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Tapeout Design Engineer Jobs (NOW HIRING)

Violet Ink

Physical Design Engineer

San Jose, CA

$159K - $164K/yr

Physical Design Engineer / Staff Engineer Location : San Jose CA Contract More than 12 months ... Candidates should have multiple full-cycle tapeouts and strong experience in signoff-to-tapeout ...

Talent 101, Inc.

Physical Design Engineer

Frisco, TX · On-site

$127K - $131K/yr

About Talent 101 Inc Talent 101 is an Engineering and IT services provider, with clients that range ... Deliver signoff reports and support final tapeout package creation * 5+ years' Physical Design ...

OMNIVISION

Analog Design Engineer

Santa Clara, CA

... in design reviews, tapeout signoff, and lab characterization, contributing to silicon bring-up and performance optimization. Requirements: Master's degree in Electrical Engineering, Computer ...

OMNIVISION

Analog Design Engineer

Santa Clara, CA

$156K - $160K/yr

... in design reviews, tapeout signoff, and lab characterization, contributing to silicon bring-up and performance optimization. Requirements: Master's degree in Electrical Engineering, Computer ...

OMNIVISION

Analog Design Engineer

Santa Clara, CA · On-site

$156K - $160K/yr

... in design reviews, tapeout signoff, and lab characterization, contributing to silicon bring-up and performance optimization. Requirements: Master's degree in Electrical Engineering, Computer ...

OMNIVISION

SoC Design Engineer

Santa Clara, CA · On-site

$156K - $160K/yr

SoC Design Engineer Job Duties: Be responsible for digital design of ASIC cores within image sensor ... Full-chip integration and verification for tapeout. Annual base salary for this role in California ...

OMNIVISION

SoC Design Engineer

Santa Clara, CA · On-site

SoC Design Engineer Job Duties: Be responsible for digital design of ASIC cores within image sensor ... Full-chip integration and verification for tapeout. Annual base salary for this role in California ...

OmniVision Technologies

SoC Design Engineer

Santa Clara, CA · On-site

$156K - $160K/yr

SoC Design Engineer Job Duties: Be responsible for digital design of ASIC cores within image sensor ... Full-chip integration and verification for tapeout. Annual base salary for this role in California ...

OMNIVISION

SoC Design Engineer

Santa Clara, CA

$156K - $160K/yr

SoC Design Engineer Job Duties: Be responsible for digital design of ASIC cores within image sensor ... Full-chip integration and verification for tapeout. Annual base salary for this role in California ...

onsemi

Design Engineer

Scottsdale, AZ

As a Principal Design Engineer located in Scottsdale, Arizona, you will have the opportunity to ... Highly skilled in Cadence design tools for schematic capture, simulations, DRC, LVS for tapeout.

The PJF Group

Physical Design Engineer

Bodega Bay, CA · On-site

$180K - $230K/yr

We're looking for a hands-on Physical Design Engineer to support complex SoC projects for our ... Will work of full project lifecycle from inception to tapeout. Qualifications: * BSEE with 5+ years ...

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All JobsTapeout Design Engineer Jobs

Tapeout Design Engineer information

See salary details

$40.5K

$88.2K

$158.5K

How much do tapeout design engineer jobs pay per year?

As of Jun 19, 2026, the average yearly pay for tapeout design engineer in the United States is $88,150.00, according to ZipRecruiter salary data. Most workers in this role earn between $68,000.00 and $98,500.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Tapeout Design Engineer, and why are they important?

To thrive as a Tapeout Design Engineer, you need a solid background in semiconductor physics, digital/analog circuit design, and a relevant engineering degree. Proficiency with EDA tools such as Cadence, Synopsys, and experience with physical verification, DRC/LVS checks, and scripting languages like Python or TCL are typically required. Strong attention to detail, problem-solving skills, and effective communication are valuable soft skills in this role. These skills and qualities are crucial for ensuring error-free silicon fabrication, efficient workflow, and successful collaboration across engineering teams.

What are Tapeout Design Engineers?

Tapeout Design Engineers are professionals responsible for finalizing the layout and design of integrated circuits (ICs) before manufacturing. They ensure that all design specifications are met, and that the chip layout is error-free and ready for fabrication. Their work involves collaborating with design, verification, and foundry teams to deliver a manufacturable design, often using tools for physical verification, design rule checking, and layout-versus-schematic checks. This role is critical in the semiconductor industry, as any errors at tapeout can result in costly manufacturing delays. Tapeout Design Engineers play a key role in bringing new microchips from concept to production.

What is the difference between Tapeout Design Engineer vs ASIC Design Engineer?

AspectTapeout Design EngineerASIC Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering or related field; knowledge of EDA toolsBachelor's or Master's in Electrical Engineering or related field; strong digital design skills
Work EnvironmentSemiconductor companies, chip design firms, EDA tool providersSemiconductor companies, integrated circuit design firms
Industry UsageFocuses on final chip layout and manufacturing readinessDesigns the digital architecture and logic of chips

While both roles require a background in electrical engineering and familiarity with EDA tools, a Tapeout Design Engineer specializes in preparing the final chip layout for manufacturing, ensuring design rules are met. An ASIC Design Engineer focuses on creating the digital logic and architecture of integrated circuits. The roles often collaborate but differ mainly in their stage of the design process and specific responsibilities.

What are some common challenges Tapeout Design Engineers face during the tapeout process, and how can they be addressed?

Tapeout Design Engineers often encounter tight deadlines, last-minute design changes, and the need to coordinate between multiple teams such as layout, verification, and fabrication. Addressing these challenges typically involves proactive communication, thorough planning, and the use of automated verification tools to catch errors early. Effective collaboration and robust documentation help ensure that any issues are quickly identified and resolved, minimizing the risk of costly delays or rework in the fabrication stage.
More about Tapeout Design Engineer jobs
What cities are hiring for Tapeout Design Engineer jobs? Cities with the most Tapeout Design Engineer job openings:
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Tapeout Design Engineer jobs near you
Infographic showing various Tapeout Design Engineer job openings in the United States as of June 2026, with employment types broken down into 67% Full Time, and 33% Temporary. Highlights an 100% In-person job distribution, with an average salary of $88,150 per year, or $42.4 per hour.
Physical Design Engineer

Physical Design Engineer

Violet Ink

San Jose, CA

$159K - $164K/yr

Other

Posted 28 days ago

Job description

Position: Physical Design Engineer / Staff Engineer

Location : San Jose CA

Contract More than 12 months

Relocation consultants are also considerable.. 

Job Responsibilities:

We are seeking experienced Physical Design Engineers with expertise in top-level signoff for complex SoCs on advanced nodes (7nm/5nm/3nm). Candidates should have multiple full-cycle tapeouts and strong experience in signoff-to-tapeout closure.

Key Responsibilities:

  • Drive full-chip/top-level signoff activities
  • Collaborate with RTL, PD, STA, EMIR, and Foundry teams
  • Resolve timing, power, clocking, and reliability challenges
  • Improve PPA and signoff turnaround time
  • Support independent tapeout closure

Specialized Expertise in One or More Areas:

  • EMIR / Power Integrity (RedHawk-SC, Voltus)
  • Timing & STA (PrimeTime/PT-SI, Tempus, MMMC)
  • Clock Distribution / CTS (Innovus, ICC2, H-Tree, Mesh)

 

Requirements:

  • 8+ years in Physical Design / Signoff
  • Hands-on experience with 7nm/5nm/3nm tapeouts
  • Strong knowledge of OCV, AOCV/POCV, STA methodologies
  • Scripting skills in Tcl/Python/Perl
  • Experience with HPC, AI accelerators, or large-scale SoCs preferred
  • Exposure to TSMC/Samsung/Intel signoff methodologies is a plus

Apply