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Semiconductor Packaging Engineer Jobs in Oregon (NOW HIRING)

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Senior Systems Engineer

Hillsboro, OR · On-site

$115K - $172K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... The new hire will have the opportunity to work closely with systems engineers to develop metrology ...

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Senior Systems Engineer

Hillsboro, OR

$115K - $172K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... The new hire will have the opportunity to work closely with systems engineers to develop metrology ...

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Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR · On-site

$83K - $125K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

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Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR · On-site

$83K - $125K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR · On-site

$83K - $125K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR

$83K - $125K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

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Principal Systems Engineer

Hillsboro, OR

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... The Principal Systems Engineer will define system-level requirements, ensure cross-functional ...

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Senior Systems Engineer

Hillsboro, OR

$102K - $153K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities The core responsibilities of the Senior Systems Engineer are to ...

Onto

Senior Systems Engineer

Hillsboro, OR · On-site

$102K - $153K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities The core responsibilities of the Senior Systems Engineer are to ...

Intel

WATD Module Development Engineer

Hillsboro, OR · On-site

$155K - $219K/yr

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

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Senior Systems Engineer

Hillsboro, OR

$128K - $192K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities The core responsibilities of the Senior Systems Engineer are to ...

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All JobsSemiconductor Packaging Engineer JobsSemiconductor Packaging Engineer Jobs in Oregon

Semiconductor Packaging Engineer information

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How much do semiconductor packaging engineer jobs pay per hour?

As of Sep 4, 2026, the average hourly pay for semiconductor packaging engineer in Oregon is $44.79, according to ZipRecruiter salary data. Most workers in this role earn between $34.57 and $52.12 per hour, depending on experience, location, and employer.

What does a semiconductor packaging engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are the key skills and qualifications needed to thrive as a semiconductor packaging engineer?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What are some common challenges semiconductor packaging engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are popular job titles related to Semiconductor Packaging Engineer jobs in Oregon?

For Semiconductor Packaging Engineer jobs in Oregon, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging Engineer jobs in Oregon look for?

The top searched job categories for Semiconductor Packaging Engineer jobs in Oregon are:

What cities in Oregon are hiring for Semiconductor Packaging Engineer jobs?

Cities in Oregon with the most Semiconductor Packaging Engineer job openings:

Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in Oregon as of August 2026, with employment types broken down into 88% Full Time, 8% Part Time, and 4% Contract. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution, with an average salary of $93,168 per year, or $44.8 per hour.

Key Account Technologist (Advanced Packaging)

Thermo Fisher Scientific

Hillsboro, OR • Hybrid

Full-time

Re-posted 13 days ago

Thermo Fisher Scientific rating

7.8

Company rating: 7.8 out of 10

Based on 429 frontline employees who took The Breakroom Quiz

170th of 545 rated manufacturers

Job description

Work Schedule

Standard (Mon-Fri)

Environmental Conditions

Office

Job Description

At Thermo Fisher Scientific, our Electron Microscopy business is helping the world’s leading semiconductor companies solve some of the industry’s most complex challenges. As semiconductor architectures continue to evolve through advanced packaging, heterogeneous integration, hybrid bonding, and high-bandwidth memory, we’re looking for a strategic technology leader to help define what’s next.

As a Key Account Technologist (Advanced Packaging), you’ll work at the intersection of customer technology roadmaps, market strategy, and product innovation. This is a highly visible role where you’ll partner with strategic semiconductor customers and internal business leaders to identify emerging technology trends, understand future workflow challenges, and influence the direction of our electron microscopy portfolio.

If you enjoy combining deep semiconductor expertise with strategic thinking and customer engagement, this role offers the opportunity to make a lasting impact on the future of advanced semiconductor manufacturing.

What You’ll Do
  • Develop a deep understanding of advanced semiconductor packaging trends, emerging manufacturing technologies, and customer roadmaps.
  • Build trusted relationships with strategic semiconductor customers to understand future technical challenges and evolving workflow requirements.
  • Translate customer insights and market trends into actionable recommendations for product management, marketing, engineering, and business leadership.
  • Identify technology gaps, competitive opportunities, and innovation priorities that influence future product development.
  • Collaborate across product management, field applications, sales, marketing, and executive leadership to align business strategy with market needs.
  • Communicate complex technical concepts and market insights to diverse audiences, from engineering teams to senior executives.
  • Support strategic account planning by providing technical market intelligence and identifying opportunities to strengthen customer partnerships.
  • Contribute to innovation initiatives, including new workflow concepts, invention disclosures, and long-term portfolio planning.
What You’ll Bring

We’re looking for someone who combines strong technical credibility with exceptional business insight and communication skills.

Minimum Requirements
  • Bachelor’s degree in Engineering, Materials Science, Physics, Electrical Engineering, or a related technical discipline. Advanced degree preferred.
  • 8+ years’ experience within the semiconductor industry, preferably supporting advanced packaging technologies.
  • Strong understanding of semiconductor technology roadmaps and next-generation packaging trends, including areas such as:
    • Heterogeneous Integration
    • Hybrid Bonding
    • High Bandwidth Memory (HBM)
    • Chiplets
    • Die-to-Wafer and Wafer-to-Wafer Integration
    • Photonics
  • Experience engaging directly with strategic semiconductor customers or technology partners.
  • Ability to synthesize technical information into strategic business recommendations.
  • Excellent presentation and executive communication skills.
  • Proven success influencing cross-functional teams in a matrixed organization.
Preferred Experience

Experience in one or more of the following areas is highly desirable:

  • Semiconductor equipment manufacturing
  • Semiconductor device manufacturers or foundries
  • Advanced packaging organizations
  • Failure analysis
  • Process integration
  • Yield engineering
  • Metrology
  • Applications engineering
  • Technical marketing
  • Product strategy
  • Strategic account technology leadership

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