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Semiconductor Packaging Jobs in Arizona (NOW HIRING)

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$85K - $162K/yr

  • Medical

  • Retirement

  • PTO

This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development ...

Jobtailor

Advanced IC Packaging Engineer

Chandler, AZ · On-site

$150 - $230/hr

Advanced degree (MS/PhD preferred) in Electrical Engineering, Materials Science, Mechanical Engineering, or related field. * 8+ years of experience in semiconductor packaging with deep expertise in ...

New

Intel

Quality Reliability Engineer

Phoenix, AZ · On-site

$101K - $128K/yr

  • Medical

  • Retirement

  • PTO

Experience in semiconductor package, board-level, or electronic system reliability. Knowledge of reliability qualification methodologies including thermal cycling, mechanical shock, vibration ...

Intel Corporation

Quality Reliability Engineer

Phoenix, AZ · On-site

$101K - $128K/yr

  • Medical

  • Retirement

  • PTO

Experience in semiconductor package, board-level, or electronic system reliability. Knowledge of reliability qualification methodologies including thermal cycling, mechanical shock, vibration ...

Intel Corporation

Quality Reliability Engineer

Phoenix, AZ · On-site

$121 - $171/hr

  • Medical

  • Retirement

  • PTO

Experience in semiconductor package, board-level, or electronic system reliability. * Knowledge of reliability qualification methodologies including thermal cycling, mechanical shock, vibration ...

INTEL

Process Integration Engineer

Phoenix, AZ

$127K - $179K/yr

  • Medical

  • Retirement

  • PTO

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

INTEL

Seniconductor Process Engineer

Phoenix, AZ

$127K - $179K/yr

  • Medical

  • Retirement

  • PTO

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

INTEL

Process Engineer - RF Test

Phoenix, AZ

$127K - $179K/yr

  • Medical

  • Retirement

  • PTO

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

INTEL

Yield Engineer

Phoenix, AZ

$127K - $179K/yr

  • Medical

  • Retirement

  • PTO

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

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Semiconductor Packaging information

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How much do semiconductor packaging jobs pay per hour?

As of Aug 19, 2026, the average hourly pay for semiconductor packaging in Arizona is $17.56, according to ZipRecruiter salary data. Most workers in this role earn between $15.24 and $18.61 per hour, depending on experience, location, and employer.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

Is it hard to get a job in semiconductor packaging?

Securing a job in semiconductor packaging can be competitive, but candidates with relevant technical skills, such as knowledge of cleanroom environments, soldering, and inspection tools, have good opportunities. Entry-level positions may require some training or certifications, but experience with industry-standard processes can improve job prospects.

What are the most commonly searched types of Semiconductor Packaging jobs in Arizona?

The most popular types of Semiconductor Packaging jobs in Arizona are:

What are popular job titles related to Semiconductor Packaging jobs in Arizona?

For Semiconductor Packaging jobs in Arizona, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging jobs in Arizona look for?

The top searched job categories for Semiconductor Packaging jobs in Arizona are:

What cities in Arizona are hiring for Semiconductor Packaging jobs?

Cities in Arizona with the most Semiconductor Packaging job openings:

Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in Arizona as of August 2026, with employment types broken down into 83% Full Time, 11% Part Time, 2% Temporary, 2% Contract, and 2% Nights. Highlights an 96% Physical, 1% Hybrid, and 3% Remote job distribution, with an average salary of $36,529 per year, or $17.6 per hour.

Packaging Module Development Engineer

Intel

Phoenix, AZ • On-site

$85K - $162K/yr

Full-time

Medical, Retirement, PTO

Re-posted 14 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

Job Details:Job Description: 

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability. By leveraging your technical expertise, you will help ensure that Intel delivers exceptional results to meet the demands of a rapidly evolving industry.

Key Responsibilities:

  • Design and develop assembly processes and equipment to enable future packaging technologies.
  • Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
  • Conduct tests under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces, to evaluate silicon and packaging technologies.
  • Oversee the manufacturability of package designs and manage their manufacturing cycles.
  • Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
  • Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
  • Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
  • Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
  • Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.
Qualifications:

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

  • Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field.

  • Experience listed above should be a combination of the following:

    • Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.

Preferred Qualifications

  • Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

  • Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.

  • Demonstrated ability to collaborate with cross-functional teams and contribute to time-sensitive projects.

We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel. Be a part of our mission to create world-class packaging solutions and help shape the future of technology.

Job Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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