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Semiconductor Packaging Jobs in Oregon (NOW HIRING)

INTEL

Advanced Packaging Engineer

Vernonia, OR

$148K - $209K/yr

The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...

INTEL

Advanced Packaging Engineer

Hillsboro, OR

$148K - $209K/yr

The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...

INTEL

Advanced Packaging Engineer

Lafayette, OR

$148K - $209K/yr

The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...

INTEL

Advanced Packaging Engineer

Portland, OR

$148K - $209K/yr

The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...

Intel

Foveros Direct Pathfinding Integration

Hillsboro, OR · On-site

$141K - $269K/yr

Apply today to become part of the team shaping the future of semiconductor packaging technology. Some of the responsibilities will include but not be limited to: * You will apply scientific and ...

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Semiconductor Packaging information

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How much do semiconductor packaging jobs pay per hour?

As of Aug 20, 2026, the average hourly pay for semiconductor packaging in Oregon is $19.93, according to ZipRecruiter salary data. Most workers in this role earn between $17.26 and $21.11 per hour, depending on experience, location, and employer.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

Is it hard to get a job in semiconductor packaging?

Securing a job in semiconductor packaging can be competitive, but candidates with relevant technical skills, such as knowledge of cleanroom environments, soldering, and inspection tools, have good opportunities. Entry-level positions may require some training or certifications, but experience with industry-standard processes can improve job prospects.

What are popular job titles related to Semiconductor Packaging jobs in Oregon?

For Semiconductor Packaging jobs in Oregon, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging jobs in Oregon look for?

The top searched job categories for Semiconductor Packaging jobs in Oregon are:

What cities in Oregon are hiring for Semiconductor Packaging jobs?

Cities in Oregon with the most Semiconductor Packaging job openings:

Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in Oregon as of August 2026, with employment types broken down into 79% Full Time, 16% Part Time, 2% Contract, and 3% Nights. Highlights an 96% Physical, 1% Hybrid, and 3% Remote job distribution, with an average salary of $41,444 per year, or $19.9 per hour.

Key Account Technologist (Advanced Packaging)

Thermo Fisher

Hillsboro, OR • On-site

$18.50 - $22.50/hr

Other

Posted 17 days ago

Job description

Strategic Technology Leader For Advanced Packaging

At Thermo Fisher Scientific, our Electron Microscopy business is helping the world's leading semiconductor companies solve some of the industry's most complex challenges. As semiconductor architectures continue to evolve through advanced packaging, heterogeneous integration, hybrid bonding, high-bandwidth memory, we're looking for a strategic technology leader to help define what's next.

As a Key Account Technologist (Advanced Packaging), you'll work at the intersection of customer technology roadmaps, market strategy, and product innovation. This is a highly visible role where you'll partner with strategic semiconductor customers and internal business leaders to identify emerging technology trends, understand future workflow challenges, and influence the direction of our electron microscopy portfolio.

If you enjoy combining deep semiconductor expertise with strategic thinking and customer engagement, this role offers the opportunity to make a lasting impact on the future of advanced semiconductor manufacturing.

What You'll Do
  • Develop a deep understanding of advanced semiconductor packaging trends, emerging manufacturing technologies, and customer roadmaps.
  • Build trusted relationships with strategic semiconductor customers to understand future technical challenges and evolving workflow requirements.
  • Translate customer insights and market trends into actionable recommendations for product management, marketing, engineering, and business leadership.
  • Identify technology gaps, competitive opportunities, and innovation priorities that influence future product development.
  • Collaborate across product management, field applications, sales, marketing, and executive leadership to align business strategy with market needs.
  • Communicate complex technical concepts and market insights to diverse audiences, from engineering teams to senior executives.
  • Support strategic account planning by providing technical market intelligence and identifying opportunities to strengthen customer partnerships.
  • Contribute to innovation initiatives, including new workflow concepts, invention disclosures, and long-term portfolio planning.
What You'll Bring

We're looking for someone who combines strong technical credibility with exceptional business insight and communication skills.

Minimum Requirements
  • Bachelor's degree in Engineering, Materials Science, Physics, Electrical Engineering, or a related technical discipline. Advanced degree preferred.
  • 8+ years' experience within the semiconductor industry, preferably supporting advanced packaging technologies.
  • Strong understanding of semiconductor technology roadmaps and next-generation packaging trends, including areas such as: Heterogeneous Integration, Hybrid Bonding, High Bandwidth Memory (HBM), Chiplets, Die-to-Wafer and Wafer-to-Wafer Integration, Photonics.
  • Experience engaging directly with strategic semiconductor customers or technology partners.
  • Ability to synthesize technical information into strategic business recommendations.
  • Excellent presentation and executive communication skills.
  • Proven success influencing cross-functional teams in a matrixed organization.
Preferred Experience

Experience in one or more of the following areas is highly desirable:

  • Semiconductor equipment manufacturing
  • Semiconductor device manufacturers or foundries
  • Advanced packaging organizations
  • Failure analysis
  • Process integration
  • Yield engineering
  • Metrology
  • Applications engineering
  • Technical marketing
  • Product strategy
  • Strategic account technology leadership

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