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Internship Semiconductor Packaging Jobs (NOW HIRING)

Fab2

Packaging Engineering Intern - Winter

Austin, TX · On-site

$108 - $126/hr

About the Role We're hiring Semiconductor Packaging Engineering Interns for the winter term. The internship begins in January, with a preferred commitment of 4 to 8 months. We are a small team ...

Atomic Semi

$108 - $126/hr

About the Role We're hiring Semiconductor Packaging Engineering Interns for the winter term. The internship begins in January, with a preferred commitment of 4 to 8 months. We are a small team ...

Socket.dev

IC Packaging Engineer - WLP

California, MO · On-site

$90 - $130/hr

MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling Internship or research experience with a ...

GlobalFoundries inc.

$85 - $146/hr

Prior related internship, co-op, research, or academic project experience in semiconductor packaging, silicon photonics, reliability engineering, failure analysis, materials characterization, thermal ...

Skyworks

$22.50 - $42/hr

This internship will focus on integrated cirucit (IC) packaging process flow and support the development and reliability assessment of advanced semiconductor packages through thermal and mechanical ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$85K - $162K/yr

This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

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Internship Semiconductor Packaging information

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$6

$16

$23

How much do internship semiconductor packaging jobs pay per hour?

As of Sep 6, 2026, the average hourly pay for internship semiconductor packaging in the United States is $16.33, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $19.23 per hour, depending on experience, location, and employer.

What are internship roles in semiconductor packaging?

Internship roles in semiconductor packaging involve assisting with the design, development, and testing of packaging solutions for semiconductor devices, such as integrated circuits and microchips. Interns may work alongside engineers to learn about materials selection, thermal management, and reliability testing. These positions often include hands-on tasks in laboratories or manufacturing environments, as well as data analysis and documentation. The goal is to provide students with exposure to real-world packaging processes and industry standards while contributing to ongoing projects.

What are the key skills and qualifications needed to thrive as an internship semiconductor packaging?

To thrive as an intern in semiconductor packaging, foundational knowledge in materials science, electronics, and engineering principles—typically from coursework in electrical or mechanical engineering—is essential. Familiarity with semiconductor design software (such as AutoCAD or SolidWorks), lab equipment, and basic data analysis tools is often required. Strong problem-solving, attention to detail, and effective communication skills set candidates apart in team-based, technical environments. These competencies are crucial for supporting complex manufacturing processes, ensuring quality, and contributing meaningfully to R&D projects.

What types of projects and hands-on experiences can I expect during an internship in semiconductor packaging?

As an intern in semiconductor packaging, you can expect to work on projects involving the design, assembly, and testing of semiconductor packages. Typical responsibilities may include assisting with process optimization, analyzing failure modes, and supporting engineers with data collection and analysis. You will likely collaborate with cross-functional teams in engineering, quality assurance, and manufacturing, gaining exposure to industry-standard tools and methodologies. This hands-on experience is valuable for understanding the full lifecycle of semiconductor devices and can provide a strong foundation for future roles in the industry.

What is the difference between Internship Semiconductor Packaging vs Semiconductor Process Engineer?

AspectInternship Semiconductor PackagingSemiconductor Process Engineer
CredentialsTypically pursuing or recent graduate in engineering or related fieldBachelor's or master's in electrical, materials, or chemical engineering
Work EnvironmentInternship setting, hands-on lab and manufacturing environmentFull-time role in R&D or manufacturing facilities
Industry UsageEntry-level, training-focused position in semiconductor companiesDesign, develop, and optimize semiconductor manufacturing processes

In summary, an Internship Semiconductor Packaging provides hands-on training and experience in packaging processes, often for students or recent graduates. A Semiconductor Process Engineer is a full-time professional responsible for developing and improving manufacturing processes. While both roles are within the semiconductor industry, the internship is more educational and entry-level, whereas the process engineer role involves ongoing process optimization and technical expertise.

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Internship Semiconductor Packaging jobs near you
Infographic showing various Internship Semiconductor Packaging job openings in the United States as of August 2026, with employment types broken down into 19% Internship, 75% Full Time, and 6% Part Time. Highlights an 100% In-person job distribution, with an average salary of $33,957 per year, or $16.3 per hour.

Packaging Module Development Engineer

Intel Corporation

Phoenix, AZ • On-site

Full-time

Medical, Retirement, PTO

This job post has expired 2 days ago. Applications are no longer accepted.

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

18th of 161 rated electronics manufacturers

Job description

Job Details:
Job Description:
Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life.
We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ. This role is focused on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing.
This role requires regular onsite presence to fulfill essential job responsibilities.
Key Responsibilities.
  • Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
  • Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
  • The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
  • The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
  • The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.
  • The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.

The ideal candidate should exhibit the following skills or behavioral traits:
  • Demonstrated ability to work seamlessly between experiments and simulations.

Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
  • PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics.
  • 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
  • 3+ years of experience with Finite Element Analysis tools
  • 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.

Preferred Qualifications:
  • Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma.
  • Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.
  • Experience with designing, planning and executing experiments, along with interpretation of results.
  • Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
  • Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
  • Programming/script development with artificial intelligence and machine learning concepts.
  • Previous related work experience in a semiconductor foundry preferred.

Join us at Intel and be part of a team that values innovation, collaboration, and making a meaningful impact. Apply today to embark on a rewarding career journey with us!
Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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