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Ic Packaging Engineer Jobs in Georgia (NOW HIRING)

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:

Falcomm

Senior IC Packaging Designer

Atlanta, GA

$98K - $104K/yr

The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

The position requires close collaboration with RFIC designers, layout engineers, testing teams, and ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:

Falcomm

Senior RFIC Layout Engineer

Atlanta, GA

$100K - $138K/yr

This role focuses on developing high-quality IC layouts for RF front-end circuits while ensuring ... Collaborate with cross-functional teams including RF design, packaging, and testing. * Document ...

Falcomm

Senior RFIC Layout Engineer

Atlanta, GA · On-site

$100K - $138K/yr

This role focuses on developing high-quality IC layouts for RF front-end circuits while ensuring ... Collaborate with cross-functional teams including RF design, packaging, and testing. * Document ...

Falcomm

Senior RFIC Layout Engineer

Atlanta, GA · On-site

$100K - $138K/yr

This role focuses on developing high-quality IC layouts for RF front-end circuits while ensuring ... Collaborate with cross-functional teams including RF design, packaging, and testing. * Document ...

Falcomm

ASIC Engineer

Atlanta, GA

$159K/yr

Strong experience with RTL design (Verilog/SystemVerilog) and/or analog/mixed-signal IC design ... Benefits * Competitive Salary and Equity Package * Comprehensive Health, Dental, and Vision ...

Falcomm

ASIC Engineer

Atlanta, GA · On-site

$159K/yr

Strong experience with RTL design (Verilog/SystemVerilog) and/or analog/mixed-signal IC design ... Benefits * Competitive Salary and Equity Package * Comprehensive Health, Dental, and Vision ...

Falcomm

ASIC Engineer

Atlanta, GA · On-site

$159K/yr

Strong experience with RTL design (Verilog/SystemVerilog) and/or analog/mixed-signal IC design ... Benefits * Competitive Salary and Equity Package * Comprehensive Health, Dental, and Vision ...

GRVTY

Systems Engineer 2

Fort Eisenhower, GA

... core Intelligence Community (IC) missions. As an application engineer professional in the ... That's why we offer a comprehensive and competitive benefits package designed to support your well ...

GRVTY

Systems Engineer 2

Gordon, GA · On-site

... core Intelligence Community (IC) missions. As an application engineer professional in the ... That's why we offer a comprehensive and competitive benefits package designed to support your well ...

Rambus

SPE Signal Integrity Engineer

Johns Creek, GA · On-site

$133K - $248K/yr

... packaging and PCB routings, IC-PKG-BRD decoupling requirements, channel simulations and jitter ... MS or PhD in Electrical Engineering with 10+ years of industry experience in which at least a few ...

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Ic Packaging Engineer information

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How much do ic packaging engineer jobs pay per hour?

As of Aug 11, 2026, the average hourly pay for ic packaging engineer in Georgia is $35.77, according to ZipRecruiter salary data. Most workers in this role earn between $27.60 and $41.59 per hour, depending on experience, location, and employer.

What is an IC Packaging Engineer?

An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer?

To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.

What does an IC Packaging Engineer do?

IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.

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Ic Packaging Engineer jobs near you
Infographic showing various Ic Packaging Engineer job openings in Georgia as of August 2026, with employment types broken down into 87% Full Time, 6% Part Time, 1% Temporary, and 6% Contract. Highlights an 86% Physical, 5% Hybrid, and 9% Remote job distribution, with an average salary of $74,407 per year, or $35.8 per hour.

Senior IC Packaging Designer

Falcomm

Atlanta, GA • On-site

$98K - $104K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 2 days ago

Job description

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless systems? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver cutting-edge wireless solutions that push the boundaries of performance, efficiency, and integration.
Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III-V MMICs devices into production-ready packages.
Responsibilities:
  • Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages.
  • Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools.
  • Work with signal integrity, EM, and thermal simulation teams to validate package performance.
  • Generate package documentation, fabrication drawings, and assembly specifications.
  • Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield.
  • Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss.
  • Support package integration with PCB design teams to ensure optimal RF performance at the system level.
  • Coordinate with fabrication and assembly partners.

Requirements
  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
  • 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition.
  • Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging.
  • Must be willing to work full-time, onsite, in Atlanta, GA.

Preferred Skills:
  • Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high-speed interface requirements such as DDR or PCIe.
  • Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre.
  • Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows.
  • Ability to build accurate 3-D models of packages using Ansys Electronics Desktop and EM-simulate them in HFSS and run thermal simulations on them with Icepak

Benefits
  • Competitive Salary and Equity Package
  • Comprehensive Health, Dental, and Vision Insurance
  • 401(k) Retirement Plan
  • Paid Time Off (PTO) and Sick Leave

Disclosure:
  • Falcomm is an Equal Opportunity Employer; employment with Falcomm is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
  • Applicants wishing to view a copy of Falcomm's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify Falcomm.
  • To conform to U.S. Government export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State.

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