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Ic Packaging Engineer Jobs (NOW HIRING)

Broadcom

IC Package Design / Development

Irvine, CA · On-site

$108K - $192K/yr

... IC Packaging Engineer to drive next-generation package architecture, design, and productization ... using advanced node silicon (7nm, 5nm, 3nm and beyond). This role partners closely with chip design ...

Apple

Package Integration Engineer

San Francisco, CA · On-site

$122K - $164K/yr

Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets ...

Apple

Package Integration Engineer

Bodega Bay, CA

$181K - $318K/yr

Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.

Qualcomm

Senior Packaging Engineer

San Diego, CA · On-site

$127K - $190K/yr

The IC Package Engineering (PKGE) team is responsible for developing and deploying advanced packaging technologies to meet increasingly demanding performance, reliability, and system integration ...

Apple

IC Packaging Simulation Engineer

Austin, TX · On-site

We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... of IC packages to provide a comprehensive understanding of chip-package interaction and package ...

Apple

IC Packaging Simulation Engineer

Austin, TX · On-site

We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... In this role, you will be working on stress and deformation simulation of IC packages to provide a ...

Qualcomm

Staff Packaging Engineer

San Diego, CA · On-site

We are seeking a highly motivated Staff Packaging Engineer with the capability to lead advanced integrated circuit (IC) packaging development and manage the introduction of new product technologies.

Apple

Packaging Assembly Engineer

Austin, TX · On-site

We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip ...

Etched

IC Package Engineer

Cupertino, CA

$2K/mo

Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2K/mo

Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2K/mo

Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...

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Ic Packaging Engineer information

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How much do ic packaging engineer jobs pay per hour?

As of Jun 9, 2026, the average hourly pay for ic packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is an IC Packaging Engineer job?

An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.

What are the key skills and qualifications needed to thrive in the Ic Packaging Engineer position, and why are they important?

To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.

What are the typical daily responsibilities of an IC Packaging Engineer?

IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.

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What cities are hiring for Ic Packaging Engineer jobs? Cities with the most Ic Packaging Engineer job openings:
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Ic Packaging Engineer jobs near you
Infographic showing various Ic Packaging Engineer job openings in the United States as of May 2026, with employment types broken down into 1% As Needed, 54% Full Time, 3% Part Time, 1% Temporary, 38% Contract, and 3% Nights. Highlights an 90% Physical, 3% Hybrid, and 7% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.
Packaging Engineer ll

Packaging Engineer ll

Rochester Electronics LLC

Newburyport, MA

Other

Medical, Dental, Vision, Retirement, PTO

Posted 19 days ago

Job description

Rochester Electronics is hiring immediately for Packaging Engineers!

For the last 40 years, Rochester Electronics, in partnership with over 70 leading semiconductor manufacturers, has provided our valued customers with a continuous source of critical semiconductors. As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world's most extensive range of end-of-life (EOL) and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester can manufacture over 70,000 device types.

At Rochester Electronics, we create an excellent employee experience focused on value, performance, motivation, recognition, and career growth. Many companies say their employees are their most important asset. At Rochester Electronics, we mean it! Our benefits include but are not limited to the following:

  • Outstanding low-cost medical, dental, vision, and prescription drug coverage, Rochester pays 92% of the premiums on behalf of its full-time employees
  • Paid time off, including vacation, sick, and holiday
  • 100% Rochester-funded Profit-Sharing program
  • Two-tier Rochester match 401K program
  • Tuition reimbursement
  • Flexible spending account

And so much more!

Packaging Engineer General Summary

The Packaging Engineer II is responsible for executing semiconductor packaging projects on future and existing product formats to support the manufacturing operations to ensure customer service, profitability, and continuous improvement. This role provides package design, materials development, and sustaining support for semiconductor assemblies.

Packaging Engineer Responsibilities

  • Manage and develop materials suppliers and processes for high-reliability applications.
  • Establish material specifications and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Working knowledge in materials characterization and analysis.
  • General understanding of assembly processes, IC packaging materials, reliability standards, and FA techniques.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Actively interact with Program Managers, Engineering, Quality, OSAT and suppliers to promptly provide robust and reliable components.

Packaging Engineer Basic Qualifications

  • Master's Degree or Bachelor's Degree in Packaging Engineering (preferred), Materials Engineering, Mechanical Engineering, Industrial Engineering, Manufacturing Engineering, or a related engineering field.

 Packaging Engineer Preferred Qualifications

  • Analytical and problem-solving skills with the willingness to lead and work effectively with a team.
  • Comprehensive understanding of multiple relevant packaging technologies (FC-BGA, large BGA, SiP, leadframe, and Hermetic packages)
  • Reputation and track record for having a can-do attitude and a customer-first mindset.
  • Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
  • Ability to work independently and take on projects with minimum supervision.
  • Good engineering problem-solving skills with strong engineering physics and fundamentals.
  • Mentor junior-level employees on tool operation and best practice assembly techniques

Rochester Electronics is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability status, age, veteran status, or other characteristics protected by applicable law. Rochester Electronics is committed to a culturally diverse workforce.

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