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Electronics Packaging Engineer Jobs in Arizona (NOW HIRING)

... electronics packaging, or complex testing services. * Technical Foundation: Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a deeply technical field. A ...

Engineer Sales "Technical"

Phoenix, AZ · On-site

$150K - $250K/yr

... electronics packaging, or complex testing services. * Technical Foundation: Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a deeply technical field. A ...

Packaging Module Development Engineer

Phoenix, AZ

$94K - $133K/yr

  • Medical

  • Retirement

  • PTO

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... and manufacturability or electronics assembly. Preferred Qualifications * Proficiency in ...

Packaging Module Development Engineer

Phoenix, AZ · On-site

$85K - $162K/yr

  • Medical

  • Retirement

  • PTO

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... and manufacturability or electronics assembly. Preferred Qualifications * Proficiency in ...

Senior Mechanical Engineer (Engineer III) Location: Oro Valley, AZ Contract Duration: 3 months to 1 ... Lead mechanical design and analysis for electronic packaging of aerospace hardware * Create and ...

Experience with electronics packaging and design. Proficiency in SolidWorks 3D design software ... engineering role. #LI-MC1 Salary Range Transparency: Phoenix, AZ $75,000.00-$120,000.00 Annually ...

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Showing results 1-20

Electronics Packaging Engineer information

See Arizona salary details

$38.2K

$82.8K

$128.1K

How much do electronics packaging engineer jobs pay per year?

As of Aug 14, 2026, the average yearly pay for electronics packaging engineer in Arizona is $82,841.00, according to ZipRecruiter salary data. Most workers in this role earn between $55,400.00 and $102,000.00 per year, depending on experience, location, and employer.

What does an electronics packaging engineer do?

An electronics packaging engineer designs and develops protective enclosures and interconnections for electronic components to ensure durability, thermal management, and electrical performance. They work with CAD software, materials, and manufacturing processes to optimize product reliability and manufacturability, often collaborating with design and manufacturing teams. Knowledge of industry standards and testing methods is essential in this role.

Are electronics packaging engineers in demand?

Electronics packaging engineers are in demand due to the growth of consumer electronics, telecommunications, and semiconductor industries. They require skills in materials, thermal management, and CAD tools, and often find opportunities in manufacturing and R&D environments. The field offers steady job prospects as electronic devices continue to evolve and expand.

What are the typical daily responsibilities of an electronics packaging engineer?

An Electronics Packaging Engineer typically spends their days designing mechanical enclosures for electronic components, performing thermal and structural analyses, selecting appropriate materials, and creating detailed drawings using CAD software. They collaborate closely with electrical engineers, mechanical designers, manufacturing teams, and suppliers to ensure all aspects of the design meet performance, manufacturability, and safety requirements. Regular tasks also include reviewing prototypes, addressing manufacturability issues, and supporting the transition from design to production. This multifaceted role blends hands-on technical work with frequent teamwork and problem-solving to ensure successful electronic product launches.

What is an electronics packaging engineer?

An Electronics Packaging Engineer designs and develops the physical enclosure and interconnects for electronic components, ensuring reliability, thermal management, and signal integrity. They work with materials, manufacturing processes, and industry standards to optimize product performance and durability. Their role spans from conceptual design to production, collaborating with mechanical, electrical, and manufacturing teams.

What are the key skills and qualifications needed to thrive as an electronics packaging engineer?

A successful Electronics Packaging Engineer requires a solid background in electrical engineering, thermal management, materials science, and CAD-based design, often supported by a relevant bachelor’s or master’s degree. Familiarity with industry-standard design software such as AutoCAD, SolidWorks, and simulation tools, as well as adherence to IPC and JEDEC standards, is typically expected. Attention to detail, strong problem-solving skills, and effective collaboration with multidisciplinary teams are valuable soft skills in this field. Mastery of these competencies ensures reliable product development, compliance with industry standards, and seamless integration with manufacturing processes.

What are popular job titles related to Electronics Packaging Engineer jobs in Arizona?

