ZipRecruiter

Log In

1

Semiconductor Packaging Jobs in California (NOW HIRING)

Apple

IC Packaging Engineer - WLP

San Francisco, CA · On-site

... semiconductor packaging, materials, thermal, mechanical, or electrical modeling Deep experience in ... the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM ...

Apple

IC Packaging Engineer - WLP

Bodega Bay, CA

$184K - $324K/yr

  • Medical

  • Dental

  • Retirement

... semiconductor packaging, materials, thermal, mechanical, or electrical modeling Deep experience in the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM ...

Apple

IC Packaging Engineer - WLP

San Francisco, CA · On-site

Minimum Qualifications Minimum requirement of a bachelors degree Preferred Qualifications MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials ...

Altera

Senior Package Reliability Engineer

San Jose, CA

$166K - $240K/yr

Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field with 8+ years of experience in semiconductor package thermal and thermomechanical ...

Cspeed

FEA Packaging Engineer

Palo Alto, CA · On-site

Cspeed IO is developing next-generation optical semiconductor solutions for the AI infrastructure ... The analysis supports package architecture decisions and qualification. Temperature governs optical ...

next page

Showing results 1-20

All JobsSemiconductor Packaging JobsSemiconductor Packaging Jobs in California

Semiconductor Packaging information

See California salary details

$12

$18

$26

How much do semiconductor packaging jobs pay per hour?

As of Aug 15, 2026, the average hourly pay for semiconductor packaging in California is $18.60, according to ZipRecruiter salary data. Most workers in this role earn between $16.15 and $19.71 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What are the most commonly searched types of Semiconductor Packaging jobs in California?

The most popular types of Semiconductor Packaging jobs in California are:

What are popular job titles related to Semiconductor Packaging jobs in California?

For Semiconductor Packaging jobs in California, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging jobs in California look for?

The top searched job categories for Semiconductor Packaging jobs in California are:

What cities in California are hiring for Semiconductor Packaging jobs?

Cities in California with the most Semiconductor Packaging job openings:

Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in California as of August 2026, with employment types broken down into 75% Full Time, and 25% Contract. Highlights an 100% In-person job distribution, with an average salary of $38,685 per year, or $18.6 per hour.

Semiconductor Packaging Engineer

SAAZ Micro Inc

Camarillo, CA • On-site

Full-time

Posted 4 days ago

Job description

The successful applicant willbe responsible formechanical engineering, including mechanical design, assembly process development and implementation and packagingof infrared focal plane arrays,for visible and infrared sensors


Key Responsibilities:

  • Work in mechanical and electrical subsystems and integrate them into a larger system
  • Perform process related activities, such as process development and yield improvement activities.
  • Assemble optoelectronic components of FPAs into final device packaging including die attach, wire bonding, solder, inspect and test
  • Perform hands-on work on mechanical and electrical systems and components
  • Use hand tools to perform integration and assembly tasks in a laboratory environment
  • Set up andoperatetest equipment to verify, evaluate, and troubleshoot systems and components
  • Perform electrical characterization of components and integrated assemblies
  • Designfixturing, assembly aids, and support equipment
  • Read,understandandutilizeengineering documentationincluding: drawings, assembly/process instructions, block diagrams, schematic diagrams, and bills of material
  • Provide data analysis and status reporting to technical staff and leadership
  • Support maintenance of lab instrumentation

Desired Qualifications:

  • Experience in a laboratory or manufacturing environment involving assembly, integration, test and troubleshooting of visible and IR cameras and FPAs
  • Experience with optoelectronic packaging technology and integration techniques
  • Understanding and application of basic electrical and mechanical engineering concepts
  • Ability to function safely in a laboratory environment performing assembly, integration, test, and troubleshooting tasks
  • Ability to follow formal and informal assembly and integration processes
  • Proficiencywith Microsoft Office tools (Word, Excel, and PowerPoint) and ability to create charts and communicate clearly
  • Experience with AutoCAD design,SolidWorksor other design software
  • Possess problem solving skills, good mechanical aptitude, strong organizational skills, and the ability to work effectively with others and individually
  • Understanding of mechanical and electrical assembly techniques
  • Exceptional time management and organizational skills
  • Strong oral and written communication skills with a strong attention to detail, and excellent documentation capability
  • Candidate should be enthusiastic and highly self-motivated
  • Ability to adapt to a flexible and changing schedule

Success Metrics:

  • Mechanical designs released on timeand without errors
  • Fixture/tooling designs completed on schedule
  • Assembly process development milestones completed
  • Packaging process documentation completed
  • Documentation quality
  • Demonstrate good lab safety,cleanroomand ESD rule compliance

Apply