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Internship Semiconductor Packaging Jobs (NOW HIRING)

... the semiconductor packaging field OR Master's degree and/or PhD in ME and Material science or ... every stage - from internship to retirement and through life's most important moments. Our ...

... packaging Familiarity with semiconductor device structures, routing, or packaging design concepts Additional Information Paid internship position PARI is an EOE/AA employer. All individuals ...

This internship focuses on advancing shared program interests in advanced semiconductor packaging, heterogeneous integration, and advanced thermal cooling solutions relevant to next-generation ...

Optical Systems Engineer Internship

Milpitas, CA · On-site

$19.50 - $25.25/hr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... This internship is ideal for students interested in learning how complex measurement systems are ...

About Marvell Marvell's semiconductor solutions are the essential building blocks of the data ... every stage - from internship to retirement and through life's most important moments. Our ...

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Internship Semiconductor Packaging information

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How much do internship semiconductor packaging jobs pay per hour?

As of Jun 9, 2026, the average hourly pay for internship semiconductor packaging in the United States is $16.33, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $19.23 per hour, depending on experience, location, and employer.

What are internship roles in semiconductor packaging?

Internship roles in semiconductor packaging involve assisting with the design, development, and testing of packaging solutions for semiconductor devices, such as integrated circuits and microchips. Interns may work alongside engineers to learn about materials selection, thermal management, and reliability testing. These positions often include hands-on tasks in laboratories or manufacturing environments, as well as data analysis and documentation. The goal is to provide students with exposure to real-world packaging processes and industry standards while contributing to ongoing projects.

What types of projects and hands-on experiences can I expect during an internship in semiconductor packaging?

As an intern in semiconductor packaging, you can expect to work on projects involving the design, assembly, and testing of semiconductor packages. Typical responsibilities may include assisting with process optimization, analyzing failure modes, and supporting engineers with data collection and analysis. You will likely collaborate with cross-functional teams in engineering, quality assurance, and manufacturing, gaining exposure to industry-standard tools and methodologies. This hands-on experience is valuable for understanding the full lifecycle of semiconductor devices and can provide a strong foundation for future roles in the industry.

What is the difference between Internship Semiconductor Packaging vs Semiconductor Process Engineer?

AspectInternship Semiconductor PackagingSemiconductor Process Engineer
CredentialsTypically pursuing or recent graduate in engineering or related fieldBachelor's or master's in electrical, materials, or chemical engineering
Work EnvironmentInternship setting, hands-on lab and manufacturing environmentFull-time role in R&D or manufacturing facilities
Industry UsageEntry-level, training-focused position in semiconductor companiesDesign, develop, and optimize semiconductor manufacturing processes

In summary, an Internship Semiconductor Packaging provides hands-on training and experience in packaging processes, often for students or recent graduates. A Semiconductor Process Engineer is a full-time professional responsible for developing and improving manufacturing processes. While both roles are within the semiconductor industry, the internship is more educational and entry-level, whereas the process engineer role involves ongoing process optimization and technical expertise.

What are the key skills and qualifications needed to thrive as an Internship Semiconductor Packaging, and why are they important?

To thrive as an intern in semiconductor packaging, foundational knowledge in materials science, electronics, and engineering principles—typically from coursework in electrical or mechanical engineering—is essential. Familiarity with semiconductor design software (such as AutoCAD or SolidWorks), lab equipment, and basic data analysis tools is often required. Strong problem-solving, attention to detail, and effective communication skills set candidates apart in team-based, technical environments. These competencies are crucial for supporting complex manufacturing processes, ensuring quality, and contributing meaningfully to R&D projects.
More about Internship Semiconductor Packaging jobs
What cities are hiring for Internship Semiconductor Packaging jobs? Cities with the most Internship Semiconductor Packaging job openings:
What are the most commonly searched types of Semiconductor Packaging jobs? The most popular types of Semiconductor Packaging jobs are:
What states have the most Internship Semiconductor Packaging jobs? States with the most job openings for Internship Semiconductor Packaging jobs include:
Infographic showing various Internship Semiconductor Packaging job openings in the United States as of June 2026, with employment types broken down into 77% Full Time, 21% Part Time, and 2% Nights. Highlights an 85% Physical, 1% Hybrid, and 14% Remote job distribution, with an average salary of $33,957 per year, or $16.3 per hour.
Principal Package Engineer

Principal Package Engineer

Marvell

Santa Clara, CA

Full-time

Life, Retirement

Posted 6 days ago


Job description

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

The package engineering team drives semiconductor package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design that results in the delivery of engineering samples and a subsequent production ramp-up. There is the excitement of always working on new projects and cutting-edge technologies.

What You Can Expect

  • Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product.

  • Working closely with cross functional teams - BU, CE, QA and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality and reliability.

  • Perform package design review.

  • Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual.

  • Provide inputs to design guidelines and drive to implement the guidelines.

  • Achieve milestone dates for all NPI schedules.

  • Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues.

  • Work with procurement and suppliers on package cost analysis.

  • Provide inputs to the package technology roadmap.

  • Support new package and technology development.

  • Manage and mentor junior engineers if required

What We're Looking For

  • Bachelor's degree in ME and Material science or related fields and 10+ years of professional experience in the semiconductor packaging field OR Master's degree and/or PhD in ME and Material science or related fields and 7+ years of professional experience in the semiconductor packaging field.

  • Experience in substrate, RDL and assembly.

  • Experienced with flip-chip package development and substrate review.

  • Basic Cadence APD and AutoCAD skills.

  • Deep understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques.

  • The ideal candidate would be knowledgeable of 2D, 2.5D, 3D and wafer-level packaging.

  • Good communication skills that can enable the candidate to work well with internal cross functional teams and suppliers.

  • Good program management skills.

  • OSAT management experience is a plus.

  • Ability to work independently, provide leadership and to exercise discretion to solve complex problems.

  • Manager experience is a plus

Expected Base Pay Range (USD)

136,880 - 205,000, $ per annum

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life's most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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