Packaging Engineer
$127K - $179K/yr
... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...
$127K - $179K/yr
... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...
$127K - $179K/yr
... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...
Phoenix, AZ · On-site
Top Mandatory Skills: * 7+ years of advanced semiconductor packaging experience. * Hands-on ... Bachelor'''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics ...
Phoenix, AZ · On-site
Top Mandatory Skills: * 7+ years of advanced semiconductor packaging experience. * Hands-on ... Bachelor'''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics ...
Phoenix, AZ · On-site
$105K - $149K/yr
We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This ...
Phoenix, AZ · On-site
$105K - $149K/yr
We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This ...
Phoenix, AZ · On-site
$105K - $149K/yr
We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This ...
Phoenix, AZ · On-site
$105K - $149K/yr
We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This ...
This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design ...
This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design ...
This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design ...
This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design ...
This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design ...
This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design ...
Semiconductor Engineering experience * Experience supporting high-volume manufacturing ramps and ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Semiconductor Engineering experience * Experience supporting high-volume manufacturing ramps and ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...
... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...
As a Packaging Module Development Engineer, you will: Contribute to the advancement of technology ... Semiconductor fabrication processes and technologies. Prior related work experience within a ...
As a Packaging Module Development Engineer, you will: Contribute to the advancement of technology ... Semiconductor fabrication processes and technologies. Prior related work experience within a ...
Phoenix, AZ · On-site
$116K - $163K/yr
Knowledge of Semiconductor fabrication and processing techniques (Lithography, Etch, CMP, Thin ... Programing Experience in JMP/JSL, Python, R and SQL * 2+ yrs of New Technology startup experience ...
Phoenix, AZ · On-site
$116K - $163K/yr
Knowledge of Semiconductor fabrication and processing techniques (Lithography, Etch, CMP, Thin ... Programing Experience in JMP/JSL, Python, R and SQL * 2+ yrs of New Technology startup experience ...
$127K - $179K/yr
... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...
$127K - $179K/yr
... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...
$94K - $133K/yr
This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...
$94K - $133K/yr
This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...
Phoenix, AZ · On-site
$115K - $219K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor ...
Phoenix, AZ · On-site
$115K - $219K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor ...
Phoenix, AZ · On-site
$115K - $219K/yr
... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...
Phoenix, AZ · On-site
$115K - $219K/yr
... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...
Phoenix, AZ · On-site
$85K - $162K/yr
This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...
Phoenix, AZ · On-site
$85K - $162K/yr
This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...
Phoenix, AZ · On-site
$85K - $162K/yr
This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...
Phoenix, AZ · On-site
$85K - $162K/yr
This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...
Phoenix, AZ · On-site
$150K - $250K/yr
You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital ...
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Phoenix, AZ · On-site
$150K - $250K/yr
You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital ...
Phoenix, AZ · On-site
$250K/yr
You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital ...
Phoenix, AZ · On-site
$250K/yr
You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital ...
$150K - $250K/yr
You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital ...
$150K - $250K/yr
You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital ...
$18.37 - $22.38
2% of jobs
$22.38 - $26.39
6% of jobs
$30.22 is the 25th percentile. Wages below this are outliers.
$26.39 - $30.40
17% of jobs
$30.40 - $34.42
16% of jobs
The median wage is $36.42 / hr.
$34.42 - $38.43
16% of jobs
$38.43 - $42.44
12% of jobs
$44.35 is the 75th percentile. Wages above this are outliers.
$42.44 - $46.45
11% of jobs
$46.45 - $50.46
6% of jobs
$50.46 - $54.48
5% of jobs
$54.48 - $58.49
4% of jobs
$58.49 - $62.50
3% of jobs
$18
$39
$62
| Aspect | Semiconductor Packaging Engineer | Test Engineer |
|---|---|---|
| Required Credentials | Bachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMI | Bachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards |
| Work Environment | Design labs, manufacturing facilities, cleanrooms | Testing labs, production lines, quality assurance departments |
| Industry Usage | Semiconductor manufacturing, electronics companies | Electronics manufacturing, semiconductor companies |
Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.
$127K - $179K/yr
Full-time
Medical, Retirement, PTO
Posted 15 days ago
8.7
Based on 147 frontline employees who took The Breakroom Quiz
19th of 156 rated electronics manufacturers
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
As a Packaging Module Development Engineer, you will:
• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate should demonstrate:
• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
• Experience listed above should be a combination of the following:
Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Preferred Qualifications:
One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Manufacturing
10,000+ Employees
Santa Clara, CA, US
1968