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Electronics Packaging Engineer Jobs in Seattle, WA

Leidos

Electronics Engineer

Des Moines, WA · On-site

$87K - $157K/yr

Provide engineering system design packages for installation including communications equipment ... Electrical and/or Electronic Engineering degree and 4+ years of prior relevant experience OR Master ...

Leidos

Electronics Engineer

Des Moines, WA · On-site

$87K - $157K/yr

Provide engineering system design packages for installation including communications equipment ... Electrical and/or Electronic Engineering degree and 4+ years of prior relevant experience OR Master ...

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All JobsElectronics Packaging Engineer JobsElectronics Packaging Engineer Jobs in Seattle, WA

Electronics Packaging Engineer information

See Seattle, WA salary details

$46.7K

$101.2K

$156.5K

How much do electronics packaging engineer jobs pay per year?

As of Aug 4, 2026, the average yearly pay for electronics packaging engineer in Seattle, WA is $101,166.00, according to ZipRecruiter salary data. Most workers in this role earn between $67,700.00 and $124,600.00 per year, depending on experience, location, and employer.

What does an electronics packaging engineer do?

An electronics packaging engineer designs and develops protective enclosures and interconnections for electronic components to ensure durability, thermal management, and electrical performance. They work with CAD software, materials, and manufacturing processes to optimize product reliability and manufacturability, often collaborating with design and manufacturing teams. Knowledge of industry standards and testing methods is essential in this role.

Are electronics packaging engineers in demand?

Electronics packaging engineers are in demand due to the growth of consumer electronics, telecommunications, and semiconductor industries. They require skills in materials, thermal management, and CAD tools, and often find opportunities in manufacturing and R&D environments. The field offers steady job prospects as electronic devices continue to evolve and expand.

What are the typical daily responsibilities of an electronics packaging engineer?

An Electronics Packaging Engineer typically spends their days designing mechanical enclosures for electronic components, performing thermal and structural analyses, selecting appropriate materials, and creating detailed drawings using CAD software. They collaborate closely with electrical engineers, mechanical designers, manufacturing teams, and suppliers to ensure all aspects of the design meet performance, manufacturability, and safety requirements. Regular tasks also include reviewing prototypes, addressing manufacturability issues, and supporting the transition from design to production. This multifaceted role blends hands-on technical work with frequent teamwork and problem-solving to ensure successful electronic product launches.

What is an electronics packaging engineer?

An Electronics Packaging Engineer designs and develops the physical enclosure and interconnects for electronic components, ensuring reliability, thermal management, and signal integrity. They work with materials, manufacturing processes, and industry standards to optimize product performance and durability. Their role spans from conceptual design to production, collaborating with mechanical, electrical, and manufacturing teams.

What are the key skills and qualifications needed to thrive as an electronics packaging engineer?

A successful Electronics Packaging Engineer requires a solid background in electrical engineering, thermal management, materials science, and CAD-based design, often supported by a relevant bachelor’s or master’s degree. Familiarity with industry-standard design software such as AutoCAD, SolidWorks, and simulation tools, as well as adherence to IPC and JEDEC standards, is typically expected. Attention to detail, strong problem-solving skills, and effective collaboration with multidisciplinary teams are valuable soft skills in this field. Mastery of these competencies ensures reliable product development, compliance with industry standards, and seamless integration with manufacturing processes.

What are popular job titles related to Electronics Packaging Engineer jobs in Seattle, WA? For Electronics Packaging Engineer jobs in Seattle, WA, the most frequently searched job titles are:
What job categories do people searching Electronics Packaging Engineer jobs in Seattle, WA look for? The top searched job categories for Electronics Packaging Engineer jobs in Seattle, WA are:
Electronics Packaging Engineer jobs near you
Infographic showing various Electronics Packaging Engineer job openings in Seattle, WA as of July 2026, with employment types broken down into 85% Full Time, 5% Part Time, and 10% Contract. Highlights an 100% In-person job distribution, with an average salary of $101,166 per year, or $48.6 per hour.

Principal Power Electronics Packaging Engineer

Helion Energy

Everett, WA • On-site

$202K - $240K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Re-posted 25 days ago

Job description

About Helion
We are a fusion power company based in Everett, WA, with the mission to build the world's first fusion power plant, enabling a future with unlimited clean electricity. Our vision is a world with clean, reliable, and affordable energy for everyone.
Since Helion's founding in 2013, we have raised $1.5 billion from long-time investors such as Sam Altman, Mithril, and Capricorn Investment Group as well as new investors including Thrive Capital, LightSpeed Venture Capital, SoftBank, and others to propel us forward. Our current prototype, Polaris, has reached record-breaking plasma temperatures of 150 million degrees Celsius (13 keV). Helion is continuing to iterate and on the path to the world's first fusion power plant, Orion.
This is a pivotal time to join Helion. You will tackle real-world challenges with a team that prizes urgency, rigor, ownership, and a commitment to delivering hard truths - values essential to achieving what no one has before. Together, we will change the future of energy, because the world can't wait.
What You Will Be Doing:
The switching systems in a commercial fusion generator will need to handle extreme pulsed currents in mass-manufacturable package. We are looking for someone to design what the next generation of packaging looks like, working ahead of where technology currently is and defining what it needs to become.
You Will
  • Lead development of next-generation thermal management and packaging architectures for high-current switching components
  • Work across packaging geometry, materials selection, and cooling system design to push the performance ceiling of pulsed power switch assemblies
  • Collaborate with internal teams and industry partners to accelerate development of packaging solutions
  • Build test setups to validate thermal and electrical performance under realistic pulsed conditions and use that data to drive iteration

Required Skills
  • Hands-on experience with power electronics packaging for high-current or high-voltage applications
  • Strong thermal engineering fundamentals; comfortable with modeling and bench validation
  • Experience with SCRs, diodes, or similar power semiconductors in demanding environments
  • Proven experience translating research into tangible hardware and products

Benefits
Our total compensation package includes benefits, including but not limited to:
  • Medical, Dental, and Vision plans for employees and their families
  • 31 Days of PTO (21 vacation days and 10 sick days)
  • 10 Paid holidays, plus company-wide winter break
  • Up to 5% employer 401(k) match
  • Short term disability, long term disability, and life insurance
  • Paid parental leave and support (up to 16 weeks)
  • Annual wellness stipend

Helion is an equal opportunity employer and value diversity at our company. We do not discriminate based on race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. If you need assistance or an accommodation during the interview process, please let us know.

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