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Ic Packaging Engineer Jobs (NOW HIRING)

Apple

IC Packaging Simulation Engineer

Austin, TX · On-site

We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...

Apple

IC Packaging Simulation Engineer

Austin, TX · On-site

We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...

Apple

Packaging Assembly Engineer

Austin, TX · On-site

We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

  • Medical

  • Dental

  • Vision

Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

  • Medical

  • Dental

  • Vision

Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...

Etched

IC Package Engineer

Cupertino, CA

$2.0K/mo

Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...

Broadcom

IC Package Thermal Mechanical Engineer

Irvine, CA · On-site

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

As an IC Package Engineer, you will leverage advanced multiphysics simulations to optimize ... Deep understanding of electronic packaging structures and advanced materials. Ability to evaluate ...

Apple

IC Packaging Simulation Engineer

Austin, TX

$129K - $225K/yr

  • Medical

  • Dental

  • Retirement

We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:

Apple

IC Packaging Simulation Engineer

Austin, TX

$184K - $324K/yr

  • Medical

  • Dental

  • Retirement

We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:

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Ic Packaging Engineer information

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How much do ic packaging engineer jobs pay per hour?

As of Aug 13, 2026, the average hourly pay for ic packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is an IC Packaging Engineer?

An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer?

To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.

What does an IC Packaging Engineer do?

IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.

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Ic Packaging Engineer jobs near you
Infographic showing various Ic Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 92% Full Time, 2% Part Time, and 6% Contract. Highlights an 86% Physical, 5% Hybrid, and 9% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

IC Packaging Integration Engineer

Apple Inc.

Santa Clara, CA • On-site

$150 - $210/hr

Other

Posted 5 days ago

Apple rating

8.0

Company rating: 8.0 out of 10

Based on 677 frontline employees who took The Breakroom Quiz

7th of 30 rated technology retailers

Job description

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

Learn about accessibility in Apple’s workplace.

Learn about reasonable accommodations for job applicants.

Description
  • You will be responsible for IC packaging development.
  • Work with cross-functional teams and lead SoC Package integration and architecture efforts.
  • Drive the industry with advanced package solutions, new material developments, and specs.
Responsibilities
  • Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements.
  • Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).
  • Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
  • Lead package failure analysis and root cause investigations across multiple domains (wafer level processes, assembly, substrate), process excursions, and drive efficient issues resolution.
  • Apply advanced AI/ML and data analytics techniques to convert complex foundry and OSAT datasets into actionable insights that drive process optimization and yield improvement.
Minimum Qualifications
  • BS and 10+ years of experience in relevant industry experience.
Preferred Qualifications
  • MS/PhD and 6+ years of experience in relevant industry.
  • Someone experienced in the semiconductor packaging and/or system integration.
  • Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration.
  • Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo‑mechanical, reliability, and cost constraints.
  • Excellent problem solving with strong physics and fundamentals.
  • Excellent communication skills that enable the candidate to work well with internal cross‑functional teams and overseas suppliers.
  • Basic knowledge of signal integrity/power integrity.
  • Ability to review schematics, package/PCB layout and designs in Allegro.

Apple accepts applications to this posting on an ongoing basis.

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About Apple

Sourced by ZipRecruiter

Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Cupertino, CA, US

Year founded

1976

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