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Principal Packaging Engineer Jobs in California (NOW HIRING)

Skyworks

Principal Packaging Engineer

Irvine, CA · On-site

$129K - $247K/yr

Principal Packaging Engineer Posting Start Date: 3/23/26 Job Location(s): San Jose If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks ...

Skyworks

Principal Packaging Engineer

Irvine, CA

$129K - $247K/yr

We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will ...

MiniMed

Principal Packaging Engineer

Northridge, CA · On-site

$109K - $185K/yr

About the Role Minimed is seeking an experienced Principal Packaging Engineer to manage medical device packaging in both new product introduction and sustaining programs. As part of the packaging ...

MiniMed

Principal Packaging Engineer

Los Angeles, CA · On-site

$109K - $185K/yr

About the Role Minimed is seeking an experienced Principal Packaging Engineer to manage medical device packaging in both new product introduction and sustaining programs. As part of the packaging ...

Lancesoft

Packaging Engineer

Foster City, CA · On-site

$70 - $96.30/hr

... and cold chain principals Working knowledge of temperature-controlled shipping container ... engineering, package engineering, or a related scientific field. Advanced degree(s) with ...

Qualcomm

Principal IC Packaging Engineer

San Diego, CA · On-site

We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product ...

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All JobsPrincipal Packaging Engineer JobsPrincipal Packaging Engineer Jobs in California

Principal Packaging Engineer information

See California salary details

$73K

$145.3K

$209.7K

How much do principal packaging engineer jobs pay per year?

As of Aug 6, 2026, the average yearly pay for principal packaging engineer in California is $145,292.00, according to ZipRecruiter salary data. Most workers in this role earn between $116,900.00 and $170,700.00 per year, depending on experience, location, and employer.

What is a principal packaging engineer?

A Principal Packaging Engineer is a senior-level professional responsible for designing, developing, and optimizing packaging solutions for products. They ensure packaging meets functional, cost, and sustainability requirements while complying with industry regulations. This role involves cross-functional collaboration with manufacturing, supply chain, marketing, and regulatory teams to improve packaging performance and efficiency. Principal Packaging Engineers also lead innovation initiatives, troubleshoot issues, and implement new technologies to enhance packaging design and reduce environmental impact.

What are the typical responsibilities of a principal packaging engineer in a manufacturing environment?

As a Principal Packaging Engineer in a manufacturing setting, you will lead the design, development, and optimization of packaging solutions for new and existing products. This includes collaborating closely with R&D, quality assurance, supply chain, and production teams to ensure packaging meets performance, safety, and sustainability standards. You may also oversee testing, validation, and process improvements, as well as mentor junior engineers and participate in supplier evaluations. These responsibilities are critical for ensuring product integrity, customer satisfaction, and compliance with industry regulations while driving cost-efficiency.

What are the key skills and qualifications needed to thrive as a principal packaging engineer?

To thrive as a Principal Packaging Engineer, you need deep expertise in packaging design, materials science, regulatory compliance, and project management, usually supported by a degree in engineering or a related field. Experience with CAD software, packaging testing protocols, and knowledge of industry standards (such as ISTA or ISO) are highly valuable, along with relevant certifications like Six Sigma or PMP. Exceptional problem-solving ability, leadership, and cross-functional communication skills help you influence teams and manage complex projects. These capabilities are crucial for developing innovative, cost-effective packaging solutions that meet business objectives and regulatory requirements.

What are the most commonly searched types of Principal Packaging Engineer jobs in California? The most popular types of Principal Packaging Engineer jobs in California are:
What are popular job titles related to Principal Packaging Engineer jobs in California? For Principal Packaging Engineer jobs in California, the most frequently searched job titles are:
What job categories do people searching Principal Packaging Engineer jobs in California look for? The top searched job categories for Principal Packaging Engineer jobs in California are:
Principal Packaging Engineer jobs near you
Infographic showing various Principal Packaging Engineer job openings in California as of August 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $145,292 per year, or $69.9 per hour.

Principal Packaging Engineer

Skyworks

Irvine, CA • On-site

$129K - $247K/yr

Full-time

Medical, Retirement, PTO

Re-posted 29 days ago

Job description

Principal Packaging Engineer
Posting Start Date: 3/23/26
Job Location(s): San Jose
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 77070
Job Description:
Description
  • We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will be the RF packaging interface between multi-functional groups within Skyworks and internal/external manufacturing.
  • This position offers significant opportunities for growth, including leading strategic packaging initiatives and influencing Skyworks packaging technology roadmap. Leadership experience, either as a program manager, people manager, or technical lead is a strong plus.
  • On-site location is flexiable. Desired location in San Jose CA or Irvine CA.

Responsibilities
  • Working with IC design teams to define and implement the package requirements.
  • Ownership of specific product from feasibility stage to high volume production.
  • Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
  • Developing new assembly technologies, running process DOE's, identifying new materials and equipment, reliability testing, and qualification of new assembly process.

Required Experience and Skills
  • BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.
  • Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology
  • Strong project management and communication skills (verbal, written, and presentation).
  • Expertise with overmolded laminate module packaging processes: SMT, Wirebonding, Die Attach, and Molding.
  • Knowledge of various assembly processes: Flip Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.
  • Experience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding,
  • Experience working with OSAT Assembly Factories in Asia.

Desired Experience and Skills
  • Solid understanding of Design Rules Check and Design for Manufacturing
  • Hands on experience with assembly process/equipment.
  • Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • Understanding of RF products and concepts is highly desired.
  • Experience with Failure Analysis.
  • Understanding of Module and Board Level Reliability requirements.
  • Understanding of manufacturing of organic laminate technologies.
  • Experience with Lead-Frame Packaging.
  • Prior R&D experience of advanced packaging concepts.

#LI-JR1
The typical base pay range for this role across the U.S. is currently USD $129,400 - $247,800 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
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About Skyworks

Sourced by ZipRecruiter

We are empowering the wireless networking revolution, connecting people, places and things around the world. As the demand for ubiquitous, “always-on” connectivity increasingly expands, our innovative, high performance analog semiconductors are enabling breakthrough communication platforms from global industry leaders – changing the way we live, work, play and learn. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

Industry

Construction

Company size

201 - 500 Employees

Headquarters location

Buffalo, NY, US

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