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Semiconductor Packaging Engineer Jobs in Arizona

INTEL

Packaging Module Engineer

Phoenix, AZ

The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel ... Familiarity with semiconductor device fabrication processes and packaging process flows. * A track ...

Intel

Packaging Module Engineer

Phoenix, AZ · On-site

By applying scientific and engineering principles, you will design and develop innovative packaging ... Familiarity with semiconductor device fabrication processes and packaging process flows. * A track ...

Intel Corporation

Packaging Module Engineer

Phoenix, AZ · On-site

By applying scientific and engineering principles, you will design and develop innovative packaging ... Familiarity with semiconductor device fabrication processes and packaging process flows. * A track ...

Intel

Quality Reliability Engineer

Phoenix, AZ · On-site

$101K - $128K/yr

The Board-Level Quality and Reliability Engineer is responsible for ensuring the quality ... Experience in semiconductor package, board-level, or electronic system reliability. Knowledge of ...

New

Intel Corporation

Quality Reliability Engineer

Phoenix, AZ · On-site

$101K - $128K/yr

The Board-Level Quality and Reliability Engineer is responsible for ensuring the quality ... Experience in semiconductor package, board-level, or electronic system reliability. Knowledge of ...

INTEL

Yield Engineer

Phoenix, AZ

$127K - $179K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...

INTEL

Process Integration Engineer

Phoenix, AZ

$127K - $179K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...

INTEL

Seniconductor Process Engineer

Phoenix, AZ

$127K - $179K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...

INTEL

Process Engineer - RF Test

Phoenix, AZ

$127K - $179K/yr

... semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within ... As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ...

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All JobsSemiconductor Packaging Engineer JobsSemiconductor Packaging Engineer Jobs in Arizona

Semiconductor Packaging Engineer information

See Arizona salary details

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How much do semiconductor packaging engineer jobs pay per hour?

As of Aug 8, 2026, the average hourly pay for semiconductor packaging engineer in Arizona is $39.48, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are the key skills and qualifications needed to thrive as a semiconductor packaging engineer?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What does a semiconductor packaging engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are some common challenges semiconductor packaging engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.
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Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in Arizona as of August 2026, with employment types broken down into 90% Full Time, 5% Part Time, and 5% Contract. Highlights an 86% Physical, 5% Hybrid, and 9% Remote job distribution, with an average salary of $82,118 per year, or $39.5 per hour.

Principal Engineer, Electrical Engineering - Advanced Packaging

ASM

Phoenix, AZ • On-site

$138K - $168K/yr

Full-time

Re-posted 12 days ago

Job description

Role Overview 

The Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.). This role drives system-level electrical design excellence, ensures compliance with industry standards, and partners closely with systems, mechanical, process, and manufacturing teams to deliver robust, scalable, and high-performance tools. 

Key Responsibilities 

  • Define and own the electrical system architecture for advanced packaging semiconductor tools, including power distribution, grounding, EMC/EMI, controls, and safety systems. 
  • Develop and decompose electrical requirements for subsystems such as RF power delivery, motion control, sensors, PLC/safety systems, and mixed-signal electronics. 
  • Lead system and electrical design reviews (SRR, PDR, CDR). 
  • Ensure compliance with SEMI standards, CE/UL, EMC, and safety regulations. 
  • Collaborate with systems engineering to align architecture and requirements. 
  • Partner with process engineering to correlate electrical behavior with wafer performance. 
  • Lead root cause analysis of electrical and electromechanical issues. 
  • Drive DFMEA/FMEA, reliability analysis, and risk mitigation. 
  • Mentor engineers and establish best practices. 
  • Support product roadmap planning and innovation. 
  • Work with manufacturing and supply chain for scalability and robustness. 

Required Qualifications 

  • Bachelor's or Master's degree in Electrical Engineering or related field. 
  • 10+ years of experience in semiconductor capital equipment. 
  • Expertise in RF systems, motion control, power distribution, or safety systems. 
  • Knowledge of SEMI standards, CE/UL, and EMC regulations. 
  • Experience with requirements management and FMEA. 
  • Proven technical leadership in complex programs. 

Preferred Qualifications 

  • Experience with advanced packaging tools. 
  • Familiarity with PLCs and real-time control systems. 
  • Experience in certification and field issue resolution. 
  • Track record of influencing product architecture. 

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