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Internship Semiconductor Packaging Jobs (NOW HIRING)

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Packaging Module Development Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ... within semiconductor or advanced manufacturing environments. - Strong experimental background ...

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Internship Semiconductor Packaging information

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How much do internship semiconductor packaging jobs pay per hour?

As of Jul 13, 2026, the average hourly pay for internship semiconductor packaging in the United States is $16.33, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $19.23 per hour, depending on experience, location, and employer.

What are internship roles in semiconductor packaging?

Internship roles in semiconductor packaging involve assisting with the design, development, and testing of packaging solutions for semiconductor devices, such as integrated circuits and microchips. Interns may work alongside engineers to learn about materials selection, thermal management, and reliability testing. These positions often include hands-on tasks in laboratories or manufacturing environments, as well as data analysis and documentation. The goal is to provide students with exposure to real-world packaging processes and industry standards while contributing to ongoing projects.

What types of projects and hands-on experiences can I expect during an internship in semiconductor packaging?

As an intern in semiconductor packaging, you can expect to work on projects involving the design, assembly, and testing of semiconductor packages. Typical responsibilities may include assisting with process optimization, analyzing failure modes, and supporting engineers with data collection and analysis. You will likely collaborate with cross-functional teams in engineering, quality assurance, and manufacturing, gaining exposure to industry-standard tools and methodologies. This hands-on experience is valuable for understanding the full lifecycle of semiconductor devices and can provide a strong foundation for future roles in the industry.

What is the difference between Internship Semiconductor Packaging vs Semiconductor Process Engineer?

AspectInternship Semiconductor PackagingSemiconductor Process Engineer
CredentialsTypically pursuing or recent graduate in engineering or related fieldBachelor's or master's in electrical, materials, or chemical engineering
Work EnvironmentInternship setting, hands-on lab and manufacturing environmentFull-time role in R&D or manufacturing facilities
Industry UsageEntry-level, training-focused position in semiconductor companiesDesign, develop, and optimize semiconductor manufacturing processes

In summary, an Internship Semiconductor Packaging provides hands-on training and experience in packaging processes, often for students or recent graduates. A Semiconductor Process Engineer is a full-time professional responsible for developing and improving manufacturing processes. While both roles are within the semiconductor industry, the internship is more educational and entry-level, whereas the process engineer role involves ongoing process optimization and technical expertise.

What are the key skills and qualifications needed to thrive as an Internship Semiconductor Packaging, and why are they important?

To thrive as an intern in semiconductor packaging, foundational knowledge in materials science, electronics, and engineering principles—typically from coursework in electrical or mechanical engineering—is essential. Familiarity with semiconductor design software (such as AutoCAD or SolidWorks), lab equipment, and basic data analysis tools is often required. Strong problem-solving, attention to detail, and effective communication skills set candidates apart in team-based, technical environments. These competencies are crucial for supporting complex manufacturing processes, ensuring quality, and contributing meaningfully to R&D projects.
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Internship Semiconductor Packaging jobs near you
Infographic showing various Internship Semiconductor Packaging job openings in the United States as of July 2026, with employment types broken down into 9% Internship, 1% As Needed, 68% Full Time, 20% Part Time, 1% Temporary, and 1% Contract. Highlights an 87% Physical, 1% Hybrid, and 12% Remote job distribution, with an average salary of $33,957 per year, or $16.3 per hour.
Program Management Intern - SiC Power Modules

Program Management Intern - SiC Power Modules

Navitas Semiconductor

Irvine, CA • On-site

$25 - $40/hr

Other

Posted 29 days ago

Job description

Job Purpose:

Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader driving innovation in gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification.

With more than 30 years of combined expertise in wide bandgap technologies, GaNFast™ power ICs integrate GaN power, drive, control, sensing, and protection, delivering faster power delivery, higher system density, and greater efficiency. GeneSiC™ high-voltage SiC devices leverage patented trench-assisted planar technology to provide industry-leading voltage capability, efficiency, and reliability for medium-voltage grid and infrastructure applications. 

We are seeking a high-performing graduate-level intern to join our Program Management team supporting the development of high-power SiC-based modules for AI infrastructure and electrification applications. The intern will take an active role in our New Product Introduction (NPI) process — coordinating cross-functional teams, tracking program milestones, and engaging directly with semiconductor suppliers to drive development projects to launch on time and within specification.

Key Responsibilities and Duties:

  • Lead and support NPI program management activities for SiC high-power module development programs targeting AI and electrification end markets.
  • Own and maintain detailed program schedules, milestone trackers, and risk registers to ensure programs launch on time and within technical specifications.
  • Coordinate and communicate with suppliers, manufacturing partners, and internal stakeholders to align on program requirements and deliverables.
  • Execute and refine the NPI process gate reviews — including design reviews, qualification milestones, and product release criteria.
  • Collaborate cross-functionally with R&D, applications engineering, operations, and quality teams to track action items and resolve program blockers.
  • Prepare executive program status reports, dashboards, and presentations for senior leadership review.
  • Support supplier development activities including monitoring qualification progress, tracking sample deliveries, and facilitating corrective action plans.
Minimum Qualifications
  • BS in Electrical Engineering (required); currently enrolled in or accepted to a graduate-level MS or PhD program in Electrical Engineering, Power Electronics, or closely related discipline.
  • Ability to communicate clearly with the internal team and external suppliers abroad. Professional, articulate speaking skills required.
  • Foundational knowledge of semiconductor device physics, power electronics, or semiconductor manufacturing processes.
  • Strong organizational and communication skills with demonstrated ability to manage multiple concurrent tasks and deadlines.
  • Proficiency in Microsoft Office Suite (Excel, PowerPoint, Project) and/or project management tools (e.g., Asana, Jira, Smartsheet).
  • Expert at using AI tools to assist in automating tasks and ideation (Copilot, Claude, PowerAutomate, PowerBI are preferred)
Preferred Qualifications
  • Prior internship, co-op, or research experience within the semiconductor, power electronics, or hardware product development industry.
  • Familiarity with Silicon Carbide (SiC) or Wide Bandgap (WBG) semiconductor technologies, process flows, or device characterization.
  • Exposure to NPI, stage-gate, or structured product development processes in a technology or hardware environment.
  • Understanding of power module packaging concepts (e.g., substrate types, thermal management, module assembly) for high-power applications.
  • Experience working in cross-functional or cross-cultural teams; prior exposure to Asia-Pacific supplier ecosystems is a plus.
  • Coursework or research in AI hardware, power conversion systems, or electrification platforms (EV, data center, renewable energy).

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