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Electronics Packaging Engineer Jobs in Arizona (NOW HIRING)

Viasat, Inc.

Mechanical Design Engineer

Tempe, AZ

$149K - $224K/yr

What you'll do Viasat is seeking a dynamic Mechanical Build Engineer to become part of our growing ... Cryptographic electronics packaging experience using SolidWorks. * Thermal Analysis experience for ...

Managed Staffing

Senior Mechanical Engineer

Oro Valley, AZ · On-site

$45 - $50/hr

Senior Mechanical Engineer (Engineer III) Location: Oro Valley, AZ Contract Duration: 3 months to 1 ... Lead mechanical design and analysis for electronic packaging of aerospace hardware * Create and ...

Butler America

Operations Support Engineer

Phoenix, AZ · On-site

$43 - $50/hr

Operations Support Engineer Location: Phoenix, AZ Job ID: #72217 Duration: 12 months contract Pay ... Electronics Packaging equipment, facilities, systems, products and networks for commercial ...

Raytheon

Senior Mechanical Engineer, Design

Tucson, AZ

$85K - $117K/yr

Our core mechanical engineering responsibilities include requirements/conceptual development ... Proven expertise in airframe development, electronics packaging, and mechanisms tailored for ...

Raytheon

Senior Mechanical Engineer, Design

Tucson, AZ

$85K - $117K/yr

Our core mechanical engineering responsibilities include requirements/conceptual development ... Proven expertise in airframe development, electronics packaging, and mechanisms tailored for ...

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All JobsElectronics Packaging Engineer JobsElectronics Packaging Engineer Jobs in Arizona

Electronics Packaging Engineer information

See Arizona salary details

$38.2K

$82.8K

$128.1K

How much do electronics packaging engineer jobs pay per year?

As of Jun 28, 2026, the average yearly pay for electronics packaging engineer in Arizona is $82,841.00, according to ZipRecruiter salary data. Most workers in this role earn between $55,400.00 and $102,000.00 per year, depending on experience, location, and employer.

Can I make 200K as an electrical engineer?

Electronics Packaging Engineers and electrical engineers can reach a $200,000 salary level with extensive experience, advanced skills, and working in high-paying industries or senior roles. Salaries vary based on location, certifications, and company size, with some senior or specialized positions exceeding this amount. Continuous skill development and industry demand influence earning potential.

What engineers make $500,000?

Senior engineers in specialized fields such as petroleum, aerospace, or software engineering can earn $500,000 or more annually, often through a combination of base salary, bonuses, and stock options. Achieving this level typically requires extensive experience, advanced skills, and sometimes leadership roles or executive responsibilities.

What engineers make $300,000 a year?

Senior engineers in specialized fields such as petroleum, aerospace, or software engineering can earn $300,000 or more annually, especially with extensive experience, advanced skills, and leadership roles. High-level positions often require advanced degrees, certifications, and a strong track record of project management and technical expertise.

What are the typical daily responsibilities of an Electronics Packaging Engineer?

An Electronics Packaging Engineer typically spends their days designing mechanical enclosures for electronic components, performing thermal and structural analyses, selecting appropriate materials, and creating detailed drawings using CAD software. They collaborate closely with electrical engineers, mechanical designers, manufacturing teams, and suppliers to ensure all aspects of the design meet performance, manufacturability, and safety requirements. Regular tasks also include reviewing prototypes, addressing manufacturability issues, and supporting the transition from design to production. This multifaceted role blends hands-on technical work with frequent teamwork and problem-solving to ensure successful electronic product launches.

What does an electronic packaging engineer do?

An electronic packaging engineer designs and develops protective enclosures and interconnections for electronic components to ensure reliability, thermal management, and electrical performance. They work with materials, CAD tools, and testing procedures to optimize device durability and manufacturability in electronic systems.

What is an Electronics Packaging Engineer job?

An Electronics Packaging Engineer designs and develops the physical enclosure and interconnects for electronic components, ensuring reliability, thermal management, and signal integrity. They work with materials, manufacturing processes, and industry standards to optimize product performance and durability. Their role spans from conceptual design to production, collaborating with mechanical, electrical, and manufacturing teams.

What are the key skills and qualifications needed to thrive in the Electronics Packaging Engineer position, and why are they important?

A successful Electronics Packaging Engineer requires a solid background in electrical engineering, thermal management, materials science, and CAD-based design, often supported by a relevant bachelor’s or master’s degree. Familiarity with industry-standard design software such as AutoCAD, SolidWorks, and simulation tools, as well as adherence to IPC and JEDEC standards, is typically expected. Attention to detail, strong problem-solving skills, and effective collaboration with multidisciplinary teams are valuable soft skills in this field. Mastery of these competencies ensures reliable product development, compliance with industry standards, and seamless integration with manufacturing processes.

What are popular job titles related to Electronics Packaging Engineer jobs in Arizona? For Electronics Packaging Engineer jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Electronics Packaging Engineer jobs in Arizona look for? The top searched job categories for Electronics Packaging Engineer jobs in Arizona are:
What cities in Arizona are hiring for Electronics Packaging Engineer jobs? Cities in Arizona with the most Electronics Packaging Engineer job openings:
Electronics Packaging Engineer jobs near you
Infographic showing various Electronics Packaging Engineer job openings in Arizona as of June 2026, with employment types broken down into 91% Full Time, 6% Part Time, 1% Temporary, 1% Contract, and 1% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $82,841 per year, or $39.8 per hour.
RF/Microelectronics Packaging Engineer

RF/Microelectronics Packaging Engineer

Viasat, Inc.

