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Semiconductor Packaging Jobs (NOW HIRING)

Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities Lead equipment development activities, including pathfinding ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless ... Falcomm is seeking an IC Packaging Designer to support the development and implementation of ...

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless ... Falcomm is seeking an IC Packaging Designer to support the development and implementation of ...

... semiconductor packaging, materials, thermal, mechanical, or electrical modeling Deep experience in the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM ...

Senior IC Packaging Designer

Atlanta, GA

$98K - $104K/yr

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless ... Falcomm is seeking an IC Packaging Designer to support the development and implementation of ...

Minimum Qualifications Minimum requirement of a bachelors degree Preferred Qualifications MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials ...

Showing results 21-40

Semiconductor Packaging information

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$12

$18

$27

How much do semiconductor packaging jobs pay per hour?

As of Aug 6, 2026, the average hourly pay for semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.
More about Semiconductor Packaging jobs
What cities are hiring for Semiconductor Packaging jobs? Cities with the most Semiconductor Packaging job openings:
What are the most commonly searched types of Semiconductor Packaging jobs? The most popular types of Semiconductor Packaging jobs are:
What states have the most Semiconductor Packaging jobs? States with the most job openings for Semiconductor Packaging jobs include:
Infographic showing various Semiconductor Packaging job openings in the United States as of July 2026, with employment types broken down into 84% Full Time, 12% Part Time, 2% Contract, and 2% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Semiconductor Operations - Advanced SiP Packaging

Apple

Cupertino, CA

$175K - $263K/yr

Full-time

Medical, Dental, Retirement

Re-posted 11 days ago


Apple rating

8.0

Company rating: 8.0 out of 10

Based on 677 frontline employees who took The Breakroom Quiz

7th of 30 rated technology retailers


Job description

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there is no telling what you could accomplish.
The people here at Apple do not just create products - they create the kind of wonder that is revolutionizing entire industries. It is the diversity of those people and their ideas that inspires the innovation that runs through everything we do. Join Apple, and help us leave the world better than we found it.
Description
The Apple Semiconductor Operations team is looking for a motivated, highly technical Component SiP productization engineering focusing on product and process development, supplier readiness, and high-volume manufacturing quality.
This role will drive NPI execution, process bring-up, qualification readiness, and quality improvement for advanced SiP, RF, antenna, mmWave, wireless, and high-density module technologies.
The successful candidate will work with module integration suppliers, OSATs, sub-component vendors, PCB/substrate suppliers, and system integration sites. They will interface regularly with Engineering, Operations, Reliability, and Quality teams.","responsibilities":"Deliver high-density and high-performance SiP/module technologies within thermo-mechanical, performance, reliability, quality, cost, and form-factor constraints.
Support Advance Component SiP and system integration development for future products, including design rules, process bring-up, materials/process selection.
Drive quality readiness at vendor factories for development builds, risk ramp, and mass production.
Lead supplier readiness across NPI phases, including process BKM lock, build-exit criteria, factory audits, qualification status, and ramp-risk closure.
Resolve process, yield, reliability, and quality issues in product and manufacturing processes.
Use data analysis and failure analysis to identify gaps in component design, package architecture, process capability, inspection coverage, and test readiness.
Work with vendors and OEM/system integration sites to ensure compliance to Apple specifications and manufacturing requirements.
Ensure qualification and reliability activities at suppliers are in line with product and process requirements.
• Partner closely with component design, hardware engineering, reliability, PD FEA/simulation, operations, and quality teams.
• Provide routine status reporting to leadership and escalate technical, quality, and supplier execution issues when needed.
Preferred Qualifications
Hands-on experience with supplier manufacturing process control, quality systems, factory audits, and production readiness reviews.
Ability to take advanced packages or modules from concept and development builds to high-volume manufacturing.
Experience with RF, mmWave, antenna module, wireless module, high-density package, or advanced SiP architecture is a plus.
Ability to communicate technical risk clearly, drive issue closure, and provide concise executive-level updates.
Self-motivated, good communicator, and able to lead complex issues across global suppliers.
Minimum Qualifications
Strong SiP, semiconductor packaging, module assembly, or advanced packaging experience, including knowledge of assembly processes, materials, substrates, and package-level failure mechanisms.
5+ years relevant experience in product engineering, process engineering, semiconductor packaging, module productization, supplier quality, or high-volume manufacturing.
MS/BS in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or related technical discipline
Understanding of SPC, DOE, FMEA, JMP or equivalent data analysis tools, and factory quality metrics used to monitor production performance.
Strong understanding of reliability testing and failure mechanisms such as temperature cycling, board-level reliability, MSL, bHAST, CAF, warpage, solder fatigue, and substrate/material interactions.
Strong interpersonal skills to work with design, development, operations, reliability, quality, supplier engineering, and other cross-functional teams.
Pay & Benefits
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $175,500 and $263,800, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

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About Apple

Sourced by ZipRecruiter

Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Cupertino, CA, US

Year founded

1976