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Principal Packaging Engineer Jobs in California (NOW HIRING)

Astera Labs

Optical Test Engineer, Principal

San Jose, CA · On-site

$185K - $240K/yr

We are seeking a world-class Senior Staff to Principal Optical Test Engineer to lead the ... Collaborate closely with Silicon Photonics design, package engineering, product engineering, and ...

Microsoft

Principal Product Engineer

Mountain View, CA · On-site

To achieve this goal, the Silicon, Manufacturing, and Packaging Engineering ( SMPE) team is ... We are looking for a Principal Product Engineer to join the team. Responsibilities * Responsible ...

Wood Rodgers

Principal Engineer

Roseville, CA · On-site

$126.50 - $158.10/hr

Principal Engineer Department: Geotechnical Employment Type: Full Time Location: Roseville, CA ... Review PS&E packages for compliance with the project's geotechnical report requirements. A note on ...

Wood Rodgers

Principal Engineer

Sacramento, CA · On-site

$126.50 - $158.10/hr

Principal Engineer Department: Geotechnical Employment Type: Full Time Location: Sacramento, CA ... Review PS&E packages for compliance with the project's geotechnical report requirements. A note on ...

Wood Rodgers Inc.

Principal Engineer

Roseville, CA · On-site

$126K - $158K/yr

Principal Engineer Department: Geotechnical Employment Type: Full Time Location: Roseville, CA ... Review of PS&E packages for compliance with the project's geotechnical report requirements. A note ...

Wood Rodgers

Principal Engineer

Sacramento, CA · On-site

$126K - $158K/yr

Principal Engineer Department: Geotechnical Employment Type: Full Time Location: Sacramento, CA ... Review of PS&E packages for compliance with the project's geotechnical report requirements. A note ...

Wood Rodgers

Principal Engineer

Roseville, CA · On-site

$126K - $158K/yr

Principal Engineer Department: Geotechnical Employment Type: Full Time Location: Roseville, CA ... Review of PS&E packages for compliance with the project's geotechnical report requirements. A note ...

Wood Rodgers Inc.

Principal Engineer

Sacramento, CA · On-site

$126K - $158K/yr

Principal Engineer Department: Geotechnical Employment Type: Full Time Location: Sacramento, CA ... Review of PS&E packages for compliance with the project's geotechnical report requirements. A note ...

Delos Data Inc

Principal Power Design Engineer

Palo Alto, CA · On-site

$112.89 - $169.34/hr

We are seeking a Principal Power Design Engineer to own the design, implementation, and validation ... Work closely with package engineering to ensure clean power delivery handoff at the socket or ...

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Showing results 21-40

All JobsPrincipal Packaging Engineer JobsPrincipal Packaging Engineer Jobs in California

Principal Packaging Engineer information

See California salary details

$73K

$145.3K

$209.7K

How much do principal packaging engineer jobs pay per year?

As of Aug 16, 2026, the average yearly pay for principal packaging engineer in California is $145,292.00, according to ZipRecruiter salary data. Most workers in this role earn between $116,900.00 and $170,700.00 per year, depending on experience, location, and employer.

What is a principal packaging engineer?

A Principal Packaging Engineer is a senior-level professional responsible for designing, developing, and optimizing packaging solutions for products. They ensure packaging meets functional, cost, and sustainability requirements while complying with industry regulations. This role involves cross-functional collaboration with manufacturing, supply chain, marketing, and regulatory teams to improve packaging performance and efficiency. Principal Packaging Engineers also lead innovation initiatives, troubleshoot issues, and implement new technologies to enhance packaging design and reduce environmental impact.

What are the typical responsibilities of a principal packaging engineer in a manufacturing environment?

As a Principal Packaging Engineer in a manufacturing setting, you will lead the design, development, and optimization of packaging solutions for new and existing products. This includes collaborating closely with R&D, quality assurance, supply chain, and production teams to ensure packaging meets performance, safety, and sustainability standards. You may also oversee testing, validation, and process improvements, as well as mentor junior engineers and participate in supplier evaluations. These responsibilities are critical for ensuring product integrity, customer satisfaction, and compliance with industry regulations while driving cost-efficiency.

What are the key skills and qualifications needed to thrive as a principal packaging engineer?

To thrive as a Principal Packaging Engineer, you need deep expertise in packaging design, materials science, regulatory compliance, and project management, usually supported by a degree in engineering or a related field. Experience with CAD software, packaging testing protocols, and knowledge of industry standards (such as ISTA or ISO) are highly valuable, along with relevant certifications like Six Sigma or PMP. Exceptional problem-solving ability, leadership, and cross-functional communication skills help you influence teams and manage complex projects. These capabilities are crucial for developing innovative, cost-effective packaging solutions that meet business objectives and regulatory requirements.

