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Semiconductor Packaging Jobs in Arizona (NOW HIRING)

Accroid Inc

Advanced Packaging Engineer

Phoenix, AZ · On-site

Top Mandatory Skills: * 7+ years of advanced semiconductor packaging experience. * Hands-on experience with 2.5D & 3D packaging technologies . * Strong experience with chiplet architectures and ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

  • Medical

  • Retirement

  • PTO

This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

  • Medical

  • Retirement

  • PTO

This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design ...

INTEL

Packaging Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

  • Medical

  • Retirement

  • PTO

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

Intel

Packaging Module Development Engineer

Phoenix, AZ

  • Medical

  • Retirement

  • PTO

Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities Lead equipment development activities, including pathfinding ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

  • Medical

  • Retirement

  • PTO

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$94K - $133K/yr

  • Medical

  • Retirement

  • PTO

This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$115K - $219K/yr

  • Medical

  • Retirement

  • PTO

Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale. Managing equipment development, including pathfinding, new ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$85K - $162K/yr

  • Medical

  • Retirement

  • PTO

This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development ...

Intel

ATD Experienced Laser Development Engineer

Phoenix, AZ · On-site

$115K - $219K/yr

  • Medical

  • Retirement

  • PTO

The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers ...

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All JobsSemiconductor Packaging JobsSemiconductor Packaging Jobs in Arizona

Semiconductor Packaging information

See Arizona salary details

$11

$17

$25

How much do semiconductor packaging jobs pay per hour?

As of Aug 12, 2026, the average hourly pay for semiconductor packaging in Arizona is $17.56, according to ZipRecruiter salary data. Most workers in this role earn between $15.24 and $18.61 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.
What are the most commonly searched types of Semiconductor Packaging jobs in Arizona? The most popular types of Semiconductor Packaging jobs in Arizona are:
What are popular job titles related to Semiconductor Packaging jobs in Arizona? For Semiconductor Packaging jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Semiconductor Packaging jobs in Arizona look for? The top searched job categories for Semiconductor Packaging jobs in Arizona are:
What cities in Arizona are hiring for Semiconductor Packaging jobs? Cities in Arizona with the most Semiconductor Packaging job openings:
Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in Arizona as of August 2026, with employment types broken down into 84% Full Time, 11% Part Time, 1% Temporary, 2% Contract, and 2% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $36,529 per year, or $17.6 per hour.

Mechanical Design Engineer - Semiconductor Packaging

Intel

Phoenix, AZ

$105K - $149K/yr

Full-time

Medical, Retirement, PTO

Posted 11 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 157 rated electronics manufacturers

Job description

Job Details:Job Description: 

We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role in designing and developing mechanical components and tooling required throughout the packaging and assembly lifecycle. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross-functionally and solving complex design problems with minimal supervision.

Key Responsibilities:

  • Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
  • Develop and maintain mechanical designs and detailed drawings for:
    • Substrates
    • Integrated Heat Spreaders (IHS)
    • Stiffeners
    • Overall package assemblies
  • Design process media trays used during various stages of the assembly process.
  • Collaborate closely with architecture, process, and assembly teams to ensure design intent and manufacturability.
  • Act as the single point of contact for all packaging mechanical design collateral needs.
  • Proactively identify and solve design and process issues, ensuring timely project execution.

Behavioral traits

  • Problem-solving skills and a proactive approach to challenges.
  • Excellent communication and interpersonal skills for effective cross-functional collaboration.
  • Manage multiple tasks and projects simultaneously under tight deadlines.
Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

This position is not eligible for Intel immigration sponsorship

Knowledge and/or experience listed below would be obtained through a combination of your school/work and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Bachelor's degree in mechanical engineering or in a STEM related field of study.
  • 1+ year of experience in:
    • 2D and 3D CAD software.
    • Mechanical design foundation and 3D spatial awareness.
    • Interpret and generate technical drawings and specifications.

Preferred Qualifications

  • Master's degree in mechanical engineering or in a STEM related field of study.
  • 2+ years' experience with CAD tools such as SolidWorks, Siemens NX, and AutoCAD is highly preferred.
  • Experience in semiconductor packaging or related high-precision manufacturing environments.
  • Familiarity with material properties and mechanical tolerances used in package design and tooling.
Job Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $105,650.00-149,150.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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