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Microelectronics Packaging Jobs (NOW HIRING)

SpaceX

Microelectronics Technician, Starlink

Redmond, WA · On-site

$36 - $45/hr

MICROELECTRONICS TECHNICIAN, STARLINK SpaceX is developing a low latency, broadband internet system ... Base salary is just one part of your total rewards package at SpaceX. You may also be eligible for ...

Donaldson Company, Inc.

Market Manager, Microelectronics

$112.50K - $147.60K/yr

As the Market Manager, Microelectronics within our Process Filtration Product & Technology group ... Employee benefits are part of the competitive total rewards package that Donaldson Company, Inc ...

Mercury Systems

Manufacturing Engineering Manager

Oxnard, CA · Hybrid

$116.50K - $144.60K/yr

Typically requires 7+ years of experience in microelectronics packaging, hybrid microcircuit assembly, semiconductor packaging, RF module manufacturing, or a closely related manufacturing environment.

mercury

Manufacturing Engineering Manager

Oxnard, CA · Hybrid

$116.50K - $144.60K/yr

Typically requires 7+ years of experience in microelectronics packaging, hybrid microcircuit assembly, semiconductor packaging, RF module manufacturing, or a closely related manufacturing environment.

Medtronic

Process Engineer II

Tempe, AZ · On-site

Experience in microelectronics packaging processes including pick and place, solder print, under fill, reflow, clean, singulation processes, automated inspections, etc. * Experience in developing a ...

Medtronic

Process Engineer II

Tempe, AZ · On-site

Experience in microelectronics packaging processes including pick and place, solder print, under fill, reflow, clean, singulation processes, automated inspections, etc. * Experience in developing a ...

Medtronic

Process Engineer II

Tempe, AZ · On-site

Experience in microelectronics packaging processes including pick and place, solder print, under fill, reflow, clean, singulation processes, automated inspections, etc. * Experience in developing a ...

Radiance Technologies

Senior FPGA Engineer

Ruston, LA

$84K - $113K/yr

... microelectronics packaging to system-level security for weapons systems. ATDO is looking for an FPGA Engineer with the breadth and versatility to work at all design and development stages, from ...

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Microelectronics Packaging information

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$12

$18

$23

How much do microelectronics packaging jobs pay per hour?

As of May 29, 2026, the average hourly pay for microelectronics packaging in the United States is $18.31, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.71 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Microelectronics Packaging Engineer, and why are they important?

To thrive as a Microelectronics Packaging Engineer, you need expertise in semiconductor device physics, materials science, and electronic circuit design, typically supported by a degree in electrical, mechanical, or materials engineering. Proficiency with CAD software, thermal and stress simulation tools, and familiarity with industry standards like IPC or JEDEC is expected. Strong problem-solving abilities, attention to detail, and effective cross-functional communication are crucial soft skills. These competencies ensure reliable, high-performance electronic products and successful collaboration across design, manufacturing, and quality teams.

What are some common challenges faced in microelectronics packaging roles, and how are they typically addressed?

Professionals in microelectronics packaging often encounter challenges such as maintaining signal integrity at high frequencies, managing thermal dissipation, and ensuring reliability as components become smaller and more complex. These issues are typically addressed through close collaboration with design, materials, and manufacturing teams, adoption of advanced materials and simulation tools, and continual process improvements. Staying updated with evolving industry standards and participating in cross-disciplinary problem solving are also key strategies to successfully navigate these challenges.

What is microelectronics packaging?

Microelectronics packaging is the process of enclosing semiconductor devices, such as microchips, in a protective case that enables electrical connection to a circuit board while shielding the device from physical damage and environmental factors. The packaging not only provides mechanical support but also assists in heat dissipation and ensures reliable electrical performance. This field is crucial in the electronics industry, as advancements in packaging technology directly impact the size, speed, and reliability of electronic devices.

What is the difference between Microelectronics Packaging vs Semiconductor Process Engineer?

AspectMicroelectronics PackagingSemiconductor Process Engineer
CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications in packaging technologies are a plusRequires a degree in electrical engineering, materials science, or chemical engineering; process-specific certifications may be beneficial
Work EnvironmentManufacturing floors, cleanrooms, R&D labs focused on packaging and assemblySemiconductor fabrication plants, cleanrooms, process development labs
Industry UsageDesign, develop, and test packaging solutions for microelectronic devicesDevelop and optimize manufacturing processes for semiconductor fabrication

Microelectronics Packaging professionals focus on creating protective and functional packages for microchips, while Semiconductor Process Engineers work on the fabrication processes within semiconductor manufacturing. Both roles require technical expertise and often collaborate but serve different stages of the product lifecycle.

More about Microelectronics Packaging jobs
What cities are hiring for Microelectronics Packaging jobs? Cities with the most Microelectronics Packaging job openings:
What job categories do people searching Microelectronics Packaging jobs look for? The top searched job categories for Microelectronics Packaging jobs are:
Microelectronics Packaging jobs near you
Infographic showing various Microelectronics Packaging job openings in the United States as of May 2026, with employment types broken down into 85% Full Time, and 15% Part Time. Highlights an 100% Physical job distribution, with an average salary of $38,076 per year, or $18.3 per hour.
Failure Analysis Engineer, Microelectronics (Starlink)

Failure Analysis Engineer, Microelectronics (Starlink)

SpaceX

Bastrop, TX

Other

Posted 19 days ago

SpaceX rating

8.7

Company rating: 8.7 out of 10

Based on 142 frontline employees who took The Breakroom Quiz

12th of 59 rated aerospace companies

Job description

FAILURE ANALYSIS ENGINEER, MICROELECTRONICS (STARLINK)

Starlink is SpaceX's ambitious goal to bring high-quality internet to the globe by building a constellation of thousands of satellites in low Earth orbit (LEO) using our Falcon 9 and Starship reusable rockets. We are developing millions of devices for end users to link our customers to our satellites.

As a Failure Analysis Engineer on the Starlink team, you will perform detailed root cause failure analysis on microelectronic components and packaging to support high-volume manufacturing, qualification, and field returns. You will leverage advanced laboratory tools and physics-of-failure techniques to identify failure mechanisms and drive corrective actions that improve the reliability of our satellite constellation and user terminals.

RESPONSIBILITIES:

  • Own end-to-end root cause failure analysis investigations on microelectronics failing in manufacturing, test, and field, from initial failure characterization through final corrective action verification
  • Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF characterization, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, nanoprobing, and related techniques to precisely localize defects in complex devices
  • Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related techniques to identify failure mechanisms in silicon, packaging, and interconnects
  • Apply physics-of-failure principles and deep knowledge of semiconductor failure modes (electromigration, thermal fatigue, delamination, EOS/ESD, solder joint fatigue, etc.) to determine root causes
  • Drive corrective actions by working directly with silicon design, packaging, and manufacturing teams to implement and validate design or process changes based on FA findings
  • Author detailed technical reports documenting failure modes, root cause conclusions, supporting data, and corrective action effectiveness
  • Develop and improve failure analysis techniques and workflows to support new packaging technologies and advanced materials

BASIC QUALIFICATIONS:

  • Bachelor's degree in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline 
  • 2+ years of hands-on experience in microelectronics failure analysis or materials characterization (internship experience is applicable)

PREFERRED SKILLS AND EXPERIENCE:

  • Master's or PhD in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline with a focus on microelectronics or failure analysis
  • Direct experience with failure analysis tools and techniques (SEM, FIB, EDS, cross-sectioning, fault isolation, or equivalent)
  • Strong understanding of semiconductor physics and common microelectronics failure mechanisms (electromigration, thermal fatigue, delamination, solder joint fatigue, electrical overstress/ESD, etc.)
  • Proficiency with advanced FA tools including SEM, FIB, SAM, and EDS
  • Hands-on experience in electrical characterization and fault isolation techniques such as IV curves, RF/VNA measurement, LIT, OBIRCH, EBIRCH, EBAC, nanoprobing, photon emission, or voltage contrast
  • Experience applying JEDEC and AEC reliability test standards and physics-of-failure methodologies to root cause investigations
  • Experience analyzing complex datasets with Python, JMP, or similar tools
  • Excellent problem-solving, communication, and technical writing skills

ADDITIONAL REQUIREMENTS:

  • Ability to work overtime and weekends as needed
  • Ability to work in a cleanroom or ESD-controlled environment when required

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