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Semiconductor Packaging Jobs (NOW HIRING)

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98.10K - $104.80K/yr

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless ... Falcomm is seeking an IC Packaging Designer to support the development and implementation of ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98.10K - $104.80K/yr

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless ... Falcomm is seeking an IC Packaging Designer to support the development and implementation of ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA

$98.10K - $104.80K/yr

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless ... Falcomm is seeking an IC Packaging Designer to support the development and implementation of ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$94.30K - $133.20K/yr

This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development ...

Apple

Packaging Assembly Engineer

Austin, TX · On-site

S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired.5+ years of extensive experience in Semiconductor Packaging ...

Nvidia

Senior Package Modeling Engineer

Santa Clara, CA · Hybrid

$122.70K - $168.50K/yr

Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms. * Contribute to packaging technology direction ...

Marvell

Principal Package Engineer

Santa Clara, CA

Deep understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques. * The ideal candidate would ...

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Semiconductor Packaging information

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How much do semiconductor packaging jobs pay per hour?

As of May 31, 2026, the average hourly pay for semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in Semiconductor Packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a Semiconductor Packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are some semiconductor packaging companies?

Semiconductor packaging companies design and produce the protective casings and interconnections for semiconductor devices. Major firms in this industry include Amkor Technology, ASE Group, and JCET Group, which provide packaging solutions such as wire bonding, flip-chip, and system-in-package. Working in this field often requires knowledge of materials, cleanroom environments, and precision manufacturing processes.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

More about Semiconductor Packaging jobs
What cities are hiring for Semiconductor Packaging jobs? Cities with the most Semiconductor Packaging job openings:
What are the most commonly searched types of Semiconductor Packaging jobs? The most popular types of Semiconductor Packaging jobs are:
What states have the most Semiconductor Packaging jobs? States with the most job openings for Semiconductor Packaging jobs include:
What job categories do people searching Semiconductor Packaging jobs look for? The top searched job categories for Semiconductor Packaging jobs are:
Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in the United States as of May 2026, with employment types broken down into 76% Full Time, 4% Part Time, 12% Contract, and 8% Nights. Highlights an 98% Physical, and 2% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Senior IC Packaging Designer

Falcomm

Atlanta, GA • On-site

$98.10K - $104.80K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 21 days ago

Job description

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless systems? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver cutting-edge wireless solutions that push the boundaries of performance, efficiency, and integration.
Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III-V MMICs devices into production-ready packages.
Responsibilities:
  • Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages.
  • Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools.
  • Work with signal integrity, EM, and thermal simulation teams to validate package performance.
  • Generate package documentation, fabrication drawings, and assembly specifications.
  • Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield.
  • Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss.
  • Support package integration with PCB design teams to ensure optimal RF performance at the system level.
  • Coordinate with fabrication and assembly partners.

Requirements
  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
  • 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition.
  • Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging.
  • Must be willing to work full-time, onsite, in Atlanta, GA.

Preferred Skills:
  • Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high-speed interface requirements such as DDR or PCIe.
  • Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre.
  • Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows.
  • Ability to build accurate 3-D models of packages using Ansys Electronics Desktop and EM-simulate them in HFSS and run thermal simulations on them with Icepak

Benefits
  • Competitive Salary and Equity Package
  • Comprehensive Health, Dental, and Vision Insurance
  • 401(k) Retirement Plan
  • Paid Time Off (PTO) and Sick Leave

Disclosure:
  • Falcomm is an Equal Opportunity Employer; employment with Falcomm is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
  • Applicants wishing to view a copy of Falcomm's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify Falcomm.
  • To conform to U.S. Government export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State.

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