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Electronics Packaging Engineer Jobs (NOW HIRING)

Moog

Design Engineer, Electronics Packaging

Buffalo, NY · On-site

$100K - $130K/yr

Design Engineer, Electronics Packaging Reporting To: Management, Design Engineering Work Schedule: Onsite - Buffalo, NY Moog's place as a global leader in the design and manufacture of precision ...

Moog

Design Engineer, Electronics Packaging

Arvada, CO

$100K - $130K/yr

Design Engineer, Electronics Packaging Reporting To: Management, Design Engineering Work Schedule: Onsite - Buffalo, NY Moog's place as a global leader in the design and manufacture of precision ...

Collabera

Packaging Engineer

Decatur, IL · On-site

... 3D electronic drafting experience Responsibilities: This position designs and develops packaging ... The packaging engineer develops the packaging plan and works with key groups to ensure material is ...

amphenol

Packaging Engineer

Allen, TX · On-site

... electronic components, cable assemblies, or mechanical products. • U.S. Citizen or permanent resident to satisfy AFSI ITAR requirements Work Environment: Fastpaced manufacturing floor with ESD ...

KLA Corporation

Packaging Engineer

Milpitas, CA

$83K - $141K/yr

Virtually every electronic device in the world is produced using our technologies. No laptop ... Qualifications * BS or MS degree in Packaging Engineering or relevant field with hands-on ...

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Electronics Packaging Engineer information

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$41K

$88.9K

$137.5K

How much do electronics packaging engineer jobs pay per year?

As of Aug 14, 2026, the average yearly pay for electronics packaging engineer in the United States is $88,896.00, according to ZipRecruiter salary data. Most workers in this role earn between $59,500.00 and $109,500.00 per year, depending on experience, location, and employer.

What does an electronics packaging engineer do?

An electronics packaging engineer designs and develops protective enclosures and interconnections for electronic components to ensure durability, thermal management, and electrical performance. They work with CAD software, materials, and manufacturing processes to optimize product reliability and manufacturability, often collaborating with design and manufacturing teams. Knowledge of industry standards and testing methods is essential in this role.

Are electronics packaging engineers in demand?

Electronics packaging engineers are in demand due to the growth of consumer electronics, telecommunications, and semiconductor industries. They require skills in materials, thermal management, and CAD tools, and often find opportunities in manufacturing and R&D environments. The field offers steady job prospects as electronic devices continue to evolve and expand.

What are the typical daily responsibilities of an electronics packaging engineer?

An Electronics Packaging Engineer typically spends their days designing mechanical enclosures for electronic components, performing thermal and structural analyses, selecting appropriate materials, and creating detailed drawings using CAD software. They collaborate closely with electrical engineers, mechanical designers, manufacturing teams, and suppliers to ensure all aspects of the design meet performance, manufacturability, and safety requirements. Regular tasks also include reviewing prototypes, addressing manufacturability issues, and supporting the transition from design to production. This multifaceted role blends hands-on technical work with frequent teamwork and problem-solving to ensure successful electronic product launches.

What is an electronics packaging engineer?

An Electronics Packaging Engineer designs and develops the physical enclosure and interconnects for electronic components, ensuring reliability, thermal management, and signal integrity. They work with materials, manufacturing processes, and industry standards to optimize product performance and durability. Their role spans from conceptual design to production, collaborating with mechanical, electrical, and manufacturing teams.

What are the key skills and qualifications needed to thrive as an electronics packaging engineer?

A successful Electronics Packaging Engineer requires a solid background in electrical engineering, thermal management, materials science, and CAD-based design, often supported by a relevant bachelor’s or master’s degree. Familiarity with industry-standard design software such as AutoCAD, SolidWorks, and simulation tools, as well as adherence to IPC and JEDEC standards, is typically expected. Attention to detail, strong problem-solving skills, and effective collaboration with multidisciplinary teams are valuable soft skills in this field. Mastery of these competencies ensures reliable product development, compliance with industry standards, and seamless integration with manufacturing processes.

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Electronics Packaging Engineer jobs near you
Infographic showing various Electronics Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 96% Full Time, 2% Contract, and 2% Nights. Highlights an 100% In-person job distribution, with an average salary of $88,896 per year, or $42.7 per hour.

Packaging Engineer ll

Rochester Electronics

Newburyport, MA • On-site

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 26 days ago

Job description

Rochester Electronics is hiring immediately for Packaging Engineers!

For the last 40 years, Rochester Electronics, in partnership with over 70 leading semiconductor manufacturers, has provided our valued customers with a continuous source of critical semiconductors. As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world's most extensive range of end-of-life (EOL) and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester can manufacture over 70,000 device types.

At Rochester Electronics, we create an excellent employee experience focused on value, performance, motivation, recognition, and career growth. Many companies say their employees are their most important asset. At Rochester Electronics, we mean it! Our benefits include but are not limited to the following:

  • Outstanding low-cost medical, dental, vision, and prescription drug coverage, Rochester pays 92% of the premiums on behalf of its full-time employees
  • Paid time off, including vacation, sick, and holiday
  • 100% Rochester-funded Profit-Sharing program
  • Two-tier Rochester match 401K program
  • Tuition reimbursement
  • Flexible spending account

And so much more!

Packaging Engineer General Summary

The Packaging Engineer II is responsible for executing semiconductor packaging projects on future and existing product formats to support the manufacturing operations to ensure customer service, profitability, and continuous improvement. This role provides package design, materials development, and sustaining support for semiconductor assemblies.

Packaging Engineer Responsibilities

  • Manage and develop materials suppliers and processes for high-reliability applications.
  • Establish material specifications and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Working knowledge in materials characterization and analysis.
  • General understanding of assembly processes, IC packaging materials, reliability standards, and FA techniques.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Actively interact with Program Managers, Engineering, Quality, OSAT and suppliers to promptly provide robust and reliable components.

Packaging Engineer Basic Qualifications

  • Master's Degree or Bachelor's Degree in Packaging Engineering (preferred), Materials Engineering, Mechanical Engineering, Industrial Engineering, Manufacturing Engineering, or a related engineering field.

 Packaging Engineer Preferred Qualifications

  • Analytical and problem-solving skills with the willingness to lead and work effectively with a team.
  • Comprehensive understanding of multiple relevant packaging technologies (FC-BGA, large BGA, SiP, leadframe, and Hermetic packages)
  • Reputation and track record for having a can-do attitude and a customer-first mindset.
  • Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
  • Ability to work independently and take on projects with minimum supervision.
  • Good engineering problem-solving skills with strong engineering physics and fundamentals.
  • Mentor junior-level employees on tool operation and best practice assembly techniques

Rochester Electronics is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability status, age, veteran status, or other characteristics protected by applicable law. Rochester Electronics is committed to a culturally diverse workforce.

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