We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead ...
We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead ...
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This ...
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This ...
We are looking for an experienced Engineerwho will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This will ...
We are looking for an experienced Engineerwho will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This will ...
IC Packaging Integration Engineer
$184K - $324K/yr
Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with ...
IC Packaging Integration Engineer
$184K - $324K/yr
Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with ...
IC Packaging Integration Engineer
$184K - $324K/yr
Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with ...
IC Packaging Integration Engineer
$184K - $324K/yr
Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA * Evaluate and select packaging materials (substrates, mold ...
Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA * Evaluate and select packaging materials (substrates, mold ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Description As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization ...
Advanced IC Packaging Engineer
Chandler, AZ · On-site
$175K - $225K/yr
Responsible for the end-to-end development of advanced IC packaging solutions integrating power delivery chiplets into package substrates. * Architect and deliver first-of-its-kind land-side assembly ...
Advanced IC Packaging Engineer
Chandler, AZ · On-site
$175K - $225K/yr
Responsible for the end-to-end development of advanced IC packaging solutions integrating power delivery chiplets into package substrates. * Architect and deliver first-of-its-kind land-side assembly ...
Senior IC Packaging Engineer
Hillsboro, OR · On-site
$113K - $156K/yr
We are looking for a Senior IC Packaging Engineer to join the team. #SCHIE #CSME Responsibilities The Senior IC Package Engineer will be responsible for providing expertise, insight, and support to ...
Senior IC Packaging Engineer
Hillsboro, OR · On-site
$113K - $156K/yr
We are looking for a Senior IC Packaging Engineer to join the team. #SCHIE #CSME Responsibilities The Senior IC Package Engineer will be responsible for providing expertise, insight, and support to ...
Senior IC Packaging Designer
Atlanta, GA · On-site
$98K - $104K/yr
Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing ...
Senior IC Packaging Designer
Atlanta, GA · On-site
$98K - $104K/yr
Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing ...
Senior IC Packaging Designer
$98K - $104K/yr
Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing ...
Senior IC Packaging Designer
$98K - $104K/yr
Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing ...
We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product ...
We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product ...
Senior IC Packaging Engineer
San Jose, CA · On-site
$122K - $168K/yr
Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup ...
Senior IC Packaging Engineer
San Jose, CA · On-site
$122K - $168K/yr
Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup ...
