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Semiconductor Packaging Engineer Jobs in Oregon (NOW HIRING)

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... The Principal Systems Engineer will define system-level requirements, ensure cross-functional ...

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

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Semiconductor Packaging Engineer information

See Oregon salary details

$20

$44

$70

How much do semiconductor packaging engineer jobs pay per hour?

As of Jul 19, 2026, the average hourly pay for semiconductor packaging engineer in Oregon is $44.79, according to ZipRecruiter salary data. Most workers in this role earn between $34.57 and $52.12 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are the key skills and qualifications needed to thrive as a Semiconductor Packaging Engineer, and why are they important?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What does a Semiconductor Packaging Engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are some common challenges Semiconductor Packaging Engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.
What job categories do people searching Semiconductor Packaging Engineer jobs in Oregon look for? The top searched job categories for Semiconductor Packaging Engineer jobs in Oregon are:
What cities in Oregon are hiring for Semiconductor Packaging Engineer jobs? Cities in Oregon with the most Semiconductor Packaging Engineer job openings:
Infographic showing various Semiconductor Packaging Engineer job openings in Oregon as of July 2026, with employment types broken down into 93% Full Time, 4% Part Time, 2% Contract, and 1% Nights. Highlights an 87% Physical, 4% Hybrid, and 9% Remote job distribution, with an average salary of $93,168 per year, or $44.8 per hour.
Foundry Services Advanced Packaging Account Technical Solutions Engineer

Foundry Services Advanced Packaging Account Technical Solutions Engineer

Intel

Hillsboro, OR • On-site

Full-time

Medical, Retirement, PTO

Posted 5 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

11th of 143 rated electronics manufacturers


Job description

Job Details:Job Description: 

Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
As stewards of Moore's Law, we persistently innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain, particularly for advanced products. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era.
About the Role
Intel Foundry Services is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers. This role is pivotal in enabling our foundry customers who are using Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.
Key Responsibilities:

  • Own the end-to-end customer relationship as the primary interface between the customer and Intel, ensuring seamless communication, trust, and alignment across all phases of engagement.
  • Work directly with customer to understand packaging challenges and requirements and provide technical consultation on packaging solutions and processes.
  • Engage expert stakeholders across Intel Foundry to ensure customers have firsthand access to information.
  • Collaborate with cross-functional teams including Technology Development, Product Engineering, Manufacturing and Operations, and Customer Engineering teams providing feedback to influence product and technology roadmaps.
  • Lead and coordinate all internal Intel interactions related to the customer account to drive commitment to execution across schedule, quality, technical execution, qualification and volume ramp.
  • Develop and maintain the Statement of Work (SOW) documenting customer requirements, Intel Foundry commitments, technical deliverables, and schedule milestones.
  • Manage full customer engagement lifecycle from initial design award through development, ramp, high volume manufacturing (HVM), and end of life.
    • Track and drive closure of customer commitment, action items and escalations.
    • Monitor milestones, risks, dependencies and change requests.
    • Drive resolution of issues affecting qualification and delivery.
    • Provide clear status reports to both customers and leadership.
    • Serve as the Voice of the Customer inside Intel Foundry, ensuring customer priorities, risks, and expectations are clearly communicated and advocated across all internal functions.

Required Skills and Experience

  • Experience in Semiconductor Packaging
  • Strong communication, project management and customer-facing skills
  • Ability to operate across both technical and operations discussions
  • Problem-solving and analytical thinking
  • Ability to explain complex technical concepts clearly
  • Willingness to travel

Preferred Skills and Experience

  • Strong communication, project management and customer-facing skills
  • Ability to operate across both technical and operations discussions
  • Problem-solving and analytical thinking
  • Ability to explain complex technical concepts clearly
  • Willingness to travel
Qualifications:
  • Bachelors or Masters Degree in Electrical Engineering, Materials Science, Mechanical Engineering or Chemical Engineering or related field.
  • 10+ years industry experience
  • 5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing, Operations, Product Engineering, Field Applications or customer-facing engineering
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:US, California, Folsom, US, California, Santa Clara, US, Oregon, Hillsboro, US, Texas, AustinBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $220,320.00-311,040.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968