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Semiconductor Packaging Jobs (NOW HIRING)

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless ... Falcomm is seeking an IC Packaging Designer to support the development and implementation of ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA

$98K - $104K/yr

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless ... Falcomm is seeking an IC Packaging Designer to support the development and implementation of ...

Nvidia

Senior Package Modeling Engineer

Santa Clara, CA · Hybrid

$122K - $168K/yr

Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms. * Contribute to packaging technology direction ...

Apple

Packaging Assembly Engineer

Austin, TX · On-site

S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired. 5+ years of extensive experience in Semiconductor Packaging ...

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Semiconductor Packaging information

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$27

How much do semiconductor packaging jobs pay per hour?

As of Jun 25, 2026, the average hourly pay for semiconductor packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What is packaging in the semiconductor industry?

In semiconductor packaging, the process involves enclosing and protecting semiconductor devices, such as integrated circuits, within a protective casing that provides electrical connections and mechanical support. Packaging ensures device reliability, facilitates heat dissipation, and allows integration into electronic systems. Semiconductor packaging requires precision, knowledge of materials, and often the use of specialized tools and cleanroom environments.

What are the key skills and qualifications needed to thrive in Semiconductor Packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

How much do semiconductor workers make?

Semiconductor packaging workers typically earn between $40,000 and $70,000 annually, depending on experience, location, and skill level. Entry-level positions may start lower, while experienced workers with specialized skills or certifications can earn higher wages. The role often requires knowledge of cleanroom environments and handling delicate components.

What are some semiconductor packaging companies?

Semiconductor packaging companies design and produce the protective casings and interconnections for semiconductor devices. Major firms in this industry include Amkor Technology, ASE Group, and JCET Group, which provide packaging solutions for integrated circuits used in electronics. Working in this field often requires knowledge of materials, cleanroom environments, and precision assembly techniques.

What are some of the common challenges faced in a Semiconductor Packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What does a semiconductor packaging engineer do?

A semiconductor packaging engineer designs and develops the protective enclosures for semiconductor devices, ensuring proper electrical connections, thermal management, and mechanical stability. They work with materials, manufacturing processes, and testing to optimize device performance and reliability, often using CAD tools and industry standards. This role requires knowledge of electronics, materials science, and manufacturing techniques.
More about Semiconductor Packaging jobs
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What states have the most Semiconductor Packaging jobs? States with the most job openings for Semiconductor Packaging jobs include:
What job categories do people searching Semiconductor Packaging jobs look for? The top searched job categories for Semiconductor Packaging jobs are:
Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in the United States as of June 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $39,198 per year, or $18.8 per hour.
IC Package Engineer (Starlink/Akoustis)

IC Package Engineer (Starlink/Akoustis)

SpaceX

Bastrop, TX • On-site

Full-time

Posted 25 days ago

SpaceX rating

8.7

Company rating: 8.7 out of 10

Based on 144 frontline employees who took The Breakroom Quiz

14th of 60 rated aerospace companies

Job description

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
IC PACKAGE ENGINEER (STARLINK/AKOUSTIS)
Akoustis is now operating as a wholly owned subsidiary of SpaceX, providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary and connecting the world through Starlink. We design, build, launch, and operate the world's largest constellation of satellites, enabling us to operate a global internet network unbounded by traditional ground infrastructure limitations. The root of SpaceX's success so far lies in our mission to keep all engineering and production in-house, which enables a tight feedback loop, nimble decision-making, and speedy deliverables. With millions of daily users worldwide already online, Starlink is truly a game-changer and levels the playing field for those who were previously unconnected.
We are looking for a highly skilled and motivated IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit (IC) packaging solutions. In this role, you'll play a critical part in enabling high-reliability, high-performance electronics for cutting-edge applications. You will work cross-functionally with design, manufacturing, reliability, supply chain, and failure analysis teams to deliver optimized semiconductor packaging that meets stringent thermal, mechanical, and electrical requirements. The ideal candidate will bring hands-on experience in semiconductor packaging, materials science, and electronics manufacturing processes, with a passion for technical innovation and attention to detail.
RESPONSIBILITIES:
  • Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA
  • Evaluate and select packaging materials (substrates, mold compounds, underfills, adhesives) based on thermal, mechanical, and electrical properties
  • Drive thermal management strategies within packages, including simulation and implementation of heat dissipation techniques
  • Define and execute reliability test plans (e.g., thermal cycling, uHAST, HTOL) for qualification of package designs
  • Utilize EDA/CAD tools (e.g., AutoCAD) for mechanical layout, with experience in ANSYS or other simulation tools as a plus
  • Apply DFM methodologies to ensure manufacturability, reliability, and testability from concept through production
  • Provide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulation
  • Conduct and support failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to drive root cause and corrective actions
  • Perform root cause analysis and data-driven troubleshooting using tools such as FMEA, SPC, and Six Sigma methodologies
  • Collaborate with PCB and substrate design teams to ensure co-design compatibility and package-board integration
  • Own project timelines, risks, and deliverables related to packaging initiatives and report progress to key stakeholders

BASIC QUALIFICATIONS:
  • Bachelor's degree in mechanical Engineering, packaging Engineering, materials science, electrical Engineering, or or other engineering discipline
  • 1+ year of experience designing, qualifying, or implementing IC packaging solutions (internships and academic projects are applicable)

PREFERRED QUALIFICATIONS:
  • 2+ years of hands-on experience with semiconductor packaging technologies, including:
    • Flip-chip, wire bond, WLP, LGA, CSP, QFN
    • Organic/inorganic substrates and PCB manufacturing
  • Deep understanding of packaging materials and their thermal, mechanical, and electrical properties
  • Familiarity with thermal management techniques for power-dense or mission-critical electronics
  • Experience with reliability testing, including JEDEC and IPC standards (e.g., thermal cycling, uHAST, HTS, vibration)
  • Knowledge of assembly processes: SMT, die attach, reflow soldering, encapsulation, underfill, etc.
  • Strong analytical skills with expertise in:
    • Root Cause Analysis
    • Statistical Process Control (SPC)
    • Six Sigma / Lean tools
    • Failure Mode and Effects Analysis (FMEA)
  • Experience with EDA/CAD tools such as AutoCAD (required); ANSYS or COMSOL (a plus)
  • Proven ability to lead cross-functional efforts across design, reliability, manufacturing, and supply chain
  • Strong project management, organizational, and communication skills

ADDITIONAL REQUIREMENTS:
  • Must be willing to work extended hours and weekends as needed to meet critical milestones
  • Ability to travel up to 20% domestically and internationally for supplier and manufacturing support
  • Ability to perform light physical tasks (lifting up to 25 lbs, handling packaging samples)

ITAR REQUIREMENTS:
  • To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.

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