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Semiconductor Packaging Jobs in Oregon (NOW HIRING)

The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...

The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...

The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...

The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...

Their skill, precision, and commitment to quality play a critical role in the design, engineering, and manufacture of our semiconductor packaging solutions. Attention to detail and adherence to ...

Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...

Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...

Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...

Experience with advanced semiconductor devices and process flows Preferred Qualifications * 2+ ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...

... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...

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Showing results 1-20

Semiconductor Packaging information

See Oregon salary details

$13

$19

$28

How much do semiconductor packaging jobs pay per hour?

As of Jul 29, 2026, the average hourly pay for semiconductor packaging in Oregon is $19.93, according to ZipRecruiter salary data. Most workers in this role earn between $17.26 and $21.11 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in Semiconductor Packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a Semiconductor Packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.
What job categories do people searching Semiconductor Packaging jobs in Oregon look for? The top searched job categories for Semiconductor Packaging jobs in Oregon are:
What cities in Oregon are hiring for Semiconductor Packaging jobs? Cities in Oregon with the most Semiconductor Packaging job openings:
Infographic showing various Semiconductor Packaging job openings in Oregon as of July 2026, with employment types broken down into 83% Full Time, 13% Part Time, 2% Contract, and 2% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $41,444 per year, or $19.9 per hour.
Advanced Packaging Engineer

Advanced Packaging Engineer

INTEL

Portland, OR

$148K - $209K/yr

Full-time

Medical, Retirement, PTO

Posted 4 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers


Job description

Job Description

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.
Key Responsibilities


- Develop and optimize plasma etch processes for advanced packaging applications
- Design experiments (DOE) to characterize process windows and optimize etch performance
- Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
- Partner with equipment suppliers to design, test, and implement innovative process solutions.
- Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
- Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
- Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.


Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates

Minimum Qualifications


- Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
- Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.

Experience listed above should be a combination of the following:


- Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.

- Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
- Experience with plasma etch equipment platforms

Preferred Qualifications


- Experience in wafer-level assembly, advanced packaging, or related technologies.
- Demonstrated success in leading programs from initial strategy development through high-volume production.
- Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
- Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

What Intel employees say

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Benefits

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968