For Electronics Packaging Engineer jobs in Arizona, the most frequently searched job titles are:

What job categories do people searching Electronics Packaging Engineer jobs in Arizona look for?

The top searched job categories for Electronics Packaging Engineer jobs in Arizona are:

What cities in Arizona are hiring for Electronics Packaging Engineer jobs?

Cities in Arizona with the most Electronics Packaging Engineer job openings:

Infographic showing various Electronics Packaging Engineer job openings in Arizona as of August 2026, with employment types broken down into 96% Full Time, 2% Contract, and 2% Nights. Highlights an 100% In-person job distribution, with an average salary of $82,841 per year, or $39.8 per hour.

Engineer Sales "Technical"

Spirit Electronics

Phoenix, AZ • On-site

$250K/yr

Full-time

Re-posted 4 days ago


Job description

Job Type
Full-time
Description
Spirit is seeking a high-caliber Engineer Sales "Technical" to accelerate the growth of our advanced microelectronics engineering, backend foundry services, custom assembly, and MIL-STD testing business units.
This is not a transactional, off-the-shelf component sales role. You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital technical bridge between Spirit's internal engineering team and our clients, you will translate complex backend architectures into bulletproof value propositions. Your primary focus will be capturing market share in hyper-stringent industries where failure is not an option: Aerospace & Defense, Automotive (EV Sensors & Qualification), Medical Devices, and Advanced MEMS / Micro-electronic Modules.
Essential Job Functions
  • Strategic Account Development: Cultivate and expand deep-level technical relationships with Tier 1 aerospace, defense, automotive, and medical device accounts.
  • Value-Driven Technical Selling: Conduct technical presentations, capabilities briefings, and facility tours showcasing Spirit's sophisticated foundry services, advanced packaging/assembly, and MIL-STD qualification testing.
  • Collaborative Solution Architecting: Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets.
  • Deal Execution & RFP Capture: Own the technical sales lifecycle for complex engineering services-from initial technical discovery and RFP/RFQ mapping to negotiating high-value contracts and closing deals.
  • Market Intelligence & Technical Leadership: Stay ahead of evolving industry standards (AEC-Q100, MIL-STD-883/750, ISO 13485) to position Spirit as the premier high-reliability backend partner. Represent the company at key semiconductor and aerospace trade shows.
  • Pipeline Management: Maintain an accurate, data-driven sales pipeline using CRM tools, working in lockstep with Corporate Sales and Business Development to align with

Requirements
  • Industry Experience: 5+ years of successful Technical Sales, Sales Engineering, or Applications Engineering experience, specifically selling high-reliability components, semiconductor backend services (OSAT), micro-electronics packaging, or complex testing services.
  • Technical Foundation: Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a deeply technical field. A strong semiconductor/microelectronics background is required.
  • High-Rel Domain Expertise: High familiarity with the requirements of mission-critical ecosystems:
    • Components & Packaging: Solid understanding of EEE components, wafer bumping, wire bonding, flip-chip, MEMS, and EV sensors.
    • Standards: Deep familiarity with MIL-STD testing procedures, with a strong understanding of what it takes to qualify hardware for extreme environments (AEC-Q100, IATF 16949, ISO 13485).
    • Supply Chain: Familiarity with supply chain logistics and inventory management concepts unique to aerospace, defense, and high-reliability manufacturing.
  • Commercial Track Record: Proven ability to meet or exceed quotas in long-cycle, high-value, highly technical B2B or government sales environments.
  • Elite Communication: Ability to code-switch effortlessly-speaking "physics-of-failure" with a customer's packaging engineer, and "ROI/Timeline" with their procurement director.
  • Tools & Travel: Proficiency in CRM/ERP platforms and MS Excel. Willingness to travel for face-to-face customer engineering reviews and industry events.

Why Join Spirit?
  • High-Value, High-Stakes Portfolio: You won't be competing on pennies per unit for commoditized chips. You will sell high-margin, critical engineering and qualification solutions that protect mission-critical applications.
  • Collaborative Culture: Work alongside brilliant engineering minds in an agile environment where your technical field input directly shapes our service roadmap and future capabilities.

Salary Description
$250,000