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Apprentice Principal Packaging Engineer Jobs in California

Skyworks

Principal Packaging Engineer

Irvine, CA · On-site

$129K - $247K/yr

Principal Packaging Engineer Posting Start Date: 3/23/26 Job Location(s): San Jose If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks ...

Skyworks

Principal Packaging Engineer

Irvine, CA

$129K - $247K/yr

We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will ...

MiniMed

Principal Packaging Engineer

Northridge, CA · On-site

$109K - $185K/yr

About the Role Minimed is seeking an experienced Principal Packaging Engineer to manage medical device packaging in both new product introduction and sustaining programs. As part of the packaging ...

MiniMed

Principal Packaging Engineer

Los Angeles, CA · On-site

$109K - $185K/yr

About the Role Minimed is seeking an experienced Principal Packaging Engineer to manage medical device packaging in both new product introduction and sustaining programs. As part of the packaging ...

Lancesoft

Packaging Engineer

Foster City, CA · On-site

$70 - $96.30/hr

... and cold chain principals Working knowledge of temperature-controlled shipping container ... engineering, package engineering, or a related scientific field. Advanced degree(s) with ...

Qualcomm

Principal IC Packaging Engineer

San Diego, CA · On-site

We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product ...

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Apprentice Principal Packaging Engineer information

What is the difference between Apprentice Principal Packaging Engineer vs Packaging Engineer?

AspectApprentice Principal Packaging EngineerPackaging Engineer
Required CredentialsEntry-level, often pursuing or with a degree in packaging or engineeringBachelor's degree in packaging, engineering, or related field
Work EnvironmentTraining-focused, supervised, often in manufacturing or R&D settingsDesign, development, testing, and implementation of packaging solutions
Employer & Industry UsageManufacturers, packaging companies, consumer goods industriesConsumer goods, food & beverage, pharmaceuticals, manufacturing

The Apprentice Principal Packaging Engineer is an entry-level role focused on learning and supporting packaging projects under supervision, while the Packaging Engineer is a more experienced professional responsible for designing and developing packaging solutions independently. Both roles are common in manufacturing and consumer goods industries, but the apprentice position emphasizes training and skill development.

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Apprentice Principal Packaging Engineer jobs near you
Infographic showing various Apprentice Principal Packaging Engineer job openings in California as of June 2026, with employment types broken down into 90% Full Time, 3% Part Time, 3% Temporary, 1% Contract, and 3% Nights. Highlights an 95% Physical, 1% Hybrid, and 4% Remote job distribution.

Principal Packaging Engineer

Skyworks

Irvine, CA • On-site

$129K - $247K/yr

Full-time

Medical, Retirement, PTO

Re-posted yesterday

Job description

Principal Packaging Engineer
Posting Start Date: 3/23/26
Job Location(s): San Jose
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 77070
Job Description:
Description
  • We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will be the RF packaging interface between multi-functional groups within Skyworks and internal/external manufacturing.
  • This position offers significant opportunities for growth, including leading strategic packaging initiatives and influencing Skyworks packaging technology roadmap. Leadership experience, either as a program manager, people manager, or technical lead is a strong plus.
  • On-site location is flexiable. Desired location in San Jose CA or Irvine CA.

Responsibilities
  • Working with IC design teams to define and implement the package requirements.
  • Ownership of specific product from feasibility stage to high volume production.
  • Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
  • Developing new assembly technologies, running process DOE's, identifying new materials and equipment, reliability testing, and qualification of new assembly process.

Required Experience and Skills
  • BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.
  • Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology
  • Strong project management and communication skills (verbal, written, and presentation).
  • Expertise with overmolded laminate module packaging processes: SMT, Wirebonding, Die Attach, and Molding.
  • Knowledge of various assembly processes: Flip Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.
  • Experience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding,
  • Experience working with OSAT Assembly Factories in Asia.

Desired Experience and Skills
  • Solid understanding of Design Rules Check and Design for Manufacturing
  • Hands on experience with assembly process/equipment.
  • Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • Understanding of RF products and concepts is highly desired.
  • Experience with Failure Analysis.
  • Understanding of Module and Board Level Reliability requirements.
  • Understanding of manufacturing of organic laminate technologies.
  • Experience with Lead-Frame Packaging.
  • Prior R&D experience of advanced packaging concepts.

#LI-JR1
The typical base pay range for this role across the U.S. is currently USD $129,400 - $247,800 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
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About Skyworks

Sourced by ZipRecruiter

We are empowering the wireless networking revolution, connecting people, places and things around the world. As the demand for ubiquitous, “always-on” connectivity increasingly expands, our innovative, high performance analog semiconductors are enabling breakthrough communication platforms from global industry leaders – changing the way we live, work, play and learn. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

Industry

Construction

Company size

201 - 500 Employees

Headquarters location

Buffalo, NY, US

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