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Internship Semiconductor Packaging Jobs (NOW HIRING)

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127.40K - $179.90K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

Intel

Packaging Module Development Engineer

Phoenix, AZ

$115.11K - $219.55K/yr

Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor ... and/or internship experiences. Minimum Qualifications * PhD degree in Mechanical Engineering ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127.40K - $179.90K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... and/or internship experiences. Minimum Qualifications * PhD degree in Mechanical Engineering ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$94.30K - $133.20K/yr

This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

Marvell

Principal Package Engineer

Santa Clara, CA

... the semiconductor packaging field OR Master's degree and/or PhD in ME and Material science or ... every stage - from internship to retirement and through life's most important moments. Our ...

Purdue University

Student (2)

West Lafayette, IN · On-site

... packaging Familiarity with semiconductor device structures, routing, or packaging design concepts Additional Information Paid internship position PARI is an EOE/AA employer. All individuals ...

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How much do internship semiconductor packaging jobs pay per hour?

As of Jun 1, 2026, the average hourly pay for internship semiconductor packaging in the United States is $16.33, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $19.23 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as an Internship Semiconductor Packaging, and why are they important?

To thrive as an intern in semiconductor packaging, foundational knowledge in materials science, electronics, and engineering principles—typically from coursework in electrical or mechanical engineering—is essential. Familiarity with semiconductor design software (such as AutoCAD or SolidWorks), lab equipment, and basic data analysis tools is often required. Strong problem-solving, attention to detail, and effective communication skills set candidates apart in team-based, technical environments. These competencies are crucial for supporting complex manufacturing processes, ensuring quality, and contributing meaningfully to R&D projects.

What types of projects and hands-on experiences can I expect during an internship in semiconductor packaging?

As an intern in semiconductor packaging, you can expect to work on projects involving the design, assembly, and testing of semiconductor packages. Typical responsibilities may include assisting with process optimization, analyzing failure modes, and supporting engineers with data collection and analysis. You will likely collaborate with cross-functional teams in engineering, quality assurance, and manufacturing, gaining exposure to industry-standard tools and methodologies. This hands-on experience is valuable for understanding the full lifecycle of semiconductor devices and can provide a strong foundation for future roles in the industry.

What are internship roles in semiconductor packaging?

Internship roles in semiconductor packaging involve assisting with the design, development, and testing of packaging solutions for semiconductor devices, such as integrated circuits and microchips. Interns may work alongside engineers to learn about materials selection, thermal management, and reliability testing. These positions often include hands-on tasks in laboratories or manufacturing environments, as well as data analysis and documentation. The goal is to provide students with exposure to real-world packaging processes and industry standards while contributing to ongoing projects.

What is the difference between Internship Semiconductor Packaging vs Semiconductor Process Engineer?

AspectInternship Semiconductor PackagingSemiconductor Process Engineer
CredentialsTypically pursuing or recent graduate in engineering or related fieldBachelor's or master's in electrical, materials, or chemical engineering
Work EnvironmentInternship setting, hands-on lab and manufacturing environmentFull-time role in R&D or manufacturing facilities
Industry UsageEntry-level, training-focused position in semiconductor companiesDesign, develop, and optimize semiconductor manufacturing processes

In summary, an Internship Semiconductor Packaging provides hands-on training and experience in packaging processes, often for students or recent graduates. A Semiconductor Process Engineer is a full-time professional responsible for developing and improving manufacturing processes. While both roles are within the semiconductor industry, the internship is more educational and entry-level, whereas the process engineer role involves ongoing process optimization and technical expertise.

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What are the most commonly searched types of Semiconductor Packaging jobs? The most popular types of Semiconductor Packaging jobs are:
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Internship Semiconductor Packaging jobs near you
Infographic showing various Internship Semiconductor Packaging job openings in the United States as of May 2026, with employment types broken down into 15% Internship, 1% As Needed, 33% Full Time, 44% Part Time, 3% Temporary, and 4% Nights. Highlights an 54% Physical, 2% Hybrid, and 44% Remote job distribution, with an average salary of $33,957 per year, or $16.3 per hour.
Mechanical Design Engineer - Semiconductor Packaging

Mechanical Design Engineer - Semiconductor Packaging

Intel

Phoenix, AZ • On-site

$105.65K - $149.15K/yr

Full-time

Medical, Retirement, PTO

Posted 4 days ago

Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

8th of 137 rated electronics manufacturers

Job description

Job Details:Job Description: 

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

Job Summary:
We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role in designing and developing mechanical components and tooling required throughout the packaging and assembly lifecycle. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross-functionally and solving complex design problems with minimal supervision.

Key Responsibilities:
Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
Develop and maintain mechanical designs and detailed drawings for:
o Substrates
o Integrated Heat Spreaders (IHS)
o Stiffeners
o Overall package assemblies
Design process media trays used during various stages of the assembly process.
Collaborate closely with architecture, process, and assembly teams to ensure design intent and manufacturability.
Act as the single point of contact for all packaging mechanical design collateral needs.
Proactively identify and solve design and process issues, ensuring timely project execution.

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Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.

Minimum Skills and Qualifications:
US Citizenship required.
Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.

Bachelor's degree in mechanical engineering or in a STEM related field of study.

1+ years' experience with CAD tools such as SolidWorks, Siemens NX, and AutoCAD or similar 2D and 3D CAD software.
Preferred Skills:
Master's degree in mechanical engineering or in a STEM related field of study.
Solid mechanical design foundation and 3D spatial awareness.

Excellent communication and interpersonal skills for effective cross-functional collaboration.

Ability to interpret and generate technical drawings and specifications.

Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $105,650.00-149,150.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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