Knowledge of reliability and quality requirements for semiconductor packaging. * Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly ...
Knowledge of reliability and quality requirements for semiconductor packaging. * Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly ...
Knowledge of reliability and quality requirements for semiconductor packaging. * Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly ...
Knowledge of reliability and quality requirements for semiconductor packaging. * Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly ...
Production Operator
Beaverton, OR · On-site
$19 - $20/hr
Their skill, precision, and commitment to quality play a critical role in the design, engineering, and manufacture of our semiconductor packaging solutions. Attention to detail and adherence to ...
Quick apply
Production Operator
Beaverton, OR · On-site
$19 - $20/hr
Their skill, precision, and commitment to quality play a critical role in the design, engineering, and manufacture of our semiconductor packaging solutions. Attention to detail and adherence to ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83.36 - $125.04/hr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
New
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83.36 - $125.04/hr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
New
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Process Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
... semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration ...
... semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration ...
Process Development Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Development Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Development Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Development Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Development Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Development Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Development Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
Process Development Engineer
$148K - $209K/yr
The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration ...
... semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration ...
... semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration ...
Senior Director of Software Engineering (Hillsboro)
Hillsboro, OR · On-site
$275K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Senior Director of Software Engineering (Hillsboro)
Hillsboro, OR · On-site
$275K/yr
... advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and ...
Semiconductor Packaging information
See Oregon salary details
$13.22 - $14.63
2% of jobs
$14.63 - $16.03
9% of jobs
$17.16 is the 25th percentile. Wages below this are outliers.
$16.03 - $17.44
17% of jobs
The median wage is $18.56 / hr.
$17.44 - $18.85
27% of jobs
$18.85 - $20.26
15% of jobs
$20.69 is the 75th percentile. Wages above this are outliers.
$20.26 - $21.67
15% of jobs
$21.67 - $23.08
6% of jobs
$23.08 - $24.49
4% of jobs
$24.49 - $25.90
3% of jobs
$25.90 - $27.31
1% of jobs
$27.31 - $28.72
0% of jobs
$13
$19
$28
How much do semiconductor packaging jobs pay per hour?
As of Aug 20, 2026, the average hourly pay for semiconductor packaging in Oregon is $19.93, according to ZipRecruiter salary data. Most workers in this role earn between $17.26 and $21.11 per hour, depending on experience, location, and employer.
What is semiconductor packaging?
Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.
What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?
To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.
What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?
Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.
What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?
| Aspect | Semiconductor Packaging | Semiconductor Test Engineer |
|---|---|---|
| Primary Focus | Designing and assembling packaging solutions for chips | Testing and validating semiconductor devices for performance |
| Required Skills | Materials, mechanical design, manufacturing processes | Electrical testing, data analysis, test equipment operation |
| Work Environment | Manufacturing floors, R&D labs | Testing labs, production lines |
| Common Certifications | None specific, often engineering degrees |
Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.
Is it hard to get a job in semiconductor packaging?
Securing a job in semiconductor packaging can be competitive, but candidates with relevant technical skills, such as knowledge of cleanroom environments, soldering, and inspection tools, have good opportunities. Entry-level positions may require some training or certifications, but experience with industry-standard processes can improve job prospects.
What are popular job titles related to Semiconductor Packaging jobs in Oregon?
For Semiconductor Packaging jobs in Oregon, the most frequently searched job titles are:
- Electrical Engineer Semiconductor
- Semiconductor Process Engineer
- Semiconductor Device Engineer
- Per Diem Electrical Engineer Semiconductor
- Cvd Process Engineer
- Senior Ncr Customer Engineer
- Semiconductor Manufacturing Engineer
- Semiconductor Packaging Engineer
- Contractual Semiconductor Test Engineering
- Ic Packaging Engineer
What job categories do people searching Semiconductor Packaging jobs in Oregon look for?
The top searched job categories for Semiconductor Packaging jobs in Oregon are:
What cities in Oregon are hiring for Semiconductor Packaging jobs?
Cities in Oregon with the most Semiconductor Packaging job openings:
Full-time
Medical, Retirement, PTO
Posted 7 days ago
Intel rating
8.7
Based on 147 frontline employees who took The Breakroom Quiz
19th of 159 rated electronics manufacturers
Job description
Job Description
Qualifications
Inside this Business Group
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across cross-functional teams to drive materials technology development for advanced packaging. The ideal candidate will have a strong educational foundation in Materials Science, such as Metallurgy or Polymer Science or Polymer Chemistry, with an excellent understanding of structure-property-performance correlations in materials and strong functional knowledge of materials characterization tools and techniques.
The candidate must be able to apply sound technical problem-solving skills to resolve materials-process-equipment challenges in technology development and drive innovative materials solutions for advanced packaging at Intel. This role requires close collaboration with cross organizational stakeholders to deliver novel materials technologies that meet stringent quality and reliability requirements. The candidate must also be able to work effectively with external materials suppliers and possess strong communication and presentation skills, including the ability to formulate and present materials strategies and development plans in both internal and external forums
Note: This role requires regular onsite presence to fulfill essential job responsibilities.
Key Responsibilities:
-
Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
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Optimizes and improves the efficiency of manufacturing of packages, developing innovative materials, processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
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Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
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Develops materials target specifications to ensure excellent integration of materials into packaging equipment and processes meeting quality and reliability targets.
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Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
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Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure materials technology, quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
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Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability.
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Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
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Leads efforts towards innovating, problem solving, developing, and continuously improving materials, equipment and processes using experimental design and statistical methods.
-
Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
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Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on materials/process/technology maturity for products towards key risk areas in meeting product milestones.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
-
Bachelor's degree with 4+ years of experience or Master's degree with 3+ years of experience or Ph.D in a relevant field such as Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering, or a related discipline.
-
4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.
Preferred Qualifications:
-
Experience in collaborating with cross-functional teams, suppliers, and manufacturing operations to achieve shared goals.
-
Proficiency in Design of Experiments (DOE) principles and statistical data analysis tools.
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Demonstrated expertise in packaging fundamentals, package design and development, and package testing methodologies.
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Knowledge of reliability and quality requirements for semiconductor packaging.
-
Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly preferred.
We are excited to welcome passionate engineers who thrive on innovation, collaboration, and driving advancements in technology. If you are ready to make an impact and help shape the future of semiconductor packaging, we invite you to apply today.
Inside this Business Group
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968