Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... Minimum Qualifications: • Master's degree in engineering, physics, chemistry or related STEM ...
Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... Minimum Qualifications: • Master's degree in engineering, physics, chemistry or related STEM ...
Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel's future assembly packaging platform technologies. Optimizes manufacturing processes to ...
Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel's future assembly packaging platform technologies. Optimizes manufacturing processes to ...
Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel's future assembly packaging platform technologies. Optimizes manufacturing processes to ...
Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel's future assembly packaging platform technologies. Optimizes manufacturing processes to ...
Develop packaging technology roadmap for AI XPU, XPU-attach and Switch * Explore technologies ... Deep knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as ...
Develop packaging technology roadmap for AI XPU, XPU-attach and Switch * Explore technologies ... Deep knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as ...
Develop packaging technology roadmap for AI XPU, XPU-attach and Switch * Explore technologies ... Deep knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as ...
Develop packaging technology roadmap for AI XPU, XPU-attach and Switch * Explore technologies ... Deep knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as ...
A knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as ... Evaluating package or PCB designs for challenging electrical requirements * Close interaction with ...
A knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as ... Evaluating package or PCB designs for challenging electrical requirements * Close interaction with ...
A knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as ... Evaluating package or PCB designs for challenging electrical requirements * Close interaction with ...
A knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as ... Evaluating package or PCB designs for challenging electrical requirements * Close interaction with ...
Minimum Qualifications: * BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field * 7+ years of experience as a process or packaging engineer in ...
Minimum Qualifications: * BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field * 7+ years of experience as a process or packaging engineer in ...
Minimum Qualifications: * BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field * 7+ years of experience as a process or packaging engineer in ...
Minimum Qualifications: * BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field * 7+ years of experience as a process or packaging engineer in ...
Minimum Qualifications: * BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field * 7+ years of experience as a process or packaging engineer in ...
Minimum Qualifications: * BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field * 7+ years of experience as a process or packaging engineer in ...
Packaging Designer
Chandler, AZ · On-site
Tessolve Semiconductors, a venture of Hero Electronix, is a Design and Test Engineering Service ... Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. We have a global presence ...
Packaging Designer
Chandler, AZ · On-site
Tessolve Semiconductors, a venture of Hero Electronix, is a Design and Test Engineering Service ... Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. We have a global presence ...
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving ... Engineering, or a STEM related field Experience listed above should be in the following:
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving ... Engineering, or a STEM related field Experience listed above should be in the following:
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving ... Engineering, or a STEM related field Experience listed above should be in the following:
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving ... Engineering, or a STEM related field Experience listed above should be in the following:
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
IC Packaging Design Engineer Experience: Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP) Candidates should have ...
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
IC Packaging Design Engineer Experience: Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP) Candidates should have ...
Bachelor's or Master's degree in Electrical, Mechanical Engineering or related field with 1 year of experience. * Experience mentioned above should be in the following areas: * Package design tools ...
Bachelor's or Master's degree in Electrical, Mechanical Engineering or related field with 1 year of experience. * Experience mentioned above should be in the following areas: * Package design tools ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
Bachelor's or Master's degree in Electrical, Mechanical Engineering or related field with 1 year of experience. * Experience mentioned above should be in the following areas: * Package design tools ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
Bachelor's or Master's degree in Electrical, Mechanical Engineering or related field with 1 year of experience. * Experience mentioned above should be in the following areas: * Package design tools ...
Packaging Technician
Yuma, AZ · On-site
$25/hr
Experience with operation, troubleshooting and programing of various Ishida Scales (Models NZ, RZ.M ... I year or more experience in Packaging Mechanic within a produce processing plant or related ...
Packaging Technician
Yuma, AZ · On-site
$25/hr
Experience with operation, troubleshooting and programing of various Ishida Scales (Models NZ, RZ.M ... I year or more experience in Packaging Mechanic within a produce processing plant or related ...
ADCE Packaging Design Architect
Phoenix, AZ · On-site
$220K - $311K/yr
Self-motivated engineer who has strong technical background in design and electrical analysis. * Solid background in semiconductor fabrication and packaging * Strong analytical ability and problem ...
