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Tapeout Design Engineer Jobs (NOW HIRING)

Physical Design Engineer

Bodega Bay, CA

$161.40K - $166.10K/yr

We're looking for a hands-on Physical Design Engineer to support complex SoC projects for our ... Will work of full project lifecycle from inception to tapeout. Qualifications: * BSEE with 5+ years ...

... to tapeout. * Have experience with timing fixes, area and power optimizations, and resolving ... Serve as the responsible engineer for at least one critical design block, including architecture ...

Circuits Physical Design Engineer

Beaverton, OR · On-site

$141.50K - $145.70K/yr

As part of our Digital Design Engineering group, you'll take imaginative and revolutionary ideas ... Familiar with tapeout of partitions and Verification Flows like LEQ, IR/EM, Timing and DFM closure ...

Tapeout + productization experience STA Engineer * SoC-level timing analysis & closure * PrimeTime, Tempus, or similar Physical Design Engineer * Floorplanning, CTS, routing, signoff * Timing ...

... quality design. Ability to work well with others and a belief that engineering is a team sport ... Background of successful CPU development from architecture through tapeout. MS/ PhD degree in EE ...

Staff Physical Design Engineer, HBM

Richardson, TX

$123.50K - $127.10K/yr

You'll shape physical architecture and execution from early design through tapeout, with a direct ... Mentor engineers and represent physical design in tapeout reviews and executivelevel technical ...

... design. • Ability to work well with others and a belief that engineering is a team sport. • ... tapeout. • MS/ PhD degree in EE, CE, CS or a related technical discipline, or equivalent ...

SoC Physical Design Engineer, STA/Timing

Austin, TX

$134.80K - $138.80K/yr

... tapeout) for a highly complex SOC using state of the art process technology. Description - Work ... Experience with large design STA and/or Timing Closure. Programming skills with Perl and TCL.

SoC Physical Design Engineer, STA/Timing

Beaverton, OR · On-site

$141.50K - $145.70K/yr

... tapeout) for a highly complex SoC using state of the art process technology. - Work with design ... Good programming skills with Perl and TCL.Experience with large design STA and Timing Closure.

SoC Physical Design Engineer, STA/Timing

San Diego, CA · On-site

$144.40K - $148.60K/yr

... tapeout) for a highly complex SOC using state of the art process technology. - Work with design ... Programming skills with Perl and TCL. Hands-on experience in STA.Familiar with important aspects of ...

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Tapeout Design Engineer information

See salary details

$40.5K

$88.2K

$158.5K

How much do tapeout design engineer jobs pay per year?

As of Jun 1, 2026, the average yearly pay for tapeout design engineer in the United States is $88,150.00, according to ZipRecruiter salary data. Most workers in this role earn between $68,000.00 and $98,500.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Tapeout Design Engineer, and why are they important?

To thrive as a Tapeout Design Engineer, you need a solid background in semiconductor physics, digital/analog circuit design, and a relevant engineering degree. Proficiency with EDA tools such as Cadence, Synopsys, and experience with physical verification, DRC/LVS checks, and scripting languages like Python or TCL are typically required. Strong attention to detail, problem-solving skills, and effective communication are valuable soft skills in this role. These skills and qualities are crucial for ensuring error-free silicon fabrication, efficient workflow, and successful collaboration across engineering teams.

What are some common challenges Tapeout Design Engineers face during the tapeout process, and how can they be addressed?

Tapeout Design Engineers often encounter tight deadlines, last-minute design changes, and the need to coordinate between multiple teams such as layout, verification, and fabrication. Addressing these challenges typically involves proactive communication, thorough planning, and the use of automated verification tools to catch errors early. Effective collaboration and robust documentation help ensure that any issues are quickly identified and resolved, minimizing the risk of costly delays or rework in the fabrication stage.

What are Tapeout Design Engineers?

Tapeout Design Engineers are professionals responsible for finalizing the layout and design of integrated circuits (ICs) before manufacturing. They ensure that all design specifications are met, and that the chip layout is error-free and ready for fabrication. Their work involves collaborating with design, verification, and foundry teams to deliver a manufacturable design, often using tools for physical verification, design rule checking, and layout-versus-schematic checks. This role is critical in the semiconductor industry, as any errors at tapeout can result in costly manufacturing delays. Tapeout Design Engineers play a key role in bringing new microchips from concept to production.

What is the difference between Tapeout Design Engineer vs ASIC Design Engineer?

AspectTapeout Design EngineerASIC Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering or related field; knowledge of EDA toolsBachelor's or Master's in Electrical Engineering or related field; strong digital design skills
Work EnvironmentSemiconductor companies, chip design firms, EDA tool providersSemiconductor companies, integrated circuit design firms
Industry UsageFocuses on final chip layout and manufacturing readinessDesigns the digital architecture and logic of chips

While both roles require a background in electrical engineering and familiarity with EDA tools, a Tapeout Design Engineer specializes in preparing the final chip layout for manufacturing, ensuring design rules are met. An ASIC Design Engineer focuses on creating the digital logic and architecture of integrated circuits. The roles often collaborate but differ mainly in their stage of the design process and specific responsibilities.

