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Microelectronics Packaging Jobs (NOW HIRING)

Northrop Grumman Corporation

OR · Hybrid

... Packaging team. The person hired in this position will have the option to work remotely ... For more than 70 years, Northrop Grumman's Microelectronics Center, part of Northrop Grumman ...

Abbott

R&D Product Development Engineer

Atlanta, GA

Strong candidates may come from electrical engineering, computer engineering, MEMS, microelectronics packaging, mechanical engineering, biomedical engineering, automation, applied physics, or related ...

Abbott

R&D Product Development Engineer

Atlanta, GA

Strong candidates may come from electrical engineering, computer engineering, MEMS, microelectronics packaging, mechanical engineering, biomedical engineering, automation, applied physics, or related ...

Intel

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$105.65K - $149.15K/yr

Experience and/or familiarity with microelectronic package or PCB physical layout design and manufacturing process. * Familiarity with package design tools like Siemens Xpedition, Cadence Allegro ...

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How much do microelectronics packaging jobs pay per hour?

As of May 29, 2026, the average hourly pay for microelectronics packaging in the United States is $18.31, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.71 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Microelectronics Packaging Engineer, and why are they important?

To thrive as a Microelectronics Packaging Engineer, you need expertise in semiconductor device physics, materials science, and electronic circuit design, typically supported by a degree in electrical, mechanical, or materials engineering. Proficiency with CAD software, thermal and stress simulation tools, and familiarity with industry standards like IPC or JEDEC is expected. Strong problem-solving abilities, attention to detail, and effective cross-functional communication are crucial soft skills. These competencies ensure reliable, high-performance electronic products and successful collaboration across design, manufacturing, and quality teams.

What are some common challenges faced in microelectronics packaging roles, and how are they typically addressed?

Professionals in microelectronics packaging often encounter challenges such as maintaining signal integrity at high frequencies, managing thermal dissipation, and ensuring reliability as components become smaller and more complex. These issues are typically addressed through close collaboration with design, materials, and manufacturing teams, adoption of advanced materials and simulation tools, and continual process improvements. Staying updated with evolving industry standards and participating in cross-disciplinary problem solving are also key strategies to successfully navigate these challenges.

What is microelectronics packaging?

Microelectronics packaging is the process of enclosing semiconductor devices, such as microchips, in a protective case that enables electrical connection to a circuit board while shielding the device from physical damage and environmental factors. The packaging not only provides mechanical support but also assists in heat dissipation and ensures reliable electrical performance. This field is crucial in the electronics industry, as advancements in packaging technology directly impact the size, speed, and reliability of electronic devices.

What is the difference between Microelectronics Packaging vs Semiconductor Process Engineer?

AspectMicroelectronics PackagingSemiconductor Process Engineer
CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications in packaging technologies are a plusRequires a degree in electrical engineering, materials science, or chemical engineering; process-specific certifications may be beneficial
Work EnvironmentManufacturing floors, cleanrooms, R&D labs focused on packaging and assemblySemiconductor fabrication plants, cleanrooms, process development labs
Industry UsageDesign, develop, and test packaging solutions for microelectronic devicesDevelop and optimize manufacturing processes for semiconductor fabrication

Microelectronics Packaging professionals focus on creating protective and functional packages for microchips, while Semiconductor Process Engineers work on the fabrication processes within semiconductor manufacturing. Both roles require technical expertise and often collaborate but serve different stages of the product lifecycle.

More about Microelectronics Packaging jobs
What cities are hiring for Microelectronics Packaging jobs? Cities with the most Microelectronics Packaging job openings:
What job categories do people searching Microelectronics Packaging jobs look for? The top searched job categories for Microelectronics Packaging jobs are:
Microelectronics Packaging jobs near you
Infographic showing various Microelectronics Packaging job openings in the United States as of May 2026, with employment types broken down into 85% Full Time, and 15% Part Time. Highlights an 100% Physical job distribution, with an average salary of $38,076 per year, or $18.3 per hour.
Senior Packaging Engineer (Microelectronics)

Senior Packaging Engineer (Microelectronics)

Kforce Technology Staffing

Tempe, AZ

Other

Medical, Dental, Vision, Life, Retirement, PTO

Posted 22 days ago

Job description

RESPONSIBILITIES:
Kforce is partnering with an innovative and rapidly growing communications technology company seeking to hire a Senior Packaging Engineer (Microelectronics) in the Tempe, AZ area (hybrid work schedule).
Summary:
This position would place you as the key Microelectronics Packaging Engineer on a talented space electronics engineering team, responsible for developing next-generation packaging solutions for advanced RF communications products supporting cutting-edge space systems.
In this role, you would lead all aspects of microelectronics packaging development, working closely with RFIC, MMIC, and module design teams to create advanced packaging solutions for devices ranging from ICs and System-in-Package (SiP) designs to complex modules and sub-assemblies.
Key areas of responsibility include:
* Developing advanced packaging architectures for RF communication products
* Defining package structures and materials to meet reliability, performance, manufacturability, and cost requirements
* Designing and developing semiconductor packages
* Driving the full package development lifecycle - package definition, stack-up, substrate layout, bond diagrams, drawings, predictive modeling, testing, and final release
* Utilizing thermal, mechanical, and electrical modeling to ensure early design success
* Leading technical engagement with external packaging vendors and manufacturing partners
* Supporting technology roadmaps and long-term packaging innovation initiatives
REQUIREMENTS:
* Bachelor's degree in Electrical Engineering or related discipline
* Eight or more years of related semiconductor packaging engineering experience
* Strong knowledge of microelectronic package structure, mechanical, electrical and thermal performance
* Expertise in Outsourced Semiconductor Assembly and Test (OSAT)
* Knowledge of complex RF designs
* Strong communication and collaboration skills
The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.
This job is not eligible for bonuses, incentives or commissions.
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
By clicking ?Apply Today? you agree to receive calls, AI-generated calls, text messages or emails from Kforce and its affiliates, and service providers. Note that if you choose to communicate with Kforce via text messaging the frequency may vary, and message and data rates may apply. Carriers are not liable for delayed or undelivered messages. You will always have the right to cease communicating via text by using key words such as STOP.

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