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Ic Packaging Engineer Jobs (NOW HIRING)

Apple

IC Packaging Engineer - WLP

San Francisco, CA · On-site

Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this ...

Apple

IC Packaging Engineer - WLP

San Francisco, CA · On-site

Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role ...

Apple

IC Packaging Engineer - WLP

Bodega Bay, CA

$129K - $225K/yr

  • Medical

  • Dental

  • Retirement

Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this ...

Apple

IC Packaging Engineer - WLP

Bodega Bay, CA

$184K - $324K/yr

  • Medical

  • Dental

  • Retirement

Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role ...

Apple

IC Packaging Integration Engineer

Austin, TX · On-site

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead ...

Qualcomm

Principal IC Packaging Engineer

San Diego, CA · On-site

We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product ...

Axiado

Senior IC Packaging Engineer

San Jose, CA · On-site

$122K - $168K/yr

Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup ...

Apple Inc.

IC Packaging Integration Engineer

Austin, TX · On-site

$120 - $150/hr

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description * You will be responsible for IC packaging development * Work with cross‑functional teams and lead ...

Apple

IC Packaging Integration Engineer

Austin, TX

$184K - $324K/yr

  • Medical

  • Dental

  • Retirement

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead ...

Apple

IC Packaging Integration Engineer

Austin, TX

$184K - $324K/yr

  • Medical

  • Dental

  • Retirement

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead ...

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Ic Packaging Engineer information

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How much do ic packaging engineer jobs pay per hour?

As of Aug 13, 2026, the average hourly pay for ic packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is an IC Packaging Engineer?

An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer?

To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.

What does an IC Packaging Engineer do?

IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.

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Ic Packaging Engineer jobs near you
Infographic showing various Ic Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 92% Full Time, 2% Part Time, and 6% Contract. Highlights an 86% Physical, 5% Hybrid, and 9% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

IC Packaging Engineer - WLP

Apple

San Francisco, CA • On-site

Full-time

Posted 15 days ago

Apple rating

8.0

Company rating: 8.0 out of 10

Based on 677 frontline employees who took The Breakroom Quiz

7th of 30 rated technology retailers

Job description

Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this role, you will contribute to package concept exploration, support package selection and configuration studies, and grow into ownership of package integration across SoC and advanced packaging projects.
Description
Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.
Minimum Qualifications
Minimum requirement of a bachelors degree
Preferred Qualifications
MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab.
Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards.
Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level
General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
Ability to work independently and orchestrate projects with cross functional teams
Solution-oriented mindset with strong fundamentals in engineering physics
Good program management skills.

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About Apple

Sourced by ZipRecruiter

Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Cupertino, CA, US

Year founded

1976

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