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Semiconductor Packaging Engineer Jobs in Oregon (NOW HIRING)

INTEL

Process Engineer

Portland, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Process Engineer

Vernonia, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR · On-site

$83K - $125K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

INTEL

Process Development Engineer

Vernonia, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Process Development Engineer

Hillsboro, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR

$83K - $125K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

INTEL

Process Development Engineer

Portland, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

INTEL

Process Development Engineer

Lafayette, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced ... semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR · On-site

$83K - $125K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR

$83K - $125K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities Semiconductor Metrology & Inspection Field Service Engineer (Level ...

Intel

WATD Module Development Engineer

Hillsboro, OR · On-site

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

Onto

Principal Systems Engineer

Hillsboro, OR

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... The Principal Systems Engineer will define system-level requirements, ensure cross-functional ...

INTEL

WATD Module Development Engineer

Hillsboro, OR

$148K - $209K/yr

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

INTEL

WATD Module Development Engineer

Lafayette, OR · On-site

$148K - $209K/yr

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

INTEL

WATD Module Development Engineer

Portland, OR

$148K - $209K/yr

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

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Showing results 21-40

All JobsSemiconductor Packaging Engineer JobsSemiconductor Packaging Engineer Jobs in Oregon

Semiconductor Packaging Engineer information

See Oregon salary details

$20

$44

$70

How much do semiconductor packaging engineer jobs pay per hour?

As of Aug 19, 2026, the average hourly pay for semiconductor packaging engineer in Oregon is $44.79, according to ZipRecruiter salary data. Most workers in this role earn between $34.57 and $52.12 per hour, depending on experience, location, and employer.

What does a semiconductor packaging engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are the key skills and qualifications needed to thrive as a semiconductor packaging engineer?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What are some common challenges semiconductor packaging engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are popular job titles related to Semiconductor Packaging Engineer jobs in Oregon?

For Semiconductor Packaging Engineer jobs in Oregon, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging Engineer jobs in Oregon look for?

The top searched job categories for Semiconductor Packaging Engineer jobs in Oregon are:

What cities in Oregon are hiring for Semiconductor Packaging Engineer jobs?

Cities in Oregon with the most Semiconductor Packaging Engineer job openings:

Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in Oregon as of August 2026, with employment types broken down into 89% Full Time, 8% Part Time, and 3% Contract. Highlights an 85% Physical, 6% Hybrid, and 9% Remote job distribution, with an average salary of $93,168 per year, or $44.8 per hour.

Packaging Module Development Engineer

INTEL

Hillsboro, OR • On-site

Full-time

Medical, Retirement, PTO

Posted 6 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

Job Description

We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across cross-functional teams to drive materials technology development for advanced packaging. The ideal candidate will have a strong educational foundation in Materials Science, such as Metallurgy or Polymer Science or Polymer Chemistry, with an excellent understanding of structure-property-performance correlations in materials and strong functional knowledge of materials characterization tools and techniques.

The candidate must be able to apply sound technical problem-solving skills to resolve materials-process-equipment challenges in technology development and drive innovative materials solutions for advanced packaging at Intel. This role requires close collaboration with cross organizational stakeholders to deliver novel materials technologies that meet stringent quality and reliability requirements. The candidate must also be able to work effectively with external materials suppliers and possess strong communication and presentation skills, including the ability to formulate and present materials strategies and development plans in both internal and external forums

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Key Responsibilities:

  • Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.

  • Optimizes and improves the efficiency of manufacturing of packages, developing innovative materials, processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

  • Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.

  • Develops materials target specifications to ensure excellent integration of materials into packaging equipment and processes meeting quality and reliability targets.

  • Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.

  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure materials technology, quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.

  • Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability.

  • Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.

  • Leads efforts towards innovating, problem solving, developing, and continuously improving materials, equipment and processes using experimental design and statistical methods.

  • Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.

  • Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on materials/process/technology maturity for products towards key risk areas in meeting product milestones.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Bachelor's degree with 4+ years of experience or  Master's degree with 3+ years of experience or Ph.D in a relevant field such as Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering, or a related discipline.

  • 4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.

Preferred Qualifications:

  • Experience in collaborating with cross-functional teams, suppliers, and manufacturing operations to achieve shared goals.

  • Proficiency in Design of Experiments (DOE) principles and statistical data analysis tools.

  • Demonstrated expertise in packaging fundamentals, package design and development, and package testing methodologies.

  • Knowledge of reliability and quality requirements for semiconductor packaging.

  • Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly preferred.

We are excited to welcome passionate engineers who thrive on innovation, collaboration, and driving advancements in technology. If you are ready to make an impact and help shape the future of semiconductor packaging, we invite you to apply today.


Inside this Business Group
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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