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Tapeout Design Engineer Jobs in California (NOW HIRING)

Astera Labs

Tech Lead Design Engineer

San Jose, CA · On-site

$185K - $240K/yr

Drive structured, data-driven design decisions in support of aggressive tapeout schedules Basic Qualifications * Bachelor's degree in Electrical Engineering, Computer Engineering, or related field ...

OMNIVISION

Analog Design Engineer

Santa Clara, CA · On-site

Participate in design reviews, tapeout signoff, and lab characterization, contributing to silicon bring-up and performance optimization. Requirements: Master's degree in Electrical Engineering ...

OMNIVISION

Analog Design Engineer

Santa Clara, CA · On-site

$156K - $160K/yr

... in design reviews, tapeout signoff, and lab characterization, contributing to silicon bring-up and performance optimization. Requirements: Master's degree in Electrical Engineering, Computer ...

OMNIVISION

Analog Design Engineer

Santa Clara, CA · On-site

$156K - $160K/yr

... in design reviews, tapeout signoff, and lab characterization, contributing to silicon bring-up and performance optimization. Requirements: Master's degree in Electrical Engineering, Computer ...

OMNIVISION

SoC Design Engineer

Santa Clara, CA · On-site

$156K - $160K/yr

SoC Design Engineer Job Duties: Be responsible for digital design of ASIC cores within image sensor ... Full-chip integration and verification for tapeout. Annual base salary for this role in California ...

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Tapeout Design Engineer information

What is a tapeout design engineer?

Tapeout Design Engineers are professionals responsible for finalizing the layout and design of integrated circuits (ICs) before manufacturing. They ensure that all design specifications are met, and that the chip layout is error-free and ready for fabrication. Their work involves collaborating with design, verification, and foundry teams to deliver a manufacturable design, often using tools for physical verification, design rule checking, and layout-versus-schematic checks. This role is critical in the semiconductor industry, as any errors at tapeout can result in costly manufacturing delays. Tapeout Design Engineers play a key role in bringing new microchips from concept to production.

What are the key skills and qualifications needed to thrive as a tapeout design engineer?

To thrive as a Tapeout Design Engineer, you need a solid background in semiconductor physics, digital/analog circuit design, and a relevant engineering degree. Proficiency with EDA tools such as Cadence, Synopsys, and experience with physical verification, DRC/LVS checks, and scripting languages like Python or TCL are typically required. Strong attention to detail, problem-solving skills, and effective communication are valuable soft skills in this role. These skills and qualities are crucial for ensuring error-free silicon fabrication, efficient workflow, and successful collaboration across engineering teams.

What are some common challenges tapeout design engineers face during the tapeout process, and how can they be addressed?

Tapeout Design Engineers often encounter tight deadlines, last-minute design changes, and the need to coordinate between multiple teams such as layout, verification, and fabrication. Addressing these challenges typically involves proactive communication, thorough planning, and the use of automated verification tools to catch errors early. Effective collaboration and robust documentation help ensure that any issues are quickly identified and resolved, minimizing the risk of costly delays or rework in the fabrication stage.

What is the difference between Tapeout Design Engineer vs ASIC Design Engineer?

AspectTapeout Design EngineerASIC Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering or related field; knowledge of EDA toolsBachelor's or Master's in Electrical Engineering or related field; strong digital design skills
Work EnvironmentSemiconductor companies, chip design firms, EDA tool providersSemiconductor companies, integrated circuit design firms
Industry UsageFocuses on final chip layout and manufacturing readinessDesigns the digital architecture and logic of chips

While both roles require a background in electrical engineering and familiarity with EDA tools, a Tapeout Design Engineer specializes in preparing the final chip layout for manufacturing, ensuring design rules are met. An ASIC Design Engineer focuses on creating the digital logic and architecture of integrated circuits. The roles often collaborate but differ mainly in their stage of the design process and specific responsibilities.

What are popular job titles related to Tapeout Design Engineer jobs in California?

For Tapeout Design Engineer jobs in California, the most frequently searched job titles are:

What job categories do people searching Tapeout Design Engineer jobs in California look for?

The top searched job categories for Tapeout Design Engineer jobs in California are:

What cities in California are hiring for Tapeout Design Engineer jobs?

Cities in California with the most Tapeout Design Engineer job openings:

Tapeout Design Engineer jobs near you
Infographic showing various Tapeout Design Engineer job openings in California as of August 2026, with employment types broken down into 91% Full Time, 6% Part Time, and 3% Contract. Highlights an 82% Physical, 5% Hybrid, and 13% Remote job distribution.

Principal Physical Design Engineer

Celero Communications, Inc.

Irvine, CA

$200K - $300K/yr

Full-time

Posted 3 days ago

New

Job description

Principal Physical Design Engineer
Core Responsibilities
• RTL-to-GDSII Execution: Own physical implementation of System-on-Chips (SoCs) or complex digital blocks.
• Design Optimization: Manage floor-planning, bump planning, power grid design, and clock tree synthesis (CTS) to optimize chip performance.
• Design Convergence: Resolve timing, congestions, EM/IR issues together with Frontend Designers
• Signoff & Verification: Run Static Timing Analysis (STA) and physical verification. Fix Design Rule Checking (DRC) and Layout Versus Schematic (LVS) violations.
• Methodology Development: Drive automation and improve flow robustness using scripting languages like Tcl, Python, or Perl.
• Cross-Functional Leadership: Partner with architects, logic designers, and analog design team for tapeout readiness. 
Key Qualifications
• Experience: 7+ to 15+ years of relevant ASIC physical design experience (depending on degree level).
• Process Knowledge: Deep tapeout experience in advanced technology nodes (e.g., 7nm, 5nm, 3nm).
• Tool Mastery: Advanced proficiency with industry-standard EDA tools from vendors like Cadence (e.g., Innovus, , Tempus, Voltus, Pegasus, Calibre).
• Technical Concepts: Expertise in physically aware synthesis, power domain analysis, and Electromigration/IR-drop (EM/IR) cleanup.
Annual Base Salary Range: $200,000 to $300,000 (The final offer will be determined based on job-related skills, experience, qualifications, and location.)