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Internship Semiconductor Packaging Jobs (NOW HIRING)

Intel

Packaging Module Development Engineer

Phoenix, AZ

$85K - $162K/yr

This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

Apple

IC Packaging Engineer - WLP

Bodega Bay, CA

$129K - $225K/yr

... modeling Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab. Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D ...

PsiQuantum

Optical Packaging Engineer

Milpitas, CA · On-site

$150K - $194K/yr

... semiconductor packaging, photonics, optics, or advanced manufacturing environments (internships and research experience may be considered). * Basic understanding of optical alignment, fiber optics ...

PsiQuantum

Optical Packaging Engineer

Milpitas, CA

$150K - $194K/yr

... semiconductor packaging, photonics, optics, or advanced manufacturing environments (internships and research experience may be considered). * Basic understanding of optical alignment, fiber optics ...

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Internship Semiconductor Packaging information

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How much do internship semiconductor packaging jobs pay per hour?

As of Aug 17, 2026, the average hourly pay for internship semiconductor packaging in the United States is $16.33, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $19.23 per hour, depending on experience, location, and employer.

What are internship roles in semiconductor packaging?

Internship roles in semiconductor packaging involve assisting with the design, development, and testing of packaging solutions for semiconductor devices, such as integrated circuits and microchips. Interns may work alongside engineers to learn about materials selection, thermal management, and reliability testing. These positions often include hands-on tasks in laboratories or manufacturing environments, as well as data analysis and documentation. The goal is to provide students with exposure to real-world packaging processes and industry standards while contributing to ongoing projects.

What are the key skills and qualifications needed to thrive as an internship semiconductor packaging?

To thrive as an intern in semiconductor packaging, foundational knowledge in materials science, electronics, and engineering principles—typically from coursework in electrical or mechanical engineering—is essential. Familiarity with semiconductor design software (such as AutoCAD or SolidWorks), lab equipment, and basic data analysis tools is often required. Strong problem-solving, attention to detail, and effective communication skills set candidates apart in team-based, technical environments. These competencies are crucial for supporting complex manufacturing processes, ensuring quality, and contributing meaningfully to R&D projects.

What types of projects and hands-on experiences can I expect during an internship in semiconductor packaging?

As an intern in semiconductor packaging, you can expect to work on projects involving the design, assembly, and testing of semiconductor packages. Typical responsibilities may include assisting with process optimization, analyzing failure modes, and supporting engineers with data collection and analysis. You will likely collaborate with cross-functional teams in engineering, quality assurance, and manufacturing, gaining exposure to industry-standard tools and methodologies. This hands-on experience is valuable for understanding the full lifecycle of semiconductor devices and can provide a strong foundation for future roles in the industry.

What is the difference between Internship Semiconductor Packaging vs Semiconductor Process Engineer?

AspectInternship Semiconductor PackagingSemiconductor Process Engineer
CredentialsTypically pursuing or recent graduate in engineering or related fieldBachelor's or master's in electrical, materials, or chemical engineering
Work EnvironmentInternship setting, hands-on lab and manufacturing environmentFull-time role in R&D or manufacturing facilities
Industry UsageEntry-level, training-focused position in semiconductor companiesDesign, develop, and optimize semiconductor manufacturing processes

In summary, an Internship Semiconductor Packaging provides hands-on training and experience in packaging processes, often for students or recent graduates. A Semiconductor Process Engineer is a full-time professional responsible for developing and improving manufacturing processes. While both roles are within the semiconductor industry, the internship is more educational and entry-level, whereas the process engineer role involves ongoing process optimization and technical expertise.

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Internship Semiconductor Packaging jobs near you
Infographic showing various Internship Semiconductor Packaging job openings in the United States as of August 2026, with employment types broken down into 83% Full Time, 11% Part Time, 1% Temporary, 2% Contract, and 3% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $33,957 per year, or $16.3 per hour.

Silicon Packaging Process Engineer, Silicon Technology (Starlink)

SpaceX

Bastrop, TX • On-site

Full-time

Re-posted 2 hours ago

SpaceX rating

8.8

Company rating: 8.8 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

14th of 72 rated aerospace companies

Job description

SILICON PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK)

SpaceX is leveraging its experience building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world's largest satellite constellation, providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system - thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We've only begun to scratch the surface of Starlink's potential global impact. As we continue to upgrade and expand the constellation, we're looking for best-in-class engineers to join the team.

In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing advanced silicon packaging and assembly in-house for development and manufacturing. We are looking for hands-on, dynamic engineers with expertise in semiconductor packaging design, process development, equipment, and testing. You will assume full ownership of packaging products and process modules and take them from concept to mass production as we strive to make Starlink more affordable to those who need it most.

RESPONSIBILITIES:  

  • Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems
  • Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes
  • Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
  • Own packaging prototypes, product development, and release to production
  • Select equipment and material to meet quality, reliability, cost, yield, and production targets
  • Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
  • Cross-functional interface with silicon design, materials, thermal, systems, and production teams
  • Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond

BASIC QUALIFICATIONS: 

  • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline  
  • 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable)

PREFERRED SKILLS AND EXPERIENCE: 

  • Advanced technical degree
  • 3+ years industry experience with microelectronics packaging development
  • Hands-on packaging, PCB, PCBA, or SMT assembly experience
  • OSAT (outsource semiconductor assembly and test) experience

ADDITIONAL REQUIREMENTS:

  • Ability to work extended hours or weekends as needed for mission critical deadlines

What SpaceX employees say

Pay

Benefits

Hours and flexibility

Workplace

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About SpaceX

Sourced by ZipRecruiter

Industry

Aerospace product and parts manufacturing, data services, guided missile and space vehicle manufacturing and satellite telecommunications

Company size

1,001 - 5,000 Employees

Headquarters location

Hawthorne, CA, US

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