ADCE Packaging Design Architect
Phoenix, AZ · On-site
$220K - $311K/yr
Self-motivated engineer who has strong technical background in design and electrical analysis. * Solid background in semiconductor fabrication and packaging * Strong analytical ability and problem ...
Holds a technical leadership role on the packaging functional team by developing and inspiring technical competency. Provides clear technical direction and sets priorities for package engineering ...
Holds a technical leadership role on the packaging functional team by developing and inspiring technical competency. Provides clear technical direction and sets priorities for package engineering ...
Application Packaging Specialist
Phoenix, AZ · On-site
$50K - $80K/yr
... with developers to understand and analyze technical requirements for installer creation. • ... packages, .exe installers, .msp patches, and hotfixes/updates. • Develop advanced installer ...
Application Packaging Specialist
Phoenix, AZ · On-site
$50K - $80K/yr
... with developers to understand and analyze technical requirements for installer creation. • ... packages, .exe installers, .msp patches, and hotfixes/updates. • Develop advanced installer ...
Packaging Engineering information
See Arizona salary details
$18.37 - $22.38
2% of jobs
$22.38 - $26.39
6% of jobs
$30.22 is the 25th percentile. Wages below this are outliers.
$26.39 - $30.40
17% of jobs
$30.40 - $34.42
16% of jobs
The median wage is $36.42 / hr.
$34.42 - $38.43
16% of jobs
$38.43 - $42.44
12% of jobs
$44.35 is the 75th percentile. Wages above this are outliers.
$42.44 - $46.45
11% of jobs
$46.45 - $50.46
6% of jobs
$50.46 - $54.48
5% of jobs
$54.48 - $58.49
4% of jobs
$58.49 - $62.50
3% of jobs
$18
$39
$62
How much do packaging engineering jobs pay per hour?
What are the key skills and qualifications needed to thrive as a Packaging Engineer, and why are they important?
What can you do with a packaging engineering degree?
What engineers make $500,000?
What are some common challenges packaging engineers face when balancing sustainability with cost and functionality?
What is the difference between Packaging Engineering vs Packaging Technician?
| Aspect | Packaging Engineering | Packaging Technician |
|---|---|---|
| Credentials | Bachelor's degree in engineering or related field | Technical diploma or associate degree |
| Work Environment | Design, development, and testing of packaging solutions | Implementing and troubleshooting packaging processes |
| Industry Usage | Designing new packaging systems for products | Maintaining and operating packaging equipment |
| Common Search Intent | Understanding roles in packaging design and development | Learning about packaging process support and technical tasks |
Packaging Engineering focuses on designing and developing packaging solutions, requiring engineering knowledge and design skills. Packaging Technicians support these systems by implementing and maintaining packaging processes, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and qualifications.
What engineers make $300,000 a year?
What is packaging engineering?
What does a packaging engineer do?

Full-time
Medical, Retirement, PTO
This job post has expired today. Applications are no longer accepted.
Intel rating
8.7
Based on 144 frontline employees who took The Breakroom Quiz
10th of 139 rated electronics manufacturers
Job description
Job Description:
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
As a Packaging Module Development Engineer, you will.
• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate will demonstrate:
• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.
Qualifications:
Qualifications:
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
• Master's degree in engineering, physics, chemistry or related STEM field with 3+ years of industry experience or PhD with one or more years in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
• Minimum cumulative GPA of 3.5.
• Must have the required degree prior to your start date.
• Experience in programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts
Preferred Qualifications:
One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.
Interview Tips here.
By applying to this posting your resume and profile will become visible to Intel Recruiters and will allow them to consider you for current and future job openings aligned with the skills and positions mentioned above.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
o Intel Benefits: https://www.intel.com/content/www/us/en/jobs/benefits.html
o Life Inside Intel: https://www.intel.com/content/www/us/en/jobs/life-at-intel.html
o Interviewing Tips: https://www.intel.com/content/www/us/en/jobs/hiring.html
Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968