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Semiconductor Packaging Jobs (NOW HIRING)

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$115K - $219K/yr

Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale. Managing equipment development, including pathfinding, new ...

Altera

Senior Package Reliability Engineer

San Jose, CA

$166K - $240K/yr

Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field with 8+ years of experience in semiconductor package thermal and thermomechanical ...

Apple

IC Packaging Integration Engineer

Austin, TX · On-site

We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling ...

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Semiconductor Packaging information

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How much do semiconductor packaging jobs pay per hour?

As of Aug 6, 2026, the average hourly pay for semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.
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What states have the most Semiconductor Packaging jobs? States with the most job openings for Semiconductor Packaging jobs include:
What job categories do people searching Semiconductor Packaging jobs look for? The top searched job categories for Semiconductor Packaging jobs are:
Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in the United States as of August 2026, with employment types broken down into 83% Full Time, 11% Part Time, 1% Temporary, 2% Contract, and 3% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Packaging Module Development Engineer

Intel

Phoenix, AZ • On-site

$115K - $219K/yr

Full-time

Medical, Retirement, PTO

Re-posted yesterday

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers

Job description

Job Details:Job Description: 

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:


Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms.
Collaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale.
Managing equipment development, including pathfinding, new equipment definition, equipment selection, technology development, and high-volume manufacturing.
Managing projects to meet product development timelines.
Applying formal education and judgment to solve technical problems.
Providing sustaining support for equipment performance and process health in high-volume manufacturing.
Responding promptly to foundry customer requests and events.
The ideal candidate will demonstrate:


Technical leadership, strategic planning, and critical thinking.
Ability to coach and develop technical teams.
Tolerance for ambiguity and adaptability in a dynamic environment.
Flexibility in managing changing priorities and responsibilities.
Experience leading teams in a highly matrixed organization.
Initiative and ability to work independently.
Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.
Minimum Qualifications

  • PhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field; OR
  • Master's degree in mechanical engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field.
  • Candidates who are within four (4) months of completing the required degree are eligible to apply.
  • Minimum 1+ years of experience in the following:
  • Mechanical design, equipment development, or manufacturing systems, preferably within semiconductor or advanced manufacturing environments.
  • Strong experimental background, including hands-on laboratory or prototype development experience.
  • At least one first-author publication in a peer-reviewed technical journal for PhD candidates.
Job Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

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Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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