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Ic Packaging Engineer Jobs (NOW HIRING)

Apple

IC Packaging Integration Engineer

Bodega Bay, CA

$184K - $324K/yr

We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...

Apple

Package Integration Engineer

San Francisco, CA · On-site

$122K - $164K/yr

Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.

Analog Devices

Staff Semi Packaging Engineer

San Jose, CA · On-site

$130K - $188K/yr

IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...

Analogdevices

Staff Semi Packaging Engineer

San Jose, CA

$130K - $188K/yr

IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...

Apple

Package Integration Engineer

Bodega Bay, CA

$184K - $324K/yr

Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.

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How much do ic packaging engineer jobs pay per hour?

As of Aug 13, 2026, the average hourly pay for ic packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is an IC Packaging Engineer?

An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer?

To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.

What does an IC Packaging Engineer do?

IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.

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Ic Packaging Engineer jobs near you
Infographic showing various Ic Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 92% Full Time, 2% Part Time, and 6% Contract. Highlights an 86% Physical, 5% Hybrid, and 9% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Senior IC Packaging Development Engineer

Nvidia Corporation

Santa Clara, CA • On-site

Full-time

Re-posted 6 hours ago

Nvidia rating

9.6

Company rating: 9.6 out of 10

Based on 17 frontline employees who took The Breakroom Quiz

7th of 244 rated software companies

Job description

We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This will include planning & driving related R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction. Prior knowledge of Package related Failure Analysis is beneficial.
What you will be doing:
  • Package Development & Prototyping: Drive the process, mechanical, thermal, and material evaluation of the latest IC packages. Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging architectures from concept to small volume for FA and NPI use cases.
  • Material Characterization: Pioneer new packaging & die-level processing methodologies and evaluate innovative packaging materials (e.g., molding compounds, substrates, adhesives).
  • Failure Analysis & Debug: Coordinate comprehensive physical and electrical failure analysis on prototype builds, reliability-tested components to determine root causes of failures.
  • Multi-functional Collaboration: You'll be embedded into the IC Failure Analysis team and collaborate with IC & Package design teams, process & product engineering. Collaborate with foundries and OSAT (Outsourced Semiconductor Assembly and Test) partners to develop & test the required processes, tooling, and workflows.

What we need to see:
  • B.S., M.S., or Ph.D., or equivalent experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.
  • Packaging Expertise: Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.
  • Experience: 12+ years of hands-on experience in IC packaging development and/or package design, NPI (New Product Introduction).
  • Design & Simulation Tools: Familiarity with IC package EDA software (e.g., Cadence Allegro Package Designer) and Finite Element Modeling (FEM) tools like ANSYS or ABAQUS is a strong plus.
  • FA Tooling Proficiency: At a minimum, you'll need basic understanding of advanced packaging related FA techniques and equipment, such as SEM, EDX, CSAM, X-Ray, and LIT.

With competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. If you're creative and autonomous with a real passion for your work, we want to hear from you!
Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 270,250 USD for Level 5, and 216,000 USD - 345,000 USD for Level 6.
You will also be eligible for equity and benefits.
Applications for this job will be accepted at least until July 19, 2026.
This posting is for an existing vacancy.
NVIDIA uses AI tools in its recruiting processes.
NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

What Nvidia employees say

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Hours and flexibility

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Get the full story on Breakroom

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About Nvidia

Sourced by ZipRecruiter

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It's a unique legacy of innovation that's fueled by great technology--and amazing people. Today, we're tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what's never been done before takes vision, innovation, and the world's best talent.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1993

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