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Ic Packaging Engineer Jobs in Arizona (NOW HIRING)

Judge Group, Inc.

IC Packaging Design Engineer

Chandler, AZ · On-site

$138K/yr

We are seeking experienced IC Packaging Design Engineers to support advanced semiconductor packaging programs. The ideal candidates will possess strong expertise in package and substrate design, with ...

Spirit Electronics

Engineer Sales "Technical"

Phoenix, AZ · On-site

$150K - $250K/yr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

SPIRIT ELECTRONICS

Engineer Sales "Technical"

Phoenix, AZ · On-site

$150K - $250K/yr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

black.ai

Substrate IC Package Design Engineer

Tempe, AZ · On-site

$125 - $150/hr

Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by ... Engineering, or a related field * 5+ years of experience in substrate IC package design for high ...

SPIRIT ELECTRONICS

Engineer Sales "Technical"

Phoenix, AZ · On-site

$150 - $200/hr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

Spirit Electronics

Engineer Sales "Technical"

Phoenix, AZ · On-site

$250K/yr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

ST

Analog Design Engineer

Scottsdale, AZ · On-site

$150 - $200/hr

Awareness of IC packaging issues and concerns.At STMicroelectronics, base salary is one part of our ... Engineer #J-18808-Ljbffr

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Ic Packaging Engineer information

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How much do ic packaging engineer jobs pay per hour?

As of Sep 8, 2026, the average hourly pay for ic packaging engineer in Arizona is $39.48, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What is an IC Packaging Engineer?

An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.

What does an IC Packaging Engineer do?

IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer?

To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.

What are popular job titles related to Ic Packaging Engineer jobs in Arizona?

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Ic Packaging Engineer jobs near you
Infographic showing various Ic Packaging Engineer job openings in Arizona as of August 2026, with employment types broken down into 57% Full Time, 23% Part Time, and 20% Temporary. Highlights an 100% In-person job distribution, with an average salary of $82,118 per year, or $39.5 per hour.

IC Packaging Design Engineer

Judge Group, Inc.

Chandler, AZ • On-site

$138K/yr

Other

Posted 13 days ago

Job description

Location: Chandler, AZ Salary: Negotiable Description:
Job Description:
We are seeking experienced IC Packaging Design Engineers to support advanced semiconductor packaging programs. The ideal candidates will possess strong expertise in package and substrate design, with hands-on experience in leading package design tools and a deep understanding of performance, manufacturability, and reliability considerations.
Key Responsibilities
  • Develop and implement physical design and layout solutions for advanced IC packages.
  • Perform substrate design and package layout activities while ensuring adherence to design specifications.
  • Execute signal integrity (SI) and power integrity (PI) aware package designs.
  • Optimize package designs for performance, manufacturability, yield, reliability, and cost efficiency.
  • Ensure compliance with package design rules, technology constraints, and industry standards.
  • Collaborate with cross-functional teams including silicon, system, SI/PI, manufacturing, and reliability engineering teams.
  • Support design reviews, issue resolution, and continuous process improvements throughout the product development lifecycle.

Preferred Experience
  • Candidates should demonstrate expertise in one or more of the following areas:
  • Physical package design and layout.
  • Substrate design and routing methodologies.
  • SI/PI-aware package implementation.
  • Design for manufacturability (DFM), design for reliability (DFR), and yield optimization.
  • Package design rule verification and compliance.
  • Advanced semiconductor packaging technologies, including multi-die, SiP, or high-performance package solutions.

Qualifications
  • Bachelor's or Master's degree in Electrical or Electronics Engineering.
  • Senior-Level: 10+ years of experience in IC packaging and package design.
  • Mid-Level: 4-6 years of experience with a Master's degree or 6+ years with a Bachelor's degree in IC packaging and package design.
  • Strong communication skills and the ability to work effectively in a cross-functional engineering environment.

Required Technical Skills
  • Strong hands-on experience with Siemens (Mentor) Xpedition (XPD).
  • Alternative experience with Cadence Allegro, Advanced Package Designer (APD), or SiP tools is also acceptable.
Solid understanding of semiconductor packaging technologies, package architectures, and substrate design methodologies
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Contact:
This job and many more are available through The Judge Group. Please apply with us today!

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