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Ic Packaging Engineer Jobs in Arizona (NOW HIRING)

Spirit Electronics

Engineer Sales "Technical"

Phoenix, AZ · On-site

$150K - $250K/yr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

Spirit Electronics

Engineer Sales "Technical"

Phoenix, AZ · On-site

$250K/yr

Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets. * Deal ...

Amkor Technology

Director, Package Development

Tempe, AZ · On-site

Required Qualifications: • Bachelor's degree in Engineering required; Master's degree or Ph.D. preferred. • 10+ years of experience in semiconductor package development, wafer-level packaging, IC ...

New

STMicroelectronics

Analog Design Engineer

Phoenix, AZ

$200K/yr

As an Analog Circuit Design engineer, you are passionate about CMOS IC design. You and are familiar ... Awareness of IC packaging issues and concerns At STMicroelectronics, base salary is one part of our ...

STMicroelectronics

Analog Design Engineer

Chandler, AZ

$198K/yr

As an Analog Circuit Design engineer, you are passionate about CMOS IC design. You and are familiar ... Awareness of IC packaging issues and concerns At STMicroelectronics, base salary is one part of our ...

STMicroelectronics

Analog Design Engineer

Scottsdale, AZ · On-site

$203K/yr

As an Analog Circuit Design engineer, you are passionate about CMOS IC design. You and are familiar ... Awareness of IC packaging issues and concerns. At STMicroelectronics, base salary is one part of ...

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Ic Packaging Engineer information

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How much do ic packaging engineer jobs pay per hour?

As of Aug 9, 2026, the average hourly pay for ic packaging engineer in Arizona is $39.48, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What is an IC Packaging Engineer?

An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer?

To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.

What does an IC Packaging Engineer do?

IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.

What are popular job titles related to Ic Packaging Engineer jobs in Arizona? For Ic Packaging Engineer jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Ic Packaging Engineer jobs in Arizona look for? The top searched job categories for Ic Packaging Engineer jobs in Arizona are:
Ic Packaging Engineer jobs near you
Infographic showing various Ic Packaging Engineer job openings in Arizona as of August 2026, with employment types broken down into 92% Full Time, 2% Part Time, and 6% Contract. Highlights an 87% Physical, 4% Hybrid, and 9% Remote job distribution, with an average salary of $82,118 per year, or $39.5 per hour.

IC Packaging Design Engineer

Comprehensive Resources Inc.

Chandler, AZ • On-site

$138K/yr

Other

Posted 9 days ago

Job description

Job Title: IC Packaging Design Engineer

Location: Chandler, AZ or Hillsboro, OR (100% Onsite)

Duration: Long-Term Contract (12+ Months)

Employment Type: C2C / W2

Openings: 4

Job Description

We are seeking experienced IC Packaging Design Engineers with strong expertise in package substrate design and advanced package layout. The ideal candidate should have hands-on experience with Siemens (Mentor) Xpedition (XPD) or Cadence Allegro Advanced Package Designer (APD/SiP) and a solid understanding of IC package design methodologies.

Required Qualifications
  • Bachelor's or Master's degree in Electrical/Electronics Engineering.
  • Senior Level: 10+ years of IC Packaging / Package Design experience.
  • Mid Level: 4-6+ years (MS) or 6+ years (BS) of relevant experience.
  • Strong hands-on experience with Siemens (Mentor) Xpedition (XPD) (Preferred).
  • Experience with Cadence Allegro APD / SiP is also acceptable.
  • Strong understanding of package substrate design and layout.

Required Skills
  • IC Package Physical Design & Layout
  • Substrate Design & Layout
  • SI/PI Aware Design Implementation
  • Design Rule Compliance (DRC)
  • Design for Performance, Manufacturability, Yield & Reliability
  • Package Floor Planning
  • High-Speed Signal Routing
  • Package Stack-up Design
  • Cross-functional collaboration with SI/PI, Mechanical, and Manufacturing teams

Preferred Skills
  • FCBGA, FCCSP, SiP, or Advanced Packaging experience
  • High-speed interfaces such as PCIe, DDR, HBM, or SerDes
  • Strong problem-solving and debugging skills

Please send your updated resume to:

C2C & W2 candidates are welcome.

Apply