Advanced Packaging Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
As semiconductor architectures continue to evolve through advanced packaging, heterogeneous integration, hybrid bonding, and high-bandwidth memory, we're looking for a strategic technology leader to ...
As semiconductor architectures continue to evolve through advanced packaging, heterogeneous integration, hybrid bonding, and high-bandwidth memory, we're looking for a strategic technology leader to ...
As semiconductor architectures continue to evolve through advanced packaging, heterogeneous integration, hybrid bonding, and high-bandwidth memory, we're looking for a strategic technology leader to ...
As semiconductor architectures continue to evolve through advanced packaging, heterogeneous integration, hybrid bonding, and high-bandwidth memory, we're looking for a strategic technology leader to ...
... packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our ...
... packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our ...
... packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our ...
... packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our ...
Hillsboro, OR · On-site
$133K - $255K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Hillsboro, OR · On-site
$133K - $255K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
$141K - $269K/yr
Apply today to become part of the team shaping the future of semiconductor packaging technology. Some of the responsibilities will include but not be limited to: * You will apply scientific and ...
$141K - $269K/yr
Apply today to become part of the team shaping the future of semiconductor packaging technology. Some of the responsibilities will include but not be limited to: * You will apply scientific and ...
Hillsboro, OR · On-site
$141K - $269K/yr
Apply today to become part of the team shaping the future of semiconductor packaging technology. Some of the responsibilities will include but not be limited to: * You will apply scientific and ...
Hillsboro, OR · On-site
$141K - $269K/yr
Apply today to become part of the team shaping the future of semiconductor packaging technology. Some of the responsibilities will include but not be limited to: * You will apply scientific and ...
Beaverton, OR · On-site
Their skill, precision, and commitment to quality play a critical role in the design, engineering, and manufacture of our semiconductor packaging solutions. Attention to detail and adherence to ...
Quick apply
Beaverton, OR · On-site
Their skill, precision, and commitment to quality play a critical role in the design, engineering, and manufacture of our semiconductor packaging solutions. Attention to detail and adherence to ...
Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
$13.22 - $14.63
2% of jobs
$14.63 - $16.03
9% of jobs
$17.16 is the 25th percentile. Wages below this are outliers.
$16.03 - $17.44
17% of jobs
The median wage is $18.56 / hr.
$17.44 - $18.85
27% of jobs
$18.85 - $20.26
15% of jobs
$20.69 is the 75th percentile. Wages above this are outliers.
$20.26 - $21.67
15% of jobs
$21.67 - $23.08
6% of jobs
$23.08 - $24.49
4% of jobs
$24.49 - $25.90
3% of jobs
$25.90 - $27.31
1% of jobs
$27.31 - $28.72
0% of jobs
$13
$19
$28
| Aspect | Semiconductor Packaging | Semiconductor Test Engineer |
|---|---|---|
| Primary Focus | Designing and assembling packaging solutions for chips | Testing and validating semiconductor devices for performance |
| Required Skills | Materials, mechanical design, manufacturing processes | Electrical testing, data analysis, test equipment operation |
| Work Environment | Manufacturing floors, R&D labs | Testing labs, production lines |
| Common Certifications | None specific, often engineering degrees |
Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.
$148K - $209K/yr
Full-time
Medical, Retirement, PTO
Posted 4 days ago
8.7
Based on 147 frontline employees who took The Breakroom Quiz
19th of 156 rated electronics manufacturers
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.
Key Responsibilities
- Develop and optimize plasma etch processes for advanced packaging applications
- Design experiments (DOE) to characterize process windows and optimize etch performance
- Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
- Partner with equipment suppliers to design, test, and implement innovative process solutions.
- Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
- Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
- Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates
Minimum Qualifications
- Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
- Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.
Experience listed above should be a combination of the following:
- Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
- Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
- Experience with plasma etch equipment platforms
Preferred Qualifications
- Experience in wafer-level assembly, advanced packaging, or related technologies.
- Demonstrated success in leading programs from initial strategy development through high-volume production.
- Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
- Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.
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Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Manufacturing
10,000+ Employees
Santa Clara, CA, US
1968