Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this ...
Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this ...
Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role ...
Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role ...
IC Packaging Engineer - WLP
$129K - $225K/yr
Medical
Dental
Retirement
Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this ...
IC Packaging Engineer - WLP
$129K - $225K/yr
Medical
Dental
Retirement
Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this ...
IC Packaging Engineer - WLP
$184K - $324K/yr
Medical
Dental
Retirement
Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role ...
IC Packaging Engineer - WLP
$184K - $324K/yr
Medical
Dental
Retirement
Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role ...
We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product ...
We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product ...
Senior IC Packaging Engineer
San Jose, CA · On-site
$122K - $168K/yr
Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup ...
Senior IC Packaging Engineer
San Jose, CA · On-site
$122K - $168K/yr
Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup ...
Engineering Group, Engineering Group > Packaging Engineering General Summary: This position is part of Qualcomm's Integrated Circuits (IC) package engineering process team. This role offers unique ...
Engineering Group, Engineering Group > Packaging Engineering General Summary: This position is part of Qualcomm's Integrated Circuits (IC) package engineering process team. This role offers unique ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
IC Packaging Engineer, Materials and Packaging Characterization
$184K - $324K/yr
Medical
Dental
Retirement
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
IC Packaging Engineer, Materials and Packaging Characterization
$184K - $324K/yr
Medical
Dental
Retirement
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
IC Packaging Engineer, Materials and Packaging Characterization
$129K - $225K/yr
Medical
Dental
Retirement
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
IC Packaging Engineer, Materials and Packaging Characterization
$129K - $225K/yr
Medical
Dental
Retirement
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This ...
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This ...
You'll be embedded into the IC Failure Analysis team and collaborate with IC & Package design teams, process & product engineering. Collaboratewith foundries and OSAT (Outsourced Semiconductor ...
You'll be embedded into the IC Failure Analysis team and collaborate with IC & Package design teams, process & product engineering. Collaboratewith foundries and OSAT (Outsourced Semiconductor ...
IC Packaging Integration Engineer
$184K - $324K/yr
Medical
Dental
Retirement
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...
IC Packaging Integration Engineer
$184K - $324K/yr
Medical
Dental
Retirement
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...
Photonic Packaging Engineer, Principal
$205K - $260K/yr
Collaborate with IC packaging, optical connector, and silicon photonics teams to achieve co-design optimization * Build and mentor a high-performing team of packaging engineers and scientists.
Photonic Packaging Engineer, Principal
$205K - $260K/yr
Collaborate with IC packaging, optical connector, and silicon photonics teams to achieve co-design optimization * Build and mentor a high-performing team of packaging engineers and scientists.
Staff Semi Packaging Engineer
$130K - $188K/yr
Medical
Dental
Vision
Retirement
PTO
IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...
Staff Semi Packaging Engineer
$130K - $188K/yr
Medical
Dental
Vision
Retirement
PTO
IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...
Engineering Group, Engineering Group > Packaging Engineering General Summary: This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization and represents a senior leadership ...
Engineering Group, Engineering Group > Packaging Engineering General Summary: This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization and represents a senior leadership ...
Package Integration Engineer
San Francisco, CA · On-site
$122K - $164K/yr
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Package Integration Engineer
San Francisco, CA · On-site
$122K - $164K/yr
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Staff Semi Packaging Engineer
San Jose, CA · On-site
$130K - $188K/yr
Medical
Dental
Vision
Retirement
PTO
IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...
Staff Semi Packaging Engineer
San Jose, CA · On-site
$130K - $188K/yr
Medical
Dental
Vision
Retirement
PTO
IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...
Ic Packaging Engineer information
See California salary details
$19.45 - $23.70
2% of jobs
$23.70 - $27.95
6% of jobs
$32 is the 25th percentile. Wages below this are outliers.
$27.95 - $32.20
17% of jobs
$32.20 - $36.45
16% of jobs
The median wage is $38.57 / hr.
$36.45 - $40.70
16% of jobs
$40.70 - $44.95
12% of jobs
$46.96 is the 75th percentile. Wages above this are outliers.
$44.95 - $49.19
11% of jobs
$49.19 - $53.44
6% of jobs
$53.44 - $57.69
5% of jobs
$57.69 - $61.94
4% of jobs
$61.94 - $66.19
3% of jobs
$19
$41
$66
How much do ic packaging engineer jobs pay per hour?
As of Aug 16, 2026, the average hourly pay for ic packaging engineer in California is $41.81, according to ZipRecruiter salary data. Most workers in this role earn between $32.26 and $48.65 per hour, depending on experience, location, and employer.
What is an IC Packaging Engineer?
An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.
What are the key skills and qualifications needed to thrive as an IC Packaging Engineer?
To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.
What does an IC Packaging Engineer do?
IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.
What are popular job titles related to Ic Packaging Engineer jobs in California?
For Ic Packaging Engineer jobs in California, the most frequently searched job titles are:
What job categories do people searching Ic Packaging Engineer jobs in California look for?
The top searched job categories for Ic Packaging Engineer jobs in California are:
What cities in California are hiring for Ic Packaging Engineer jobs?
Cities in California with the most Ic Packaging Engineer job openings:
Apple rating
8.0
Based on 677 frontline employees who took The Breakroom Quiz
7th of 30 rated technology retailers
Job description
Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this role, you will contribute to package concept exploration, support package selection and configuration studies, and grow into ownership of package integration across SoC and advanced packaging projects.
Description
Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.
Minimum Qualifications
Minimum requirement of a bachelors degree
Preferred Qualifications
MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab.
Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards.
Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level
General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
Ability to work independently and orchestrate projects with cross functional teams
Solution-oriented mindset with strong fundamentals in engineering physics
Good program management skills.
Description
Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.
Minimum Qualifications
Minimum requirement of a bachelors degree
Preferred Qualifications
MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab.
Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards.
Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level
General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
Ability to work independently and orchestrate projects with cross functional teams
Solution-oriented mindset with strong fundamentals in engineering physics
Good program management skills.
About Apple
Sourced by ZipRecruiter
Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Cupertino, CA, US
Year founded
1976