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Semiconductor Packaging Jobs in Indiana (NOW HIRING)

Purdue University

Student (2)

West Lafayette, IN · On-site

... semiconductor packaging, with a specific emphasis on 2.5D silicon (Si) interposer technologies. This position is based on the Purdue University campus and provides the intern an opportunity to ...

Purdue University

Student (4)

West Lafayette, IN · On-site

This internship focuses on advancing shared program interests in advanced semiconductor packaging, heterogeneous integration, and advanced thermal cooling solutions relevant to next-generation ...

Bureau Veritas

$35 - $65/hr

... package and an opportunity to play a vital role with a global organization. If you would enjoy ... Indiana Commercial Building Inspector Semiconductor Facility Project | West Lafayette, Indiana Help ...

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Semiconductor Packaging information

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$11

$17

$25

How much do semiconductor packaging jobs pay per hour?

As of Jul 14, 2026, the average hourly pay for semiconductor packaging in Indiana is $17.93, according to ZipRecruiter salary data. Most workers in this role earn between $15.58 and $18.99 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in Semiconductor Packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a Semiconductor Packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.
What are popular job titles related to Semiconductor Packaging jobs in Indiana? For Semiconductor Packaging jobs in Indiana, the most frequently searched job titles are:
What job categories do people searching Semiconductor Packaging jobs in Indiana look for? The top searched job categories for Semiconductor Packaging jobs in Indiana are:
What cities in Indiana are hiring for Semiconductor Packaging jobs? Cities in Indiana with the most Semiconductor Packaging job openings:
Semiconductor Packaging jobs near you
Student (2)

Student (2)

Purdue University

West Lafayette, IN • On-site

Full-time

Re-posted 15 hours ago

Purdue University rating

7.5

Company rating: 7.5 out of 10

Based on 136 frontline employees who took The Breakroom Quiz

273rd of 553 rated colleges and universities

Job description

Student (2)
City: West lafayette
Job Description:
Job Summary
The Purdue Applied Research Institute, LLC (PARI) Microelectronics Lab is seeking a Microelectronics Research Intern to support research and applied engineering efforts in advanced semiconductor packaging, with a specific emphasis on 2.5D silicon (Si) interposer technologies.
This position is based on the Purdue University campus and provides the intern an opportunity to support a PARI project focused on supporting the development of a domestic silicon interposer fabrication capability. PARI's role is to test and characterize prototype and production silicon interposers and apply the lessons learned to develop a Design-For-Test guidebook for design and manufacturability of interposer technologies. The intern will collaborate with PARI subject matter experts (SMEs) to support interposer-focused activities ranging from design evaluation to failure analysis.
Key Responsibilities
Time Commitment - 5 hours per week
Support programmatic activities related to advanced packaging technologies, specifically 2.5D silicon interposers
Participate in interposer design reviews, including evaluation of technical requirements, layouts, and integration considerations
Collaborate closely with PARI SMEs to understand system-level drivers, constraints, and application needs
Assisting in the development of Design For Test best practices
Hands-on test and characterization of silicon interposers
Contribute to documentation of technical findings, design observations, meeting outcomes, test data collection and analysis, and supporting materials
Participate in technical discussions with faculty, researchers, and industry and government partners as appropriate to project needs
Occasional lab work and meetings at the PARI MIcroelectronics Lab in Bloomington, IN.
Education
Enrolled undergraduate or graduate student at Purdue University in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related STEM discipline relevant to microelectronics
Must be a student member of SCALE
Completion of at least one year of academic coursework by the start of the internship
Experience
US Citizenship is a requirement to be fully considered for this position
Demonstrated understanding of semiconductor fabrication processes, including lithography, deposition, etching, and material characterization
Ability to work effectively both independently and as part of a multidisciplinary research team
Strong written and verbal communication skills
Background or coursework in heterogeneous integration or advanced semiconductor packaging
Familiarity with semiconductor device structures, routing, or packaging design concepts
Additional Information
Paid internship position
PARI is an EOE/AA employer. All individuals, including minorities, women, individuals with disabilities, and veterans are encouraged to apply
PARI will not sponsor employment authorization for this position
A background check will be required for employment in this position. Pre-employment checks are required for this position
FLSA: Exempt (Not Eligible For Overtime)
FLSA Status
Non-Exempt

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