What are the most commonly searched types of Principal Packaging Engineer jobs in California?

The most popular types of Principal Packaging Engineer jobs in California are:

What are popular job titles related to Principal Packaging Engineer jobs in California?

For Principal Packaging Engineer jobs in California, the most frequently searched job titles are:

What job categories do people searching Principal Packaging Engineer jobs in California look for?

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Principal Packaging Engineer jobs near you
Infographic showing various Principal Packaging Engineer job openings in California as of August 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $145,292 per year, or $69.9 per hour.

Principal Systems Packaging & Assembly Engineer

nEye.ai

Santa Clara, CA • Hybrid

$180K - $240K/yr

Full-time

Posted 19 days ago

Job description

About us

nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's OCS is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.

Job Overview

We are seeking a Systems Packaging & Assembly Engineer to lead the development and integration of advanced packaging and assembly solutions for our MEMS-based silicon photonics switching platform.

This role sits at the intersection of device engineering, packaging architecture, manufacturing engineering, and supply chain, driving packaging solutions from concept through high-volume production.

The ideal candidate is a hands-on packaging expert with deep experience in optical modules, MEMS devices, semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional programs with OSATs, contract manufacturers, and internal engineering teams.

This is a highly visible role responsible for bridging R&D and manufacturing, ensuring that our packaging architecture enables scalable production of high-performance optical switching systems.

Key Responsibilities
Package Design & System Integration

  • Define and codesign package substrates for MEMS-based silicon photonics optical switching systems.

  • Lead package and assembly integration of complex multi-component systems which include MEMs devices, photonic ICs, ASICs, substrates, and optical interfaces.

  • Drive mechanical, electrical, and optical integration strategies to ensure system performance, reliability, and manufacturability.

  • Collaborate with photonics, MEMS, electrical, and mechanical teams to define packaging requirements and system interfaces.

Assembly Process Development

  • Optimize assembly processes including die attach, flip-chip, wire bonding, fiber attach/alignment, and hybrid integration.

  • Develop and implement fixtures, jigs, and tooling at our OSATs to support prototype builds and NPI.

  • Establish process flows, BOM structures, and manufacturing documentation for new products.

  • Identify opportunities for yield improvement, cost reduction, and cycle-time optimization.

NPI & Manufacturing Ramp

  • Lead New Product Introduction (NPI) activities from prototype builds through production ramp.

  • Work closely with OSAT partners, contract manufacturers, and suppliers to meet our product requirements.

  • Drive process qualification, yield ramp, and reliability validation.

  • Implement root cause analysis (RCA), corrective actions, and failure analysis workflows.

Supplier & Manufacturing Partner Management

  • Direct involvement with OSATs, substrate vendors, optics suppliers, and strategic partners.

  • Lead technology transfer from engineering to manufacturing partners.

Program Management

  • Act as a technical program manager for packaging and assembly development across multiple engineering teams.

  • Coordinate activities between device engineering, system engineering, manufacturing, reliability, and supply chain.

  • Track program milestones and ensure packaging readiness aligns with product development timelines.

Required Qualifications

  • Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.

  • 15+ years of experience in semiconductor or photonics packaging engineering.

  • Extensive experience in IC package design and back-end assembly process development in a manufacturing environment.

  • Strong background in advanced packaging technologies, such as:

    • Flip-chip and wirebond hybrid assemblies

    • BGA / FCBGA / CSP / WLCSP

    • Multi-die stacking (2.5D / 3D integration)

    • System-in-Package (SiP)

  • Proven experience driving NPI programs from concept to high-volume production.

  • Hands-on experience working with OSATs and contract manufacturers.

  • Strong knowledge of yield improvement, failure analysis, and process development.

  • Demonstrated ability to lead projects and guide engineers as a senior technical contributor.

  • Hands-on expertise with die bonders, dispensers, reflow/TCB tools, wirebonders, and interface metrology (CSAM, X-ray, AOI).

  • Strong background in materials characterization and statistical process control (DOE, FMEA, SPC)

Preferred Experience

  • Experience with fiber attach and photonic IC packaging.

  • Background in optical transceivers, co-packaged optics, or photonics modules.

  • Experience with optical modules, photonics packaging, and/or MEMS devices.

  • Experience with optical alignment and hermetic packaging solutions.

  • Six Sigma certified

  • Familiarity with substrate layout tools and packaging design environments (Cadence SiP, AutoCAD, SolidWorks, etc.)

Starting salary and title will depend on, and be commensurate with, relevant experience, skills, training, education, market demands, and the ultimate job duties and requirements.
nEye is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. 

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.