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Packaging Engineering Jobs in Arizona (NOW HIRING)

Intel

Silicon Packaging Design Engineer

Phoenix, AZ

$135K/yr

Partner closely with package design, test engineering, and validation teams to define board requirements and optimize package-board interactions. * Develop and validate board connectivity, ensuring ...

Intel

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$135K/yr

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving ... Engineering, or a STEM related field Experience listed above should be in the following:

Church Brothers Farms

Packaging Technician

Yuma, AZ · On-site

$25/hr

Experience with operation, troubleshooting and programing of various Ishida Scales (Models NZ, RZ.M ... I year or more experience in Packaging Mechanic within a produce processing plant or related ...

Marvell

Advanced Packaging Design Engineer

Chandler, AZ

$133K/yr

Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance ...

Pro Mach

Packaging Sales Engineer

Phoenix, AZ · On-site

$15K - $50K/mo

Our Packaging Sales Engineers are self-motivated, savvy strategists who strive to understand their ... Internal Coordination & Administration • Communicate customer feedback to engineering and ...

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Packaging Engineering information

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How much do packaging engineering jobs pay per hour?

As of Aug 6, 2026, the average hourly pay for packaging engineering in Arizona is $39.48, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a packaging engineer, and why are they important?

To thrive as a Packaging Engineer, you need a solid background in engineering principles, materials science, and packaging design, usually supported by a degree in packaging engineering or a related field. Proficiency with CAD software, packaging simulation tools, and knowledge of regulatory standards are typically required. Strong problem-solving, project management, and communication skills help you collaborate effectively and innovate solutions. These skills ensure product safety, cost efficiency, and compliance throughout the packaging lifecycle.

What are some common challenges packaging engineers face when balancing sustainability with cost and functionality?

Packaging engineers often encounter the challenge of designing solutions that are environmentally friendly while still being cost-effective and meeting product protection requirements. Sustainable materials can sometimes be more expensive or less readily available, and may require adjustments in manufacturing processes. Additionally, engineers must ensure that the chosen packaging maintains product integrity during shipping and storage. Collaboration with suppliers, marketing, and manufacturing teams is essential to find a balance that aligns with company goals and regulatory standards.

What is the difference between Packaging Engineering vs Packaging Technician?

AspectPackaging EngineeringPackaging Technician
CredentialsBachelor's degree in engineering or related fieldTechnical diploma or associate degree
Work EnvironmentDesign, development, and testing of packaging solutionsImplementing and troubleshooting packaging processes
Industry UsageDesigning new packaging systems for productsMaintaining and operating packaging equipment
Common Search IntentUnderstanding roles in packaging design and developmentLearning about packaging process support and technical tasks

Packaging Engineering focuses on designing and developing packaging solutions, requiring engineering knowledge and design skills. Packaging Technicians support these systems by implementing and maintaining packaging processes, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and qualifications.

What is packaging engineering?

Packaging engineering is a specialized field of engineering that focuses on the design, development, testing, and production of packaging for products. Packaging engineers work to ensure that products are protected, preserved, and presented in a way that is efficient, cost-effective, and sustainable. They consider factors such as materials, manufacturing processes, safety regulations, and environmental impact. This role often involves collaboration with product designers, manufacturers, and marketing teams to create packaging solutions that meet both functional and aesthetic requirements.

What does a packaging engineer do?

A packaging engineer designs and develops packaging solutions to protect products during storage, handling, and transportation. They analyze materials, create prototypes, and ensure compliance with safety and industry standards, often using CAD software and testing methods. Their work helps optimize packaging for cost, sustainability, and efficiency.
What are the most commonly searched types of Packaging Engineering jobs in Arizona? The most popular types of Packaging Engineering jobs in Arizona are:
What are popular job titles related to Packaging Engineering jobs in Arizona? For Packaging Engineering jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Packaging Engineering jobs in Arizona look for? The top searched job categories for Packaging Engineering jobs in Arizona are:
Packaging Engineering jobs near you
Infographic showing various Packaging Engineering job openings in Arizona as of August 2026, with employment types broken down into 87% Full Time, 7% Part Time, 5% Contract, and 1% Nights. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $82,118 per year, or $39.5 per hour.

Packaging Module Equipment Development Engineer

Intel

Phoenix, AZ • On-site

$133K - $188K/yr

Full-time

Medical, Retirement, PTO

This job post has expired today. Applications are no longer accepted.

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers

Job description

Job Details:Job Description: 

Job Description:


The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:
Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms.
Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
Innovating next generation equipment, materials and fabrication processes to enhance semiconductor packaging capabilities at scale.
Managing projects to meet product development timelines.
Applying formal education and judgment to solve technical problems.
Providing sustaining support for equipment performance and process health in high-volume manufacturing.
Responding promptly to foundry customer requests and events.
The ideal candidate will demonstrate:
Technical leadership, strategic planning, and critical thinking.
Ability to coach and develop technical teams.
Tolerance for ambiguity and adaptability in a dynamic environment.
Flexibility in managing changing priorities and responsibilities.
Experience leading teams in a highly matrixed organization.
Initiative and ability to work independently.
Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.
Minimum Qualifications


PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 6+ months of relevant experience
Minimum GPA of 3.5
At least one publication in a peer-reviewed technical journal.
Must have the required degree prior to your start date.

Relevant experience and deep understanding in solid mechanics applying thermal mechanical coupling behaviors into degradation. (Thermal Cycling impact)


Preferred Qualifications
One or more years of experience in any of the following:
Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE).
Delivering results for complex, time-critical technical projects.
Semiconductor fabrication processes and technology.
Previous related work experience in a semiconductor foundry.

Job Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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