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Semiconductor Packaging Engineer Jobs in Arizona

INTEL

Packaging Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...

Accroid Inc

Advanced Packaging Engineer

Phoenix, AZ · On-site

Top Mandatory Skills: * 7+ years of advanced semiconductor packaging experience. * Hands-on ... Bachelor'''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics ...

INTEL

Packaging Engineer

Phoenix, AZ

Semiconductor Engineering experience * Experience supporting high-volume manufacturing ramps and ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$94K - $133K/yr

This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...

Intel

Packaging Module Development Engineer

Phoenix, AZ

$115K - $219K/yr

The Packaging Module Development Engineer will contribute to advancing technology and foundry ... Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor ...

Intel

Packaging Module Development Engineer

Phoenix, AZ

$85K - $162K/yr

This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...

Spirit Electronics

Engineer Sales "Technical"

Phoenix, AZ · On-site

$150K - $250K/yr

You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital ...

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Semiconductor Packaging Engineer information

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$18

$39

$62

How much do semiconductor packaging engineer jobs pay per hour?

As of Aug 12, 2026, the average hourly pay for semiconductor packaging engineer in Arizona is $39.48, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are the key skills and qualifications needed to thrive as a semiconductor packaging engineer?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What does a semiconductor packaging engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are some common challenges semiconductor packaging engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.
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What cities in Arizona are hiring for Semiconductor Packaging Engineer jobs? Cities in Arizona with the most Semiconductor Packaging Engineer job openings:
Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in Arizona as of August 2026, with employment types broken down into 92% Full Time, 3% Part Time, and 5% Contract. Highlights an 86% Physical, 5% Hybrid, and 9% Remote job distribution, with an average salary of $82,118 per year, or $39.5 per hour.

Packaging Engineer

INTEL

Phoenix, AZ • On-site

$127K - $179K/yr

Full-time

Medical, Retirement, PTO

Posted 19 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 157 rated electronics manufacturers

Job description

Job Description

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.


As a Packaging Module Development Engineer, you will:


• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate should demonstrate:


• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.


Qualifications

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:


• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.


• Experience listed above should be a combination of the following:

Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Preferred Qualifications:


One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

What Intel employees say

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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