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Microelectronics Packaging Jobs (NOW HIRING)

BAE Systems

Eng Prin - Ind

Cedar Rapids, IA · On-site

$105.25K - $178.93K/yr

Subject Matter Expert on microelectronics packaging processes and materials for the Cedar Rapids Facility. * Responsible for technical problem definition and solution in manufacturing environment.

SpaceX

Microelectronics Technician, Starlink

Redmond, WA · On-site

$36 - $45/hr

MICROELECTRONICS TECHNICIAN, STARLINK SpaceX is developing a low latency, broadband internet system ... Base salary is just one part of your total rewards package at SpaceX. You may also be eligible for ...

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How much do microelectronics packaging jobs pay per hour?

As of May 29, 2026, the average hourly pay for microelectronics packaging in the United States is $18.31, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.71 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Microelectronics Packaging Engineer, and why are they important?

To thrive as a Microelectronics Packaging Engineer, you need expertise in semiconductor device physics, materials science, and electronic circuit design, typically supported by a degree in electrical, mechanical, or materials engineering. Proficiency with CAD software, thermal and stress simulation tools, and familiarity with industry standards like IPC or JEDEC is expected. Strong problem-solving abilities, attention to detail, and effective cross-functional communication are crucial soft skills. These competencies ensure reliable, high-performance electronic products and successful collaboration across design, manufacturing, and quality teams.

What are some common challenges faced in microelectronics packaging roles, and how are they typically addressed?

Professionals in microelectronics packaging often encounter challenges such as maintaining signal integrity at high frequencies, managing thermal dissipation, and ensuring reliability as components become smaller and more complex. These issues are typically addressed through close collaboration with design, materials, and manufacturing teams, adoption of advanced materials and simulation tools, and continual process improvements. Staying updated with evolving industry standards and participating in cross-disciplinary problem solving are also key strategies to successfully navigate these challenges.

What is microelectronics packaging?

Microelectronics packaging is the process of enclosing semiconductor devices, such as microchips, in a protective case that enables electrical connection to a circuit board while shielding the device from physical damage and environmental factors. The packaging not only provides mechanical support but also assists in heat dissipation and ensures reliable electrical performance. This field is crucial in the electronics industry, as advancements in packaging technology directly impact the size, speed, and reliability of electronic devices.

What is the difference between Microelectronics Packaging vs Semiconductor Process Engineer?

AspectMicroelectronics PackagingSemiconductor Process Engineer
CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications in packaging technologies are a plusRequires a degree in electrical engineering, materials science, or chemical engineering; process-specific certifications may be beneficial
Work EnvironmentManufacturing floors, cleanrooms, R&D labs focused on packaging and assemblySemiconductor fabrication plants, cleanrooms, process development labs
Industry UsageDesign, develop, and test packaging solutions for microelectronic devicesDevelop and optimize manufacturing processes for semiconductor fabrication

Microelectronics Packaging professionals focus on creating protective and functional packages for microchips, while Semiconductor Process Engineers work on the fabrication processes within semiconductor manufacturing. Both roles require technical expertise and often collaborate but serve different stages of the product lifecycle.

More about Microelectronics Packaging jobs
What cities are hiring for Microelectronics Packaging jobs? Cities with the most Microelectronics Packaging job openings:
What job categories do people searching Microelectronics Packaging jobs look for? The top searched job categories for Microelectronics Packaging jobs are:
Microelectronics Packaging jobs near you
Infographic showing various Microelectronics Packaging job openings in the United States as of May 2026, with employment types broken down into 85% Full Time, and 15% Part Time. Highlights an 100% Physical job distribution, with an average salary of $38,076 per year, or $18.3 per hour.
Microelectronics Advanced Packaging Engineer

Microelectronics Advanced Packaging Engineer

Booz Allen Hamilton

Beavercreek, OH

$61.90K - $141K/yr

Other

Medical, Life, Retirement, PTO

Posted 4 hours ago

Booz Allen Hamilton rating

8.8

Company rating: 8.8 out of 10

Based on 47 frontline employees who took The Breakroom Quiz

8th of 57 rated business consultants

Job description

Job Number: R0239001
Microelectronics Advanced Packaging Engineer
The Opportunity:
Applies engineering physics, engineering mathematics and materials science principles to support the design, analysis, manufacture or maintenance of mechanical systems. Applies specific functional knowledge and working and general industry knowledge . Develop s or contributes to solutions to a variety of problems of moderate scope and complexity. Works independently with some guidance, and reviews or guides activities of junior employees.
You Have:
  • 2+ years of experience in dynamic manufacturing and R & D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
  • Experience in eCAD and mCAD sof tware
  • Experience with packaging, PCB fabrication, clea nro om processing, or SMT assembly
  • Experience develop ing packaging solutions that optimize Size Weight and Power ( SWaP ) and prototyping designs in a high-mix, low-volume R & D Environment
  • Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
  • Experience with the complete packaging assembly processes from concept to prototype including equipment and material selection for panel-level, wafer-level, and chip-level systems
  • Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
  • Ability to obtain a Secret clearance
  • Bachelor's degree in an engineering field

Nice If You Have:
  • 5+ years of experience with advanced packaging technology innovation and prototyping
  • Experience collaborating with RF, digital, photonics, and analog designers to tailor packaging designs to application needs
  • Knowledge of trends related to current technology, including trends related to future technologies, design, or prototyping for DoD systems
  • Secret clearance
  • Master's degree in an engineering field

Clearance:
Applicants selected will be subject to a security investigation and may need to meet eligibility requirements for access to classified information .
Compensation
At Booz Allen, we celebrate your contributions, provide you with opportunities and choices, and support your total well-being. Our offerings include health, life, disability, financial, and retirement benefits, as well as paid leave, professional development, tuition assistance, work-life programs, and dependent care. Our recognition awards program acknowledges employees for exceptional performance and superior demonstration of our values. Full-time and part-time employees working at least 20 hours a week on a regular basis are eligible to participate in Booz Allen's benefit programs. Individuals that do not meet the threshold are only eligible for select offerings, not inclusive of health benefits. We encourage you to learn more about our total benefits by visiting the Resource page on our Careers site and reviewing Our Employee Benefits page.
Salary at Booz Allen is determined by various factors, including but not limited to location, the individual's particular combination of education, knowledge, skills, competencies, and experience, as well as contract-specific affordability and organizational requirements. The projected compensation range for this position is $61,900.00 to $141,000.00 (annualized USD). The estimate displayed represents the typical salary range for this position and is just one component of Booz Allen's total compensation package for employees. This posting will close within 90 days from the Posting Date.
Identity Statement
As part of the hiring process, we will ask you to complete an identity verification process that leverages advanced biometrics and artificial intelligence to ensure authenticity and protect against identity fraud. You are expected to be on camera during interviews and assessments. We reserve the right to take your picture to verify your identity and prevent fraud.
Candidate AI Usage Policy
AI is a part of our daily work at Booz Allen, and we are committed to the responsible and ethical use of AI tools. However, we want to ensure a fair candidate process based on your own skills and knowledge. As part of this commitment, the use of artificial intelligence (AI) or other tools to assist with responses during interviews (whether in-person or virtual) is prohibited unless permission is explicitly provided.
Work Model
Our people-first culture prioritizes the benefits of collaboration, whether it occurs in person or virtually. To support engagement and effective communication, employees working virtually are generally expected to have their cameras on during meetings.
  • Remote: If this position is listed as remote, there may still be occasions when you are required to work in person at a Booz Allen or customer facility.
  • Hybrid: If this position is listed as hybrid, you will be expected to work from a Booz Allen facility frequently, in alignment with leadership expectations and the needs of the role. You may also be required to work from or visit a customer facility.
  • Onsite: If this position is listed as onsite, work will primarily be performed at a Booz Allen office or customer facility, where employees will collaborate directly with colleagues and customers as required by the role.

Commitment to Non-Discrimination
All qualified applicants will receive consideration for employment without regard to disability, status as a protected veteran or any other status protected by applicable federal, state, local, or international law.

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About Booz Allen Hamilton

Sourced by ZipRecruiter

Booz Allen Hamilton is a leading provider of management and technology consulting services to the US government in defense, intelligence, and civil markets. Headquartered in McLean, Virginia, the firm also serves major corporations, institutions, and not-for-profit organizations. Founded in 1914 by Edwin G. Booz, the company has a long-standing tradition of helping clients achieve success by delivering a wide range of consulting services that include strategic planning, human capital and learning, communication, systems development, and others. The company's mission is to empower people to change the world, and it has a reputation for maintaining the highest standards of integrity and-excellence.

Industry

It services

Company size

10,000+ Employees

Headquarters location

McLean, VA, US

Year founded

1914

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