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Semiconductor Packaging Jobs in California (NOW HIRING)

Aptino

Senior Semiconductor Packaging Engineer

Morgan Hill, CA · On-site

$119K - $163K/yr

Senior Semiconductor Packaging Engineer 📍 Morgan Hill, CA -- Onsite 💼 Full-Time | Direct Hire We are looking for an experienced Semiconductor Packaging Engineer to support the development and ...

New

Apple

IC Packaging Engineer - WLP

San Francisco, CA · On-site

... semiconductor packaging, materials, thermal, mechanical, or electrical modeling Deep experience in ... the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM ...

Apple

IC Packaging Engineer - WLP

Bodega Bay, CA

$184K - $324K/yr

... semiconductor packaging, materials, thermal, mechanical, or electrical modeling Deep experience in the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM ...

Apple

IC Packaging Engineer - WLP

San Francisco, CA · On-site

Minimum Qualifications Minimum requirement of a bachelors degree Preferred Qualifications MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials ...

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All JobsSemiconductor Packaging JobsSemiconductor Packaging Jobs in California

Semiconductor Packaging information

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$12

$18

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How much do semiconductor packaging jobs pay per hour?

As of Aug 19, 2026, the average hourly pay for semiconductor packaging in California is $18.60, according to ZipRecruiter salary data. Most workers in this role earn between $16.15 and $19.71 per hour, depending on experience, location, and employer.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

Is it hard to get a job in semiconductor packaging?

Securing a job in semiconductor packaging can be competitive, but candidates with relevant technical skills, such as knowledge of cleanroom environments, soldering, and inspection tools, have good opportunities. Entry-level positions may require some training or certifications, but experience with industry-standard processes can improve job prospects.

What are the most commonly searched types of Semiconductor Packaging jobs in California?

The most popular types of Semiconductor Packaging jobs in California are:

What are popular job titles related to Semiconductor Packaging jobs in California?

For Semiconductor Packaging jobs in California, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging jobs in California look for?

The top searched job categories for Semiconductor Packaging jobs in California are:

What cities in California are hiring for Semiconductor Packaging jobs?

Cities in California with the most Semiconductor Packaging job openings:

Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in California as of August 2026, with employment types broken down into 75% Full Time, and 25% Contract. Highlights an 100% In-person job distribution, with an average salary of $38,685 per year, or $18.6 per hour.

Senior Semiconductor Packaging Engineer

Aptino

Morgan Hill, CA • On-site

$119K - $163K/yr

Other

Posted 2 days ago

New

Job description

🚨 Hiring: Senior Semiconductor Packaging Engineer

📍 Morgan Hill, CA — Onsite
💼 Full-Time | Direct Hire

We are looking for an experienced Semiconductor Packaging Engineer to support the development and manufacturing of advanced semiconductor products. This is a hands-on engineering opportunity for someone with strong experience in die attach, semiconductor packaging, and process/equipment development.

🔧 What You’ll Do
  • Develop and improve semiconductor packaging and assembly processes.
  • Work on die attach/die bonding processes and equipment.
  • Develop process methods, select materials, and identify opportunities to improve manufacturability.
  • Work with equipment vendors and internal engineering/manufacturing teams to install, qualify, troubleshoot, and optimize equipment.
  • Support new product introduction (NPI) and transition new processes into manufacturing.
  • Develop and qualify tooling, equipment, and materials.
  • Troubleshoot manufacturing and process issues and identify root causes.
  • Perform process optimization, DOE, FMEA, SPC, and other engineering analyses.
  • Support reliability testing, failure analysis, and corrective actions.
  • Evaluate process risks and implement appropriate mitigation strategies.
  • Drive continuous improvements related to quality, yield, reliability, and cost.
  • Prepare technical documentation and communicate project status, findings, and recommendations to engineering and management teams.
🎯 What We’re Looking For
  • Bachelor’s or Master’s degree in Mechanical Engineering, Materials Engineering, Industrial Engineering, Applied Science, or a related technical field.
  • Experience in semiconductor packaging, package development, process development, or semiconductor manufacturing.
  • Strong hands-on experience with die attach / die bonding.
  • Datacon equipment experience is required, preferably Datacon EVO.
  • Experience working with semiconductor assembly or packaging equipment.
  • Strong problem-solving and troubleshooting skills.
  • Experience with engineering methodologies such as DOE, FMEA/PFMEA, SPC, 8D, Pareto analysis, or control charts is highly desirable.
  • Understanding of semiconductor reliability, materials, failure analysis, or qualification processes is a plus.
  • RF/RF Power experience is a plus but not required.
  • Experience with high-volume manufacturing is preferred.
  • Strong communication, documentation, and project coordination skills.
⭐ Important

We are open to candidates who may not have extensive RF Power or assembly-process experience. Strong semiconductor package/process development and die attach experience are more important & Datacon experience is a must.

If you have experience in semiconductor packaging, die attach, Datacon equipment, or package/process development, please reach out or send me your resume.

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