Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by ... Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key ...
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by ... Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key ...
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...
Advanced Packaging Dry Etch Module Development Engineer
Hillsboro, OR · On-site
$133K - $255K/yr
... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ... Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ...
Advanced Packaging Dry Etch Module Development Engineer
Hillsboro, OR · On-site
$133K - $255K/yr
... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ... Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the ...
... Development Engineer to join our advanced packaging team. The successful candidate will be ... Business group:Intel Foundry strives to make every facet of semiconductor manufacturing ...
... Development Engineer to join our advanced packaging team. The successful candidate will be ... Business group:Intel Foundry strives to make every facet of semiconductor manufacturing ...
Foveros Direct Pathfinding Integration
$141K - $269K/yr
Experience in packaging engineering, process development, and technology innovation. * Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
Foveros Direct Pathfinding Integration
$141K - $269K/yr
Experience in packaging engineering, process development, and technology innovation. * Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
Foveros Direct Pathfinding Integration
Hillsboro, OR · On-site
$141K - $269K/yr
Experience in packaging engineering, process development, and technology innovation. * Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
Foveros Direct Pathfinding Integration
Hillsboro, OR · On-site
$141K - $269K/yr
Experience in packaging engineering, process development, and technology innovation. * Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
... packages; metal interconnect composition; factory analytics; and lithography for advanced ... Manage customers build configurations, including translating Engineering Authorization Requests ...
... packages; metal interconnect composition; factory analytics; and lithography for advanced ... Manage customers build configurations, including translating Engineering Authorization Requests ...
... packages; metal interconnect composition; factory analytics; and lithography for advanced ... Manage customers build configurations, including translating Engineering Authorization Requests ...
... packages; metal interconnect composition; factory analytics; and lithography for advanced ... Manage customers build configurations, including translating Engineering Authorization Requests ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...
Field Service Engineer 3 (Non-Exempt)
Hillsboro, OR · On-site
$83K - $125K/yr
... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...
Field Service Engineer 3 (Non-Exempt)
$83K - $125K/yr
... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...
Field Service Engineer 3 (Non-Exempt)
$83K - $125K/yr
... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...
Field Service Engineer 3 (Non-Exempt)
$83K - $125K/yr
... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...
Field Service Engineer 3 (Non-Exempt)
$83K - $125K/yr
... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... The Principal Systems Engineer will define system-level requirements, ensure cross-functional ...
... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... The Principal Systems Engineer will define system-level requirements, ensure cross-functional ...
WATD Module Development Engineer
$148K - $209K/yr
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
WATD Module Development Engineer
$148K - $209K/yr
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
WATD Module Development Engineer
$148K - $209K/yr
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
WATD Module Development Engineer
$148K - $209K/yr
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
WATD Module Development Engineer
$148K - $209K/yr
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
WATD Module Development Engineer
$148K - $209K/yr
... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...
Semiconductor Packaging Engineer information
See Oregon salary details
$20.84 - $25.39
2% of jobs
$25.39 - $29.94
6% of jobs
$34.28 is the 25th percentile. Wages below this are outliers.
$29.94 - $34.50
17% of jobs
$34.50 - $39.05
16% of jobs
The median wage is $41.32 / hr.
$39.05 - $43.60
16% of jobs
$43.60 - $48.15
12% of jobs
$50.31 is the 75th percentile. Wages above this are outliers.
$48.15 - $52.70
11% of jobs
$52.70 - $57.25
6% of jobs
$57.25 - $61.81
5% of jobs
$61.81 - $66.36
4% of jobs
$66.36 - $70.91
3% of jobs
$20
$44
$70
How much do semiconductor packaging engineer jobs pay per hour?
What is the difference between Semiconductor Packaging Engineer vs Test Engineer?
| Aspect | Semiconductor Packaging Engineer | Test Engineer |
|---|---|---|
| Required Credentials | Bachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMI | Bachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards |
| Work Environment | Design labs, manufacturing facilities, cleanrooms | Testing labs, production lines, quality assurance departments |
| Industry Usage | Semiconductor manufacturing, electronics companies | Electronics manufacturing, semiconductor companies |
Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.
What are the key skills and qualifications needed to thrive as a Semiconductor Packaging Engineer, and why are they important?
What does a Semiconductor Packaging Engineer do?
What are some common challenges Semiconductor Packaging Engineers face in ensuring product reliability?
Foundry Services Advanced Packaging Account Technical Solutions Engineer
Hillsboro, OR • On-site
Full-time
Medical, Retirement, PTO
Posted 5 days ago
Intel rating
8.7
Based on 147 frontline employees who took The Breakroom Quiz
11th of 143 rated electronics manufacturers
Job description
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
As stewards of Moore's Law, we persistently innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain, particularly for advanced products. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era.
About the Role
Intel Foundry Services is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers. This role is pivotal in enabling our foundry customers who are using Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.
Key Responsibilities:
- Own the end-to-end customer relationship as the primary interface between the customer and Intel, ensuring seamless communication, trust, and alignment across all phases of engagement.
- Work directly with customer to understand packaging challenges and requirements and provide technical consultation on packaging solutions and processes.
- Engage expert stakeholders across Intel Foundry to ensure customers have firsthand access to information.
- Collaborate with cross-functional teams including Technology Development, Product Engineering, Manufacturing and Operations, and Customer Engineering teams providing feedback to influence product and technology roadmaps.
- Lead and coordinate all internal Intel interactions related to the customer account to drive commitment to execution across schedule, quality, technical execution, qualification and volume ramp.
- Develop and maintain the Statement of Work (SOW) documenting customer requirements, Intel Foundry commitments, technical deliverables, and schedule milestones.
- Manage full customer engagement lifecycle from initial design award through development, ramp, high volume manufacturing (HVM), and end of life.
- Track and drive closure of customer commitment, action items and escalations.
- Monitor milestones, risks, dependencies and change requests.
- Drive resolution of issues affecting qualification and delivery.
- Provide clear status reports to both customers and leadership.
- Serve as the Voice of the Customer inside Intel Foundry, ensuring customer priorities, risks, and expectations are clearly communicated and advocated across all internal functions.
Required Skills and Experience
- Experience in Semiconductor Packaging
- Strong communication, project management and customer-facing skills
- Ability to operate across both technical and operations discussions
- Problem-solving and analytical thinking
- Ability to explain complex technical concepts clearly
- Willingness to travel
Preferred Skills and Experience
- Strong communication, project management and customer-facing skills
- Ability to operate across both technical and operations discussions
- Problem-solving and analytical thinking
- Ability to explain complex technical concepts clearly
- Willingness to travel
- Bachelors or Masters Degree in Electrical Engineering, Materials Science, Mechanical Engineering or Chemical Engineering or related field.
- 10+ years industry experience
- 5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing, Operations, Product Engineering, Field Applications or customer-facing engineering
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $220,320.00-311,040.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968