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Semiconductor Packaging Jobs (NOW HIRING)

Fab2

Semiconductor Packaging Engineer

Austin, TX · On-site

$110 - $155/hr

We are seeking an experienced Semiconductor Packaging Engineer with deep expertise in packaging methods and a passion for exploring new technologies. This person will play a critical role in ...

Aptino

Senior Semiconductor Packaging Engineer

Morgan Hill, CA · On-site

$119K - $163K/yr

Senior Semiconductor Packaging Engineer 📍 Morgan Hill, CA -- Onsite 💼 Full-Time | Direct Hire We are looking for an experienced Semiconductor Packaging Engineer to support the development and ...

Micross

Package Design Engineer | Semiconductor

Apopka, FL · On-site

$119K/yr

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. * 8 to 10 years of experience in semiconductor packaging design, modeling, and ...

Steneg

Head of Packaging Engineering

Boulder, CO · On-site

$150 - $190/hr

... semiconductor platforms that enable breakthrough computational capabilities. The organization ... Mission The Head of Packaging Engineering will provide technical leadership for the architecture ...

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Semiconductor Packaging information

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How much do semiconductor packaging jobs pay per hour?

As of Aug 26, 2026, the average hourly pay for semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

Is it hard to get a job in semiconductor packaging?

Securing a job in semiconductor packaging can be competitive, but candidates with relevant technical skills, such as knowledge of cleanroom environments, soldering, and inspection tools, have good opportunities. Entry-level positions may require some training or certifications, but experience with industry-standard processes can improve job prospects.
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Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in the United States as of August 2026, with employment types broken down into 83% Full Time, 12% Part Time, 2% Contract, and 3% Nights. Highlights an 96% Physical, 1% Hybrid, and 3% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Semiconductor Packaging Engineer

Analog Devices

Wilmington, MA • On-site

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 23 days ago

Analog Devices rating

8.7

Company rating: 8.7 out of 10

Based on 18 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.
Senior Systems Semiconductor Packaging Engineer
About the Role
As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications. You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions.
This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market.
Key Responsibilities
  • Packaging Development: - Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
  • Manufacturability and Reliability: - Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
  • Root Cause and Yield Improvement: - Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
  • Engineering Analysis: - Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
  • Process and Quality Methods: - Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
  • Customer Requirements Translation: - Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
  • OSAT Collaboration: - Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
  • Vendor and Assembly Readiness: - Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
  • Cross-Functional Leadership: - Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases

Required Skills
  • Semiconductor Packaging Expertise: - Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
  • Materials Knowledge: - Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
  • Design for Reliability: - Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
  • Simulation and Analysis Tools: - Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
  • Structured Problem Solving: - Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
  • Cross-Functional Collaboration: - Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
  • Technical Communication: - Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders

Preferred Education and Experience
  • Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
  • 5+ years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
  • Experience supporting MEMS, sensor, or advanced package development is a plus
  • Experience working with OSAT partners and external manufacturing vendors is preferred

We recognize that candidates may not meet every listed requirement. If you bring relevant experience and a willingness to learn, we encourage you to apply.
#LI-PG1
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law.
Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $110,385 to $151,808.
  • Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
  • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

What Analog Devices employees say

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About Analog Devices

Sourced by ZipRecruiter

Analog Devices (NASDAQ: ADI) designs and manufactures semiconductor products and solutions. We enable our customers to interpret the world around us by intelligently bridging the physical and digital worlds with unmatched technologies that sense, measure and connect.

Industry

Electrical equipment, appliance, and component manufacturing

Company size

5,001 - 10,000 Employees

Headquarters location

Norwood, MA, US

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