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Semiconductor Packaging Engineer Jobs in Oregon (NOW HIRING)

INTEL

Advanced Packaging Engineer

Lafayette, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Advanced Packaging Engineer

Portland, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Advanced Packaging Engineer

Hillsboro, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Advanced Packaging Engineer

Vernonia, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Advanced Packaging Engineer

Lafayette, OR

Come join us and help shape the future of the semiconductor process for decades to come. What we ... LTD Module Development Engineers are responsible for leading scientific research enabling the ...

INTEL

Advanced Packaging Engineer

Vernonia, OR

Come join us and help shape the future of the semiconductor process for decades to come. What we ... LTD Module Development Engineers are responsible for leading scientific research enabling the ...

INTEL

Advanced Packaging Engineer

Portland, OR

Come join us and help shape the future of the semiconductor process for decades to come. What we ... LTD Module Development Engineers are responsible for leading scientific research enabling the ...

INTEL

Advanced Packaging Engineer

Hillsboro, OR

Come join us and help shape the future of the semiconductor process for decades to come. What we ... LTD Module Development Engineers are responsible for leading scientific research enabling the ...

INTEL

Process Engineer

Portland, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Process Engineer

Lafayette, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Process Engineer

Hillsboro, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Process Engineer

Vernonia, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

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All JobsSemiconductor Packaging Engineer JobsSemiconductor Packaging Engineer Jobs in Oregon

Semiconductor Packaging Engineer information

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$20

$44

$70

How much do semiconductor packaging engineer jobs pay per hour?

As of Aug 1, 2026, the average hourly pay for semiconductor packaging engineer in Oregon is $44.79, according to ZipRecruiter salary data. Most workers in this role earn between $34.57 and $52.12 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are the key skills and qualifications needed to thrive as a Semiconductor Packaging Engineer, and why are they important?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What does a Semiconductor Packaging Engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are some common challenges Semiconductor Packaging Engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.
What are popular job titles related to Semiconductor Packaging Engineer jobs in Oregon? For Semiconductor Packaging Engineer jobs in Oregon, the most frequently searched job titles are:
What job categories do people searching Semiconductor Packaging Engineer jobs in Oregon look for? The top searched job categories for Semiconductor Packaging Engineer jobs in Oregon are:
What cities in Oregon are hiring for Semiconductor Packaging Engineer jobs? Cities in Oregon with the most Semiconductor Packaging Engineer job openings:
Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in Oregon as of July 2026, with employment types broken down into 97% Full Time, 1% Part Time, and 2% Contract. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $93,168 per year, or $44.8 per hour.

Advanced Packaging Engineer

INTEL

Lafayette, OR

$148K - $209K/yr

Full-time

Medical, Retirement, PTO

Posted 8 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers

Job description

Job Description

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.
Key Responsibilities


- Develop and optimize plasma etch processes for advanced packaging applications
- Design experiments (DOE) to characterize process windows and optimize etch performance
- Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
- Partner with equipment suppliers to design, test, and implement innovative process solutions.
- Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
- Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
- Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.


Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates

Minimum Qualifications


- Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
- Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.

Experience listed above should be a combination of the following:


- Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.

- Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
- Experience with plasma etch equipment platforms

Preferred Qualifications


- Experience in wafer-level assembly, advanced packaging, or related technologies.
- Demonstrated success in leading programs from initial strategy development through high-volume production.
- Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
- Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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