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Semiconductor Packaging Jobs (NOW HIRING)

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless ... Falcomm is seeking an IC Packaging Designer to support the development and implementation of ...

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Semiconductor Packaging information

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How much do semiconductor packaging jobs pay per hour?

As of Jun 25, 2026, the average hourly pay for semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What is packaging in the semiconductor industry?

In semiconductor packaging, the process involves enclosing and protecting semiconductor devices, such as integrated circuits, within a protective casing that provides electrical connections and mechanical support. Packaging ensures device reliability, facilitates heat dissipation, and allows integration into electronic systems. Semiconductor packaging requires precision, knowledge of materials, and often the use of specialized tools and cleanroom environments.

What are the key skills and qualifications needed to thrive in Semiconductor Packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

How much do semiconductor workers make?

Semiconductor packaging workers typically earn between $40,000 and $70,000 annually, depending on experience, location, and skill level. Entry-level positions may start lower, while experienced workers with specialized skills or certifications can earn higher wages. The role often requires knowledge of cleanroom environments and handling delicate components.

What are some semiconductor packaging companies?

Semiconductor packaging companies design and produce the protective casings and interconnections for semiconductor devices. Major firms in this industry include Amkor Technology, ASE Group, and JCET Group, which provide packaging solutions for integrated circuits used in electronics. Working in this field often requires knowledge of materials, cleanroom environments, and precision assembly techniques.

What are some of the common challenges faced in a Semiconductor Packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What does a semiconductor packaging engineer do?

A semiconductor packaging engineer designs and develops the protective enclosures for semiconductor devices, ensuring proper electrical connections, thermal management, and mechanical stability. They work with materials, manufacturing processes, and testing to optimize device performance and reliability, often using CAD tools and industry standards. This role requires knowledge of electronics, materials science, and manufacturing techniques.
More about Semiconductor Packaging jobs
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Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in the United States as of June 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $39,198 per year, or $18.8 per hour.
RF/Microelectronics Packaging Engineer with Security Clearance

RF/Microelectronics Packaging Engineer with Security Clearance

Mount Indie, LLC

Tempe, AZ • On-site

Other

Posted 9 days ago

Job description

We are seeking a Packaging Engineer to lead end-to-end packaging development for advanced microelectronic and RF communication products. This role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules. You will own the full packaging lifecycle-from concept and definition through design, modeling, testing, and production release-while partnering closely with cross-functional engineering teams and external vendors.

This position requires deep technical expertise in semiconductor packaging, strong problem-solving skills, and the ability to drive development in a fast-paced, high-reliability environment. Responsibilities Collaborate with product development teams (RFIC, MMIC, and module engineering) to design and deliver next-generation packaging solutions for RF communication systems Define package architectures, materials, and processes that meet performance, reliability, manufacturability, and cost requirements Lead packaging efforts for new product introductions (NPI) and new technology development Develop and manage packaging documentation, including statements of work (SOWs), drawings, and process flows Design and layout semiconductor packages such as QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP, and interposers Utilize modeling and simulation (thermal, mechanical, electrical) to ensure early-stage design success Provide technical oversight to external vendors and manufacturing partners throughout package fabrication Apply expertise in assembly processes (die attach, wirebond, bumping, overmolding) to guide design decisions and troubleshoot issues Evaluate and recommend packaging solutions through feasibility studies for new products Partner with engineering teams to optimize packaging for cost and performance Define and oversee reliability testing to ensure product robustness and compliance Coordinate cross-functional efforts across design, test, quality, manufacturing, and supply chain teams Identify and resolve material and process challenges during development Manage packaging projects using industry-standard tools and methodologies Contribute to long-term packaging technology roadmaps and support proposal efforts Qualifications 10+ years of experience in semiconductor packaging, including package engineering, assembly processes, and reliability Bachelor's degree in Electrical, Mechanical, Materials Engineering, or a related technical field Strong understanding of microelectronic packaging, including mechanical, electrical, and thermal performance considerations Solid foundation in heat transfer and material properties Experience supporting RFIC, millimeter wave, SiP, or module-based products Hands-on experience with package design technologies such as QFN, SiP, BGA, WL-CSP, Flip Chip, bumping, or FO-WLP Knowledge of semiconductor assembly processes, including die prep, die attach, wirebonding, flip chip, and SMT Familiarity with interconnect reliability testing (e.g., daisy chain, CPI, BLR) Understanding of metallization schemes for laminates, interposers, and SMT Experience with statistical analysis and design of experiments (DOE) Ability to operate independently and drive technical decisions in ambiguous environments Strong communication and collaboration skills across cross-functional teams Experience translating system or IC requirements into packaging solutions Additional Requirements U.S. Citizenship required Ability to travel up to 10%

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