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Ic Packaging Jobs (NOW HIRING)

Apple

IC Packaging Engineer - WLP

San Francisco, CA · On-site

Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this ...

Teksky

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Senior IC Packaging Engineer

Sunnyvale, CA · On-site

Senior IC Packaging Engineer Job Type: Full-Time Work Arrangement: On-site Job Overview We are seeking a Senior IC Packaging Engineer to lead the architecture, design, development, and optimization ...

New

Apple

IC Packaging Integration Engineer

Austin, TX · On-site

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead ...

Apple

IC Packaging Engineer - WLP

Bodega Bay, CA

$129K - $225K/yr

Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this ...

Apple

IC Packaging Engineer - WLP

San Francisco, CA · On-site

Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role ...

Apple Inc.

IC Packaging Integration Engineer

Austin, TX · On-site

$120 - $150/hr

You will be responsible for IC packaging development * Work with cross‑functional teams and lead SoC Package integration and architecture efforts * Drive the industry with advanced package ...

Apple

IC Packaging Integration Engineer

Austin, TX

$184K - $324K/yr

Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with ...

Apple

IC Packaging Engineer - WLP

Bodega Bay, CA

$184K - $324K/yr

Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role ...

Apple

IC Packaging Integration Engineer

Austin, TX

$184K - $324K/yr

Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with ...

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All JobsIc Packaging Jobs

Ic Packaging information

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How much do ic packaging jobs pay per hour?

As of Aug 9, 2026, the average hourly pay for ic packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What are some common challenges faced by professionals working in IC packaging, and how can job seekers prepare for them?

Professionals in IC packaging often encounter challenges such as keeping up with rapid advancements in packaging technologies, ensuring high yield and reliability, and managing cross-functional communication between design, manufacturing, and testing teams. Job seekers can prepare by staying current with industry trends, developing strong problem-solving skills, and gaining hands-on experience with various packaging methods. Additionally, effective collaboration and a willingness to learn from both successes and setbacks are essential for long-term success in this dynamic field.

What are the key skills and qualifications needed to thrive as an IC packaging engineer?

To thrive as an IC Packaging Engineer, you typically need a background in electrical, mechanical, or materials engineering and knowledge of semiconductor packaging principles. Familiarity with design tools such as AutoCAD, ANSYS, and semiconductor process simulation software, along with relevant certifications like IPC standards, is crucial. Strong problem-solving, attention to detail, and effective teamwork skills help drive innovation and ensure high-quality outcomes. These competencies are vital for developing reliable, efficient integrated circuit packages that meet industry standards and customer requirements.

What is the difference between Ic Packaging vs IC Design Engineer?

AspectIC PackagingIC Design Engineer
Required CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications in packaging technologies are a plus.Requires a degree in electrical engineering, computer engineering, or related fields; often includes certifications in digital or analog design.
Work EnvironmentManufacturing facilities, R&D labs, and cleanrooms focused on physical packaging and assembly.Design labs, CAD environments, and simulation tools for circuit design and testing.
Employer & Industry UsageFound in semiconductor companies, electronics manufacturers, and R&D centers.Employed by semiconductor firms, integrated circuit companies, and design houses.

IC Packaging and IC Design Engineer roles are closely related but focus on different stages of semiconductor development. IC Packaging involves physically enclosing and protecting the chip, requiring expertise in materials and manufacturing processes. IC Design Engineers focus on creating the circuit layouts and functionalities of the chips. Both roles are essential in the semiconductor industry and often collaborate during product development.

What is IC packaging?

IC packaging refers to the process of enclosing integrated circuits (ICs) in a protective case that allows for electrical connection and heat dissipation. The package safeguards the delicate silicon chip from physical damage and environmental factors while enabling it to be mounted onto printed circuit boards (PCBs). IC packaging types vary in complexity and size, including options like DIP, QFP, BGA, and more, each suited for different applications and performance needs. The packaging also plays a critical role in determining the device's electrical performance, thermal management, and overall reliability.
More about Ic Packaging jobs
What cities are hiring for Ic Packaging jobs? Cities with the most Ic Packaging job openings:
What states have the most Ic Packaging jobs? States with the most job openings for Ic Packaging jobs include:
What job categories do people searching Ic Packaging jobs look for? The top searched job categories for Ic Packaging jobs are:
Ic Packaging jobs near you
Infographic showing various Ic Packaging job openings in the United States as of August 2026, with employment types broken down into 84% Full Time, 11% Part Time, 1% Temporary, 2% Contract, and 2% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

IC Packaging Design Engineer

Comprehensive Resources Inc.

Chandler, AZ • On-site

$138K/yr

Other

Posted 9 days ago

Job description

Job Title: IC Packaging Design Engineer

Location: Chandler, AZ or Hillsboro, OR (100% Onsite)

Duration: Long-Term Contract (12+ Months)

Employment Type: C2C / W2

Openings: 4

Job Description

We are seeking experienced IC Packaging Design Engineers with strong expertise in package substrate design and advanced package layout. The ideal candidate should have hands-on experience with Siemens (Mentor) Xpedition (XPD) or Cadence Allegro Advanced Package Designer (APD/SiP) and a solid understanding of IC package design methodologies.

Required Qualifications
  • Bachelor's or Master's degree in Electrical/Electronics Engineering.
  • Senior Level: 10+ years of IC Packaging / Package Design experience.
  • Mid Level: 4-6+ years (MS) or 6+ years (BS) of relevant experience.
  • Strong hands-on experience with Siemens (Mentor) Xpedition (XPD) (Preferred).
  • Experience with Cadence Allegro APD / SiP is also acceptable.
  • Strong understanding of package substrate design and layout.

Required Skills
  • IC Package Physical Design & Layout
  • Substrate Design & Layout
  • SI/PI Aware Design Implementation
  • Design Rule Compliance (DRC)
  • Design for Performance, Manufacturability, Yield & Reliability
  • Package Floor Planning
  • High-Speed Signal Routing
  • Package Stack-up Design
  • Cross-functional collaboration with SI/PI, Mechanical, and Manufacturing teams

Preferred Skills
  • FCBGA, FCCSP, SiP, or Advanced Packaging experience
  • High-speed interfaces such as PCIe, DDR, HBM, or SerDes
  • Strong problem-solving and debugging skills

Please send your updated resume to:

C2C & W2 candidates are welcome.

Apply