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Semiconductor Packaging Jobs (NOW HIRING)

Micross

Package Design Engineer | Semiconductor

Apopka, FL · On-site

$119K/yr

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. * 8 to 10 years of experience in semiconductor packaging design, modeling, and ...

Accroid Inc

Advanced Packaging Engineer

Phoenix, AZ · On-site

Top Mandatory Skills: * 7+ years of advanced semiconductor packaging experience. * Hands-on experience with 2.5D & 3D packaging technologies . * Strong experience with chiplet architectures and ...

Diodes Incorporated

Be Seen First

Senior Director of Packaging Technology

Plano, TX · On-site

The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing analog and power products from concept through qualification and high-volume ...

Quantinuum

Chief Packaging Engineer - 906

Broomfield, CO · On-site

$208K - $260K/yr

Minimum Bachelor's degree with 18+ years' experience in advanced semiconductor packaging development OR * Minimum Master's degree with 15+ years' experience in advanced semiconductor packaging ...

Apple

IC Packaging Engineer - WLP

San Francisco, CA · On-site

... semiconductor packaging, materials, thermal, mechanical, or electrical modeling Deep experience in ... the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM ...

INTEL

Packaging Engineer

Phoenix, AZ

$127K - $179K/yr

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

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Semiconductor Packaging information

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How much do semiconductor packaging jobs pay per hour?

As of Aug 6, 2026, the average hourly pay for semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.
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Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in the United States as of July 2026, with employment types broken down into 84% Full Time, 12% Part Time, 2% Contract, and 2% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Senior Engineer, Semiconductor Packaging

Analog Devices

Wilmington, MA • On-site

$95K - $131K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 12 days ago

Analog Devices rating

8.5

Company rating: 8.5 out of 10

Based on 17 frontline employees who took The Breakroom Quiz

33rd of 156 rated electronics manufacturers

Job description

About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.
This role will focus on the development of advanced packaging solutions for semiconductor devices across multiple market segments. The packaging solutions must meet demanding product performance, reliability, manufacturability, and cost requirements. Candidates will be expected to:
  • Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
  • Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools.
  • Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
  • Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
  • Work with quality and reliability teams to establish reliability criteria for semiconductor products across various market applications.
  • Develop and maintain package design guidelines, process specifications, and technical documentation.

Qualifications
  • PhD or Master's degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
  • 2+ years of hands-on experience in semiconductor packaging development or manufacturing.
  • Good understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
  • Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
  • Hands-on experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar tools.
  • Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
  • Experience with Cadence Allegro is a plus.
  • Strong communication skills and the ability to work effectively in cross-functional and global teams.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law.
Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $95,600 to $131,450.
  • Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
  • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

What Analog Devices employees say

Pay

Benefits

Hours and flexibility

Workplace

Get the full story on Breakroom

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About Analog Devices

Sourced by ZipRecruiter

Analog Devices (NASDAQ: ADI) designs and manufactures semiconductor products and solutions. We enable our customers to interpret the world around us by intelligently bridging the physical and digital worlds with unmatched technologies that sense, measure and connect.

Industry

Electrical equipment, appliance, and component manufacturing

Company size

5,001 - 10,000 Employees

Headquarters location

Norwood, MA, US

Year founded

1965

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