Tempe, AZ • On-site

Full-time

Posted 16 days ago

Viasat rating

4.2

Company rating: 4.2 out of 10

Based on 7 frontline employees who took The Breakroom Quiz

78th of 79 rated telecommunications companies

Job description

About us
One team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We're looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.
What you'll do
The Packaging Engineer position requires handling all aspects of packaging development. This means planning, crafting, and developing advanced or novel packaging. The role also involves managing packaging efforts related to radio frequency communication devices. The products range from IC's, System In Packages, sub-assemblies, and modules. The packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, predictive modeling combined with system testing, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, collaborating with sub-contractors and internal assembly and reliability resources, and final release of product.
The day-to-day
Job responsibilities include but not limited to:
  • Working closely with project development teams and product groups (RFIC, MMIC, Module) to develop the next generation/sophisticated/novel packaging solution for RF communication products
  • Define packages and materials that meet product requirements for reliability, performance, manufacturability, and cost.
  • Ensure all packaging work is completed for New Product and New Technology Introductions
    • Develop and manage packaging documentation including SOWs, package drawings, and process flow
    • Build and layout of semiconductor packages including QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP and Interposers
  • Ensure early success in package development with modeling and simulation for thermal, mechanical, and electrical
  • Technically oversee vendors in the manufacture of said packages in conjunction with manufacturing engineers
  • apply your assembly knowledge of die attach, Wirebond, bumping, overmolding to advise product groups on options available to solve problems
  • identify suitable IC, sub-assembly, and module package options and perform feasibility studies for new products
  • interact with product groups for package/cost optimization along with mechanical engineering
  • specify and conduct reliability testing by vendors to insure the reliability of the packaged product
  • Coordinate package related activities across multiple organizations including Marketing, Design, Applications, Test, Assembly Engineering, Quality, and Manufacturing (internal and external factories)
  • Address and solve materials and processing issues that may occur during the development process
  • Manage the package process using industry standard project management tools.
  • Develop and maintain the packaging and technology roadmap through proposal support and long term technology programs

What you'll need
  • 10+ years in semiconductor packaging including experience in package assembly process, package engineering, quality & reliability and the intersection/relationship of packaging to test.
  • Bachelor's Degree in Electrical, Mechanical, Materials Engineering or related technical discipline
  • Deep understanding of micro-electronic package structure, mechanical, electrical and thermal performance.
  • Solid grasp of heat transfer and its relation to material properties
  • Packaging knowledge in RFIC, millimeterware, System In Package, sub-assembly, and/or modules.
  • Experience in semiconductor package design with demonstrated experience in one or more of the following: QFN, SiP, BGA, WL-CSP, Flip Chip and Bumping or FO-WLP
  • Strong understanding of Die Prep, Assembly (die attach, Wirebond, flip chip, etc) and Surface Mount Technology (SMT) process-equipment is desired.
  • Have a high tolerance for ambiguity and solid interpersonal skills
  • In-depth knowledge of interconnect reliability daisy chain testing, CPI and BLR.
  • Understands the metallization schemes for laminates, interposers and SMT.
  • Knowledge of statistical methods and Building of Experiments
  • Must be able to work autonomously and help determine methods and procedures.
  • Customer service oriented.
  • Ability to work with build teams to translate IC/system requirements input packaging configurations
  • Ability to manage and drive packaging
  • US Government position. US Citizenship required
  • Ability to travel up to 10%
    This is an onsite role based in Tempe, AZ

What will help you on the job
  • Strong Preference for RF, Microwave or mmWave experience
  • Experience with package build software like Cadence APD/SiP
  • Experience with electronic compose and layout tools such as Cadence Concept HDL, Mentor Graphics DxDesigner, or Zuken
  • Prior volume OSAT experience is highly desired
  • Experience in ITAR and Mil programs
  • SolidWorks tool usage
  • Knowledge or exposure of wafer to wafer bonding
  • Knowledgeable about ATE
  • IMAPs and/or MEPTEC membership
  • Knows the latest semiconductor packaging trends.
  • Understands MIL-STD-883 and JEDEC requirements.
  • Proficient user of Microsoft Excel and other Office products.

#LI-AF1
Salary range
$155,500.00 - $246,000.00 / annually.For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $193,500.00- $290,500.00/ annually
At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience. Base pay may vary depending on job-related knowledge, skills, and experience. Additional cash or stock incentives may be provided as part of the compensation package, in addition to a range of medical, financial, and/or other benefits, dependent on the position offered. Learn more about Viasat's comprehensive benefit offerings that are focused on your holistic health and wellness at https://careers.viasat.com/benefits.
EEO Statement
Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.
ViaSat logo

About ViaSat

Sourced by ZipRecruiter

At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate.

Industry

Telecommunications

Company size

5,001 - 10,000 Employees

Headquarters location

Carlsbad, CA, US

Year founded

1986

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