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Semiconductor Packaging Jobs (NOW HIRING)

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Semiconductor Packaging Engineer Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production ...

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Semiconductor Packaging Engineer Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production ...

Micross

Package Design Engineer | Semiconductor

Durham, NC · On-site

$128.20K/yr

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. * 8 to 10 years of experience in semiconductor packaging design, modeling, and ...

Micross

Package Design Engineer | Semiconductor

Apopka, FL · On-site

$119.20K/yr

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. * 8 to 10 years of experience in semiconductor packaging design, modeling, and ...

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How much do semiconductor packaging jobs pay per hour?

As of May 31, 2026, the average hourly pay for semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in Semiconductor Packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a Semiconductor Packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are some semiconductor packaging companies?

Semiconductor packaging companies design and produce the protective casings and interconnections for semiconductor devices. Major firms in this industry include Amkor Technology, ASE Group, and JCET Group, which provide packaging solutions such as wire bonding, flip-chip, and system-in-package. Working in this field often requires knowledge of materials, cleanroom environments, and precision manufacturing processes.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

More about Semiconductor Packaging jobs
What cities are hiring for Semiconductor Packaging jobs? Cities with the most Semiconductor Packaging job openings:
What are the most commonly searched types of Semiconductor Packaging jobs? The most popular types of Semiconductor Packaging jobs are:
What states have the most Semiconductor Packaging jobs? States with the most job openings for Semiconductor Packaging jobs include:
What job categories do people searching Semiconductor Packaging jobs look for? The top searched job categories for Semiconductor Packaging jobs are:
Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in the United States as of May 2026, with employment types broken down into 76% Full Time, 4% Part Time, 12% Contract, and 8% Nights. Highlights an 98% Physical, and 2% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.
Semiconductor Packaging Engineer

Semiconductor Packaging Engineer

Sigma Design

Redmond, WA • On-site

$115K - $145K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 14 days ago

Job description

Semiconductor Packaging Engineer

Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production services to diverse clients around the globe. Sigma Design believes in hiring, developing, and recognizing the best. We offer competitive compensation, a 401(k) with up to 4% company match, quarterly bonus program, 15-days of accrued PTO and 9 company paid holidays. In addition, Sigma Design has multiple options for medical insurance and dental insurance. We also offer voluntary benefits: vision, long-term disability, and life insurance. 
Position Details:
  • This position will be In-Office
  • $115,000 - $140,000 annually
  • This is a contract position with an expected duration of 12 months and the opportunity to be extended. 

Primary Function:
The Semiconductor Packaging Engineer is responsible for developing, executing, and optimizing semiconductor and advanced packaging assembly and integration processes. This role supports the design, fabrication, and validation of advanced electronic packaging solutions for heterogeneous, flexible, and stretchable electronic systems, while collaborating across research, hardware, and manufacturing teams to improve device performance, reliability, and scalability.
Essential Job Functions - Responsibilities:
  • Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing.
  • Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices.
  • Design and oversee internal, external, and hybrid manufacturing workflows to accelerate development, integration, and scale-up of advanced electronic packaging technologies.
  • Develop new methods and processes to close technology gaps, improve device performance, and increase manufacturing yield through process innovation and optimization.
  • Design and execute experiments (DOE), analyze experimental results, and apply findings to improve packaging processes, device performance, and yield.
  • Execute hands-on fabrication workflows using advanced packaging and assembly equipment, identify in-line process issues, and propose solutions or workarounds to improve manufacturing performance.
  • Collaborate closely with researchers, hardware engineers, system integration teams, and external manufacturing partners to support the development and production of advanced electronic packaging solutions.
  • Support the development and use of high-performance electronic materials in advanced packaging environments.
  • Contribute to instrumentation development, process characterization, mechanical or layout design, and data analysis methods used in hardware research and development environments.
  • Follow Business Technology policies to protect sensitive data and reduce information security occurrences.

Education and Experience: (Knowledge, Skills, & Abilities)
  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Materials Science, or related technical field or equivalent professional experience required
  • Minimum of 1+ years of relevant work experience in semiconductor manufacturing, advanced packaging, or related electronics manufacturing environments preferred
  • Strong background in semiconductor or advanced packaging processes, including wafer-level or panel-level manufacturing
  • Hands-on experience working with semiconductor assembly and packaging equipment
  • Experience designing and executing Design of Experiments (DOE), analyzing results, and optimizing manufacturing yield
  • Experience collaborating across research and development, hardware engineering, and manufacturing teams
  • Strong analytical, troubleshooting, and problem-solving skills with an innovation and scalability mindset
  • Experience with advanced packaging technologies such as Flexible Printed Circuits (FPC), Printed Circuit Board Assembly (PCBA), 2.5D/3D integration, or related electronic packaging technologies
  • Experience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation
  • Experience handling and integrating thinned electronic components as part of advanced packaging workflows
  • Demonstrated success developing or maturing hardware research processes including instrumentation, characterization, mechanical or layout design, and/or advanced data analysis techniques
  • Experience developing or applying high-performance electronic materials in semiconductor or advanced packaging environments
  • Experience with advanced packaging domains including Flexible Printed Circuits (FPC), Multi-Chip Modules (MCM), System-in-Package (SiP), 2.5D/3D integration, Flexible Hybrid Electronics (FHE), or similar technologies preferred
  • Experience performing reliability testing and failure analysis including die or ball shear testing, wire pull testing, X-ray inspection, C-SAM inspection, thermal cycling, and environmental testing preferred
  • Experience with wearable technologies or technical soft goods preferred
  • Experience with hermetic or MEMS packaging, thermal management materials, or injection/transfer molding processes preferred
  • Experience using Finite Element Analysis (FEA) modeling or simulation tools to accelerate design and prevent failures preferred
  • Experience in System-in-Package (SiP) or Multi-Chip Module (MCM) design, manufacturing, and validation preferred
  • Experience with signal integrity or power integrity simulation tools (e.g., HFSS) and validation preferred
  • Strong written and verbal English language communication skills
  • Excellent teamwork/interpersonal skills and the ability to communicate effectively
  • Demonstrated ability to work collaboratively, both within and outside one's own work group
  • Demonstrate commitment and adherence to Sigma Design Core Values
  • Pass a post-offer background verification

Work Environment
Standard office environment with normal amounts of office related conditions. Occasionally may be required to work in environmental conditions that emulate typical user environments in order to facilitate design testing and validation.  Occasionally may be required to travel as required to other facilities, clients, or suppliers. 
 

SigmaDesign is an Equal Opportunity Employer

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