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Packaging Engineering Jobs in Arizona (NOW HIRING)

INTEL

Packaging Engineer

Phoenix, AZ

$127K - $179K/yr

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... Minimum Qualifications: • Master's degree in Mechanical Engineering, Materials Science ...

INTEL

Packaging Engineer

Phoenix, AZ

$116K - $163K/yr

BSE degree in Electrical Engineering, Microelectronics Engineering, Material Science Engineering ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...

INTEL

Packaging Engineer

Phoenix, AZ

PhD degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...

INTEL

Packaging Engineer

Phoenix, AZ

Work across organizational boundaries including process engineering, integration and yield. What we offer: We give you opportunities to transform technology and create a better future, by delivering ...

Accroid Inc

Advanced Packaging Engineer

Phoenix, AZ · On-site

Top Mandatory Skills: * 7+ years of advanced semiconductor packaging experience. * Hands-on ... Bachelor'''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics ...

INTEL

Packaging Module Engineer

Phoenix, AZ

By applying scientific and engineering principles, you will design and develop innovative packaging solutions that ensure the secure transportation and optimal performance of Intel's products ...

New

Intel

Packaging Module Engineer

Phoenix, AZ · On-site

By applying scientific and engineering principles, you will design and develop innovative packaging solutions that ensure the secure transportation and optimal performance of Intel's products ...

New

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$94K - $133K/yr

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$85K - $162K/yr

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... PhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field ... Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$115K - $219K/yr

Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... Master's degree in mechanical engineering, Materials Science, Electrical Engineering, Physics ...

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Packaging Engineering information

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How much do packaging engineering jobs pay per hour?

As of Aug 6, 2026, the average hourly pay for packaging engineering in Arizona is $39.48, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a packaging engineer, and why are they important?

To thrive as a Packaging Engineer, you need a solid background in engineering principles, materials science, and packaging design, usually supported by a degree in packaging engineering or a related field. Proficiency with CAD software, packaging simulation tools, and knowledge of regulatory standards are typically required. Strong problem-solving, project management, and communication skills help you collaborate effectively and innovate solutions. These skills ensure product safety, cost efficiency, and compliance throughout the packaging lifecycle.

What are some common challenges packaging engineers face when balancing sustainability with cost and functionality?

Packaging engineers often encounter the challenge of designing solutions that are environmentally friendly while still being cost-effective and meeting product protection requirements. Sustainable materials can sometimes be more expensive or less readily available, and may require adjustments in manufacturing processes. Additionally, engineers must ensure that the chosen packaging maintains product integrity during shipping and storage. Collaboration with suppliers, marketing, and manufacturing teams is essential to find a balance that aligns with company goals and regulatory standards.

What is the difference between Packaging Engineering vs Packaging Technician?

AspectPackaging EngineeringPackaging Technician
CredentialsBachelor's degree in engineering or related fieldTechnical diploma or associate degree
Work EnvironmentDesign, development, and testing of packaging solutionsImplementing and troubleshooting packaging processes
Industry UsageDesigning new packaging systems for productsMaintaining and operating packaging equipment
Common Search IntentUnderstanding roles in packaging design and developmentLearning about packaging process support and technical tasks

Packaging Engineering focuses on designing and developing packaging solutions, requiring engineering knowledge and design skills. Packaging Technicians support these systems by implementing and maintaining packaging processes, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and qualifications.

What is packaging engineering?

Packaging engineering is a specialized field of engineering that focuses on the design, development, testing, and production of packaging for products. Packaging engineers work to ensure that products are protected, preserved, and presented in a way that is efficient, cost-effective, and sustainable. They consider factors such as materials, manufacturing processes, safety regulations, and environmental impact. This role often involves collaboration with product designers, manufacturers, and marketing teams to create packaging solutions that meet both functional and aesthetic requirements.

What does a packaging engineer do?

A packaging engineer designs and develops packaging solutions to protect products during storage, handling, and transportation. They analyze materials, create prototypes, and ensure compliance with safety and industry standards, often using CAD software and testing methods. Their work helps optimize packaging for cost, sustainability, and efficiency.
What are the most commonly searched types of Packaging Engineering jobs in Arizona? The most popular types of Packaging Engineering jobs in Arizona are:
What are popular job titles related to Packaging Engineering jobs in Arizona? For Packaging Engineering jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Packaging Engineering jobs in Arizona look for? The top searched job categories for Packaging Engineering jobs in Arizona are:
Packaging Engineering jobs near you
Infographic showing various Packaging Engineering job openings in Arizona as of August 2026, with employment types broken down into 87% Full Time, 7% Part Time, 5% Contract, and 1% Nights. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $82,118 per year, or $39.5 per hour.

Packaging Engineer

INTEL

Phoenix, AZ

$127K - $179K/yr

Full-time

Medical, Retirement, PTO

Posted 13 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers

Job description

Job Description

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.


As a Packaging Module Development Engineer, you will:


• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate should demonstrate:


• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.


Qualifications

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:


• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.


• Experience listed above should be a combination of the following:

Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Preferred Qualifications:


One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

What Intel employees say

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Benefits

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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