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Ic Packaging Engineer Jobs in Arizona (NOW HIRING)

Jobtailor

Advanced IC Packaging Engineer

Chandler, AZ · On-site

$150 - $230/hr

* Responsible for the end-to-end development of advanced IC packaging solutions integrating power ... Advanced degree (MS/PhD preferred) in Electrical Engineering, Materials Science, Mechanical ...

New

SPIRIT ELECTRONICS

Engineer Sales "Technical"

Phoenix, AZ · On-site

$150K - $250K/yr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

Spirit Electronics

Engineer Sales "Technical"

Phoenix, AZ · On-site

$150K - $250K/yr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

black.ai

Substrate IC Package Design Engineer

Tempe, AZ · On-site

$130 - $160/hr

Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by ... Engineering, or a related field * 5+ years of experience in substrate IC package design for high ...

New

Spirit Electronics

Engineer Sales "Technical"

Phoenix, AZ · On-site

$250K/yr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

SPIRIT ELECTRONICS

Engineer Sales "Technical"

Phoenix, AZ · On-site

$120 - $180/hr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

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Ic Packaging Engineer information

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How much do ic packaging engineer jobs pay per hour?

As of Aug 19, 2026, the average hourly pay for ic packaging engineer in Arizona is $39.48, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What is an IC Packaging Engineer?

An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.

What does an IC Packaging Engineer do?

IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer?

To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.

What are popular job titles related to Ic Packaging Engineer jobs in Arizona?

For Ic Packaging Engineer jobs in Arizona, the most frequently searched job titles are:

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Ic Packaging Engineer jobs near you
Infographic showing various Ic Packaging Engineer job openings in Arizona as of August 2026, with employment types broken down into 92% Full Time, 3% Part Time, 2% Temporary, and 3% Contract. Highlights an 85% Physical, 6% Hybrid, and 9% Remote job distribution, with an average salary of $82,118 per year, or $39.5 per hour.

Advanced IC Packaging Engineer

Jobtailor

Chandler, AZ • On-site

$150 - $230/hr

Other

Posted yesterday

New

Job description

  • Responsible for the end-to-end development of advanced IC packaging solutions integrating power delivery chiplets into package substrates.
  • Architect and deliver first-of-its-kind land-side assembly and embedded chiplet integration within substrate cores.
  • Build packaging technologies from concept through high-volume manufacturing (HVM), including design, materials, process, test and reliability.
  • Establish and optimize Design of Experiments (DoE) frameworks to accelerate process development, yield learning, and performance optimization.
  • Develop statistical models and apply rigorous data analysis to drive design decisions, process control, and yield improvement.
  • Drive assembly process development, including novel flows for chiplet integration, substrate embedding, advanced interconnects and structure for reliability tests.
  • Partner directly with hyperscalers, ASIC, GPU, and xPU customers to integrate power delivery chiplets into their platforms.
  • Work closely with OSATs, testing, substrate vendors, and materials suppliers to build scalable, manufacturable solutions.
Requirements
  • Advanced degree (MS/PhD preferred) in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
  • 8+ years of experience in semiconductor packaging with deep expertise in advanced packaging (2.5D/3D, chiplets, substrate integration, test, reliability).
  • Proven experience taking packaging technologies from early concept to production including process and product qualification.
  • Strong background in power delivery, signal/power integrity, and package-system co-design.
  • Hands-on experience with DoE methodology, statistical analysis, and process optimization in a manufacturing or R&D environment.
  • Deep expertise in failure analysis, including root cause identification and corrective action across multiple domains.
  • Strong understanding of soldering processes, interconnect reliability, and assembly defect mechanisms.
  • Experience working with external manufacturing partners (OSATs), testing and supply chain ecosystems.
  • Ability to operate in ambiguity, move fast, and make high-quality technical decisions with limited data.
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