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Semiconductor Packaging Engineer Jobs in Oregon (NOW HIRING)

INTEL

WATD Module Development Engineer

Vernonia, OR

$148K - $209K/yr

... semiconductor packaging technology development. Your efforts will contribute to the design ... Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical ...

Onto

Senior Systems Engineer

Hillsboro, OR

$102K - $153K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities The core responsibilities of the Senior Systems Engineer are to ...

Onto

Senior Systems Engineer

Hillsboro, OR · On-site

$102K - $153K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Job Summary & Responsibilities The core responsibilities of the Senior Systems Engineer are to ...

Onto

Senior Director of Software Engineering

Hillsboro, OR · On-site

$275K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Lead, mentor, and grow a team of software engineers, managers, and technical leads within the ...

Onto

Senior Director of Software Engineering

Hillsboro, OR · On-site

$275K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... Lead, mentor, and grow a team of software engineers, managers, and technical leads within the ...

SEMPAC

Production Operator

Beaverton, OR · On-site

$19 - $20/hr

Their skill, precision, and commitment to quality play a critical role in the design, engineering, and manufacture of our semiconductor packaging solutions. Attention to detail and adherence to ...

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Field Service Engineer 2 (Non Exempt)

Hillsboro, OR · On-site

$55K - $83K/yr

... for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor ... The Install Engineer plays a key role in troubleshooting technical issues, supporting system ...

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Semiconductor Packaging Engineer information

See Oregon salary details

$20

$44

$70

How much do semiconductor packaging engineer jobs pay per hour?

As of Aug 18, 2026, the average hourly pay for semiconductor packaging engineer in Oregon is $44.79, according to ZipRecruiter salary data. Most workers in this role earn between $34.57 and $52.12 per hour, depending on experience, location, and employer.

What does a semiconductor packaging engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are the key skills and qualifications needed to thrive as a semiconductor packaging engineer?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What are some common challenges semiconductor packaging engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are popular job titles related to Semiconductor Packaging Engineer jobs in Oregon?

For Semiconductor Packaging Engineer jobs in Oregon, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging Engineer jobs in Oregon look for?

The top searched job categories for Semiconductor Packaging Engineer jobs in Oregon are:

What cities in Oregon are hiring for Semiconductor Packaging Engineer jobs?

Cities in Oregon with the most Semiconductor Packaging Engineer job openings:

Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in Oregon as of August 2026, with employment types broken down into 89% Full Time, 8% Part Time, and 3% Contract. Highlights an 85% Physical, 6% Hybrid, and 9% Remote job distribution, with an average salary of $93,168 per year, or $44.8 per hour.

WATD Module Development Engineer

INTEL

Vernonia, OR

$148K - $209K/yr

Full-time

Medical, Retirement, PTO

Re-posted 10 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

Job Description

Join the Wafer Assembly Technology Development Group (WATD)


As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies. By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.
Key Responsibilities
- Drive technology development and enablement for both high-volume manufacturing and future technologies.
- Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.
- Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
- Collaborate with equipment and material suppliers to design and implement enabling process technologies.
- Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.
- Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.
- Optimize production efficiency, manufacturing techniques, and output for existing and new products.
- Partner with cross-functional teams to ensure process integration and alignment with project deliverables.


Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.
- OR Master's degree in the same fields with 4+ years of experience.
- OR PhD in the same fields with 2+ years of experience.

Experience listed above should be a combination of the following:


- Development methodologies, statistical process control, and/or data analytics.
- Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.

This position is not eligible for Intel Immigration Sponsorship
Preferred Qualifications
- Experience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging.
- Demonstrated expertise in leading programs from early strategy formation through high-volume production.
- Recognized technical leadership with a proven track record of solving complex engineering challenges.
- Experience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
- Strong collaboration skills with internal and external teams, including yield, operations, and supplier management.
Join Intel's mission to advance the future of semiconductor technology and make a lasting impact on a global scale. Apply now to bring your expertise and passion to our team.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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