Semiconductor Packaging Vice President Jobs (NOW HIRING)

Requisition ID29070-Posted08/03/2026-Product Management-Regular Exempt Full-Time Employee

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com .

Position Summary

Amkor is seeking an experienced and results-driven VP, Head of fcCSP Business Unit to be based at the company's corporate headquarters in Tempe, Arizona. Reporting directly to the senior executive responsible for Amkor's Advanced and Mainstream Business Units, this is a critical leadership role with full business responsibility for Amkor's fcCSP product portfolio and package line. The Vice President will lead business growth, customer engagement, strategic planning, organizational development, capacity planning, and talent/staffing initiatives to support continued expansion of the fcCSP business.

This highly visible, customer-facing role requires extensive cross-functional leadership and collaboration across sales, operations, engineering, product development, finance, and manufacturing teams. The successful candidate will lead commercial, technical, capacity, capital investment, and strategic discussions with customers while ensuring alignment of internal resources to meet business objectives. Previous P&L ownership and a proven track record of driving profitable growth are strongly preferred.

Essential Duties and Responsibilities

This role combines executive leadership, deep semiconductor packaging expertise, strategic planning, customer management, operational execution, and organizational development. The selected individual will be responsible for driving both business and technical success across the fcCSP organization.

• Lead and grow Amkor's global fcCSP business, establishing strategies that drive sustainable revenue growth, market share expansion, and customer satisfaction.
• Manage and develop the fcCSP organization, ensuring appropriate staffing, succession planning, capability development, and organizational effectiveness to support future growth.
• Promote Amkor packaging technologies directly to new and existing customers, identifying opportunities to expand business and accelerate adoption of Amkor's package portfolio.
• Drive year-over-year revenue growth within the fcCSP Business Unit while identifying opportunities for broader growth across Amkor's product portfolio.
• Serve as the executive interface for key fcCSP customers, leading commercial, technical, capacity, roadmap, and escalation discussions.
• Partner with Amkor's advanced product development teams to successfully transition new packaging technologies into high-volume manufacturing, including cost analysis, capital investment planning, manufacturability assessments, customer qualifications, and production ramp execution.
• Lead strategic capacity planning and capital investment discussions to support customer growth requirements and maximize business performance.
• Develop and execute product roadmaps, marketing strategies, and business plans to support growth in existing and emerging markets.
• Ensure effective processes and systems are in place to manage multiple customer programs, monitor performance metrics, and drive operational excellence.
• Foster a high-performance culture focused on accountability, collaboration, innovation, customer success, and continuous improvement.
• Build, mentor, and develop future leaders within the organization while creating a strong talent pipeline for long‑term business success.
• Travel to customer locations and Amkor manufacturing sites as needed to support business objectives.

Required Qualifications

• Bachelor's degree in Engineering, Science, or a related technical discipline; advanced business degree (MBA or equivalent) preferred.
• Minimum of 15 years of leadership experience within semiconductor manufacturing, packaging, or related industries.
• Demonstrated success leading large, customer‑facing business organizations with accountability for revenue growth, profitability, and organizational development.
• Proven experience managing business strategy, customer relationships, staffing, and organizational growth in a complex, global environment.
• Strong technical understanding of semiconductor packaging technologies, materials, substrates, manufacturing processes, and specifically fcCSP packaging.
• Previous experience with P&L ownership or significant business management responsibility is highly desirable.
• Demonstrated ability to lead cross‑functional teams and execute effectively in a highly matrixed organization.
• Strong program management, strategic planning, negotiation, and executive communication skills.
• Proven track record of delivering year‑over‑year customer revenue growth and expanding strategic customer relationships.
• Exceptional leadership, organizational development, stakeholder management, and talent development capabilities.
• Excellent written, verbal, presentation, and interpersonal communication skills.
• Proficiency with Microsoft Office applications, including Excel, PowerPoint, Outlook, and Teams.
• Ability to travel approximately 15% domestically and 15% internationally.

Location:
Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.