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Microelectronics Packaging Jobs (NOW HIRING)

SpaceX

Microelectronics Technician, Starlink

Redmond, WA

$36 - $45/hr

MICROELECTRONICS TECHNICIAN, STARLINK SpaceX is developing a low latency, broadband internet system ... Base salary is just one part of your total rewards package at SpaceX. You may also be eligible for ...

Anduril Industries

Wire bonding Technician

Lexington, MA · On-site

$41.35 - $54.81/hr

Experience with microelectronics packaging such as wirebonders and custom imprints * Experience with electrical cabling assemblies, soldering, crimping and debug * Proficiency with SolidWorks and ...

Claros

Electromechanical Packaging Engineer

Torrance, CA · On-site +1

$150K - $200K/yr

Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred. * 5+ years' experience with microelectronics packaging, and/or PCB design * Knowledge of foundry processes and ...

Claros

Electromechanical Packaging Engineer

Torrance, CA · On-site

$150K - $200K/yr

Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred. * 5+ years' experience with microelectronics packaging, and/or PCB design * Knowledge of foundry processes and ...

Aquatech International LLC

Aquatech has an immediate need for a full-time Microelectronics Project Manager to support global semiconductor, advanced packaging, solar manufacturing, and data center projects. This role is ...

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Microelectronics Packaging information

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How much do microelectronics packaging jobs pay per hour?

As of Jul 12, 2026, the average hourly pay for microelectronics packaging in the United States is $18.31, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.71 per hour, depending on experience, location, and employer.

What is the difference between Microelectronics Packaging vs Semiconductor Process Engineer?

AspectMicroelectronics PackagingSemiconductor Process Engineer
CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications in packaging technologies are a plusRequires a degree in electrical engineering, materials science, or chemical engineering; process-specific certifications may be beneficial
Work EnvironmentManufacturing floors, cleanrooms, R&D labs focused on packaging and assemblySemiconductor fabrication plants, cleanrooms, process development labs
Industry UsageDesign, develop, and test packaging solutions for microelectronic devicesDevelop and optimize manufacturing processes for semiconductor fabrication

Microelectronics Packaging professionals focus on creating protective and functional packages for microchips, while Semiconductor Process Engineers work on the fabrication processes within semiconductor manufacturing. Both roles require technical expertise and often collaborate but serve different stages of the product lifecycle.

What is microelectronics packaging?

Microelectronics packaging is the process of enclosing semiconductor devices, such as microchips, in a protective case that enables electrical connection to a circuit board while shielding the device from physical damage and environmental factors. The packaging not only provides mechanical support but also assists in heat dissipation and ensures reliable electrical performance. This field is crucial in the electronics industry, as advancements in packaging technology directly impact the size, speed, and reliability of electronic devices.

What are the key skills and qualifications needed to thrive as a Microelectronics Packaging Engineer, and why are they important?

To thrive as a Microelectronics Packaging Engineer, you need expertise in semiconductor device physics, materials science, and electronic circuit design, typically supported by a degree in electrical, mechanical, or materials engineering. Proficiency with CAD software, thermal and stress simulation tools, and familiarity with industry standards like IPC or JEDEC is expected. Strong problem-solving abilities, attention to detail, and effective cross-functional communication are crucial soft skills. These competencies ensure reliable, high-performance electronic products and successful collaboration across design, manufacturing, and quality teams.

What are some common challenges faced in microelectronics packaging roles, and how are they typically addressed?

Professionals in microelectronics packaging often encounter challenges such as maintaining signal integrity at high frequencies, managing thermal dissipation, and ensuring reliability as components become smaller and more complex. These issues are typically addressed through close collaboration with design, materials, and manufacturing teams, adoption of advanced materials and simulation tools, and continual process improvements. Staying updated with evolving industry standards and participating in cross-disciplinary problem solving are also key strategies to successfully navigate these challenges.
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What cities are hiring for Microelectronics Packaging jobs? Cities with the most Microelectronics Packaging job openings:
What job categories do people searching Microelectronics Packaging jobs look for? The top searched job categories for Microelectronics Packaging jobs are:
Microelectronics Packaging jobs near you
Embedded Software/Firmware Engineer

Embedded Software/Firmware Engineer

Radiance Technologies

Huntsville, AL • On-site

$101K - $138K/yr

Full-time

Re-posted 29 days ago

Job description

Radiance Technologies, a rapidly growing employee-owned company, is searching for talented scientists and engineers with interest in custom electronics development, microelectronics, and systems security development to join our Microelectronics Technology Operation (MTO). We are looking for individuals capable of out-of-the-box thinking, with an innovative mindset and the ability to work as part of multi-disciplinary engineering teams. MTO is involved in the development and analysis of protective technology capabilities and products, advancing the state-of-the-art for the Department of War in areas ranging from secure microelectronics packaging to board-level electronics development to system-level security for weapons systems.
MTO is looking for an Embedded Software/Firmware Engineer with the breadth and versatility to work across all design and development stages, from ideation to formal production acceptance testing for electronics subsystems utilizing embedded commercial processors, SoCs, GPUs, FPGAs and ASICs.
The ideal candidate will be adept at both embedded software and Hardware Description Languages (HDL) development. The ideal candidate will have experience collaborating with hardware design engineer(s) to turn up custom embedded hardware prototype designs, and maturing said prototypes into deployable solutions.
Must work well as part of small, fast-paced and mission-driven team(s). Multiple levels of seniority will be considered based on candidate qualifications.
Requirements:
  • B.S. or higher in Electrical Engineering, Computer Engineering, or relevant technical field with 8+ years direct experience developing embedded systems
  • Ability to obtain and maintain a DoD security clearance
  • Embedded Debugging / Emulation
  • Experience developing for real-time OS, embedded Linux, and / or bare metal
  • Ability to read schematics
  • Advanced or Expert level C programmer
  • FGPA: VHDL and / or Verilog

Desirable Qualifications / Skills (some or all would be viewed positively):
  • Advanced degrees in Electrical Engineering, Computer Engineering, or relevant technical field with 20+ years of relevant work experience
  • Active Top Secret clearance
  • Demonstrated expertise as technical lead / architect for embedded projects - conceptualizing solutions to open-ended problems, deriving implementable requirements, and conveying design intent to a broader team.
  • Experience with system security architectures, cryptography implementation, roots of security, and / or secure boot
  • Entrepreneurial mindset - propose new ideas, processes, tools and solutions
  • Excel at verbal and written communication with customers and team members by providing reports, technical documentation, and guidance
  • Design, simulate, synthesize, and test IP for ASIC and FPGA projects
  • Authoring of software development plans
  • Proficiency and willingness to mentor junior technical personnel

Work Location:
  • In person, Huntsville, AL
  • Occasional travel as needed

Security Clearance:
Applicants selected may be subject to a government security investigation and must meet eligibility requirements for access to classified information.
Radiance Technologies is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or protected veteran status.

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