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Semiconductor Packaging Jobs (NOW HIRING)

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127.40K - $179.90K/yr

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

Intel

Packaging Module Development Engineer

Phoenix, AZ

$115.11K - $219.55K/yr

Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale. Managing equipment development, including pathfinding, new ...

Texas Instruments

Packaging Engineer

Dallas, TX · On-site

As a member of our Packaging team, you'll have the chance to interact with many product groups and ... TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127.40K - $179.90K/yr

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

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How much do semiconductor packaging jobs pay per hour?

As of May 31, 2026, the average hourly pay for semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in Semiconductor Packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a Semiconductor Packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are some semiconductor packaging companies?

Semiconductor packaging companies design and produce the protective casings and interconnections for semiconductor devices. Major firms in this industry include Amkor Technology, ASE Group, and JCET Group, which provide packaging solutions such as wire bonding, flip-chip, and system-in-package. Working in this field often requires knowledge of materials, cleanroom environments, and precision manufacturing processes.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

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Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in the United States as of May 2026, with employment types broken down into 76% Full Time, 4% Part Time, 12% Contract, and 8% Nights. Highlights an 98% Physical, and 2% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Semiconductor Sales & Marketing Manager

Absolics Inc

Covington, GA

$90K - $150K/yr

Other

Medical, Dental, Vision, Life, Retirement, PTO

Posted yesterday

Job description

Sales & Marketing Specialist/Manager - Semiconductor Packaging 7+ years | Covington, GA (Atlanta metro)

Absolics is a joint venture between SKC and Applied Materials, developing and commercializing glass substrate technology for next-generation AI/HPC semiconductor packaging. Leveraging superior performance, power efficiency, and thermal management of glass substrates, we work closely with the world's leading chip designers, hyperscalers, and AI semiconductor companies to shape the future of advanced packaging.

Role Overview A comprehensive commercial role spanning market intelligence, customer engagement, project management, and strategic documentation - directly supporting the commercialization of our glass substrate platform.

Key Responsibilities

  • Deliver quarterly market intelligence reports covering competitive landscape, customer trends, Packaging and HBM roadmaps, and supply chain dynamics
  • Develop competitive positioning of glass substrate technology against CoWoS-S/R/L, EMIB, and other advanced packaging solutions
  • Build and manage strategic relationships with key accounts (hyperscalers, AI semiconductor companies, etc.)
  • Represent Absolics at major industry conferences including ECTC, IMAPS, and SEMICON
  • Identify new project opportunities, develop proposals, and drive engagements through to signed agreements
  • Lead multiple concurrent customer projects managing timelines, milestones, and cross-functional coordination
  • Develop product roadmaps and go-to-market strategies in collaboration with engineering and operations
  • Demonstrate superior documentation capabilities across a broad range of materials - from executive reports and competitive analyses to strategic assessments and customer-facing presentations

Qualifications

  • 7+ years in semiconductor sales, marketing, business related role or product planning
  • Experience with advanced packaging technologies (CoWoS, EMIB, 2.5D/3D, glass substrates) preferred
  • Understanding of HBM technology and its integration with advanced packaging solutions
  • Background at AI semiconductor companies strongly preferred (NVIDIA, AMD, Apple, AWS, Broadcom, etc.)
  • Exceptional business writing skills - executive reports, strategic analyses, and customer presentations
  • Fluent English required, Korean a plus
  • Willingness to travel to customer sites (Silicon Valley, Austin, Phoenix, etc.) and industry conferences

SALARY:

  • $90,000 - $150,000

BENEFIT:

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

Apply