More about Tapeout Design Engineer jobs
What cities are hiring for Tapeout Design Engineer jobs? Cities with the most Tapeout Design Engineer job openings:
What states have the most Tapeout Design Engineer jobs? States with the most job openings for Tapeout Design Engineer jobs include:
Director-Analog Design & Infrastructure Design Automation

Director-Analog Design & Infrastructure Design Automation

Intel

Austin, TX

$164.50K/yr

Full-time

Medical, Retirement, PTO

Posted 28 days ago


Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

8th of 137 rated electronics manufacturers


Job description

Job Details:Job Description: 

We are seeking an experienced Director of Analog Design & Infrastructure Design Automation to lead the development, deployment, and governance of analog/mixed-signal design environments and CAD infrastructure. This role owns EDA tool ecosystems, PDK integration, compute infrastructure, design data governance, and tapeout manifest management to ensure high productivity, reproducibility, and audit readiness across silicon programs.

The ideal candidate combines deep analog/mixed-signal design flow expertise with strong infrastructure leadership and disciplined configuration/data management practices.

Key Responsibilities

1. Analog Design Environment & Flow Management

  • Own and maintain analog and mixed-signal design flows using platforms such as Virtuoso and Custom Compiler.
  • Manage PDK integration, validation, and controlled release in collaboration with foundries.
  • Develop and maintain schematic, layout, verification, and extraction flows (LVS, DRC, PEX, EM/IR).
  • Support simulation environments including Spectre, HSPICE, Monte Carlo, corner, and reliability analysis.
  • Drive automation and methodology improvements to reduce turnaround time and increase design robustness.

2. Infrastructure & Compute Management

  • Oversee Linux-based DA infrastructure including compute farms, storage systems, and license servers (FlexLM).
  • Manage LSF/grid environments and job scheduling systems.
  • Ensure scalability, system monitoring, high availability, and performance optimization.
  • Partner with IT on hardware lifecycle planning, cloud integration, and disaster recovery.
  • Maintain secure, access-controlled design environments aligned with IP protection policies.

3. Design Data, Manifest & Configuration Management

Design Data Governance

  • Manage large-scale analog design libraries, hierarchical database structures, and technology libraries.
  • Define backup, archival, and retention policies for tapeout-critical data.
  • Implement data integrity validation and corruption prevention controls.
  • Oversee distributed storage systems optimized for EDA workloads.

Manifest & Tapeout Release Management

  • Own creation and governance of tapeout manifests including:
    • PDK versions
    • Tool versions
    • Extraction/verification decks
    • Simulation models
    • Signoff configurations
  • Establish reproducible environment release frameworks for analog programs.
  • Implement controlled qualification flows for tool/PDK upgrades prior to production rollout.
  • Maintain environment snapshots to ensure reproducibility and post-silicon traceability.
  • Support formal tapeout readiness and design signoff reviews.

Version Control & Configuration Management

  • Deploy and manage version control systems (Git, SVN, Perforce) for:
    • CAD scripts and automation
    • Methodology flows
    • PDK overlays
    • Verification decks
  • Define branching, tagging, and release strategies for multi-project and multi-node environments.
  • Implement dependency tracking across tools, PDKs, IP, and infrastructure.
  • Apply infrastructure-as-code principles where applicable.

Automation & Traceability

  • Develop automated environment capture tools to log tool versions, library states, and system configurations.
  • Enable reproducible simulations and environment packaging.
  • Create dashboards and reporting metrics for design data health and DA service KPIs.

4. Leadership & Cross-Functional Collaboration

  • Lead and mentor DA and infrastructure engineers.
  • Serve as the primary interface between analog design, digital CAD, IT, and EDA vendors.
  • Drive tool evaluations, upgrades, and vendor negotiations.
  • Develop internal documentation, training programs, and best practices.
  • Establish measurable service-level KPIs and continuously improve DA operations.

Required Skills and Experience

  • Strong hands-on experience with analog design platforms such as Virtuoso and Custom Compiler.
  • Deep understanding of analog layout, verification flows, PDK integration, and tapeout processes.
  • Proven experience managing design data governance and tapeout manifest control.
  • Strong Linux system administration and scripting skills (Python, Tcl, Shell).
  • Experience with compute grid management, storage architecture, and license management.
  • Expertise in version control and configuration management systems.

Preferred Skills and Experience

  • Experience with advanced nodes (FinFET, GAA).
  • Familiarity with cloud-based EDA deployment models.
  • Knowledge of CI/CD practices applied to EDA environments.
  • Experience supporting geographically distributed design teams.
  • Strong budgeting and vendor management experience.

Key Competencies

  • Technical depth in analog CAD methodologies
  • Strong data governance and release discipline
  • Strategic infrastructure planning
  • Cross-functional leadership
  • Process-driven execution with audit readiness mindset
Qualifications:
  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field.
  • 10+ years of experience in analog/mixed-signal design or CAD support.
  • 5+ years of leadership experience.
    Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, California, Santa ClaraAdditional Locations:US, California, Folsom, US, Oregon, Hillsboro, US, Texas, AustinBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.Benefits

    We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

    Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

    Work Model for this Role

    This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

    *

    ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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    About Intel

    Sourced by ZipRecruiter

    Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

    Industry

    Manufacturing

    Company size

    10,000+ Employees

    Headquarters location

    Santa Clara, CA, US

    Year founded

    1968