration teams, and external manufacturing partners to support the development and production of advanced electronic packaging solutions.
  • Support the development and use of high-performance electronic materials in advanced packaging environments.
  • Contribute to instrumentation development, process characterization, mechanical or layout design, and data analysis methods used in hardware research and development environments.
  • Follow Business Technology policies to protect sensitive data and reduce information security occurrences.

Education and Experience: (Knowledge, Skills, & Abilities)
  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Materials Science, or related technical field or equivalent professional experience required
  • Minimum of 1+ years of relevant work experience in semiconductor manufacturing, advanced packaging, or related electronics manufacturing environments preferred
  • Strong background in semiconductor or advanced packaging processes, including wafer-level or panel-level manufacturing
  • Hands-on experience working with semiconductor assembly and packaging equipment
  • Experience designing and executing Design of Experiments (DOE), analyzing results, and optimizing manufacturing yield
  • Experience collaborating across research and development, hardware engineering, and manufacturing teams
  • Strong analytical, troubleshooting, and problem-solving skills with an innovation and scalability mindset
  • Experience with advanced packaging technologies such as Flexible Printed Circuits (FPC), Printed Circuit Board Assembly (PCBA), 2.5D/3D integration, or related electronic packaging technologies
  • Experience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation
  • Experience handling and integrating thinned electronic components as part of advanced packaging workflows
  • Demonstrated success developing or maturing hardware research processes including instrumentation, characterization, mechanical or layout design, and/or advanced data analysis techniques
  • Experience developing or applying high-performance electronic materials in semiconductor or advanced packaging environments
  • Experience with advanced packaging domains including Flexible Printed Circuits (FPC), Multi-Chip Modules (MCM), System-in-Package (SiP), 2.5D/3D integration, Flexible Hybrid Electronics (FHE), or similar technologies preferred
  • Experience performing reliability testing and failure analysis including die or ball shear testing, wire pull testing, X-ray inspection, C-SAM inspection, thermal cycling, and environmental testing preferred
  • Experience with wearable technologies or technical soft goods preferred
  • Experience with hermetic or MEMS packaging, thermal management materials, or injection/transfer molding processes preferred
  • Experience using Finite Element Analysis (FEA) modeling or simulation tools to accelerate design and prevent failures preferred
  • Experience in System-in-Package (SiP) or Multi-Chip Module (MCM) design, manufacturing, and validation preferred
  • Experience with signal integrity or power integrity simulation tools (e.g., HFSS) and validation preferred
  • Strong written and verbal English language communication skills
  • Excellent teamwork/interpersonal skills and the ability to communicate effectively
  • Demonstrated ability to work collaboratively, both within and outside one's own work group
  • Demonstrate commitment and adherence to Sigma Design Core Values
  • Pass a post-offer background verification

Work Environment
Standard lab/production environment. Appropriate safety garments (PPE) must be worn. Occasionally may be required to work in environmental conditions that emulate typical user environments in order to facilitate design testing and validation. Occasionally may be required to travel as required to other facilities, clients, or suppliers. Must be able to stand and work as long as 12 hours in different positions. Must be able to lift up to 50 pounds unassisted.
 

SigmaDesign is an Equal Opportunity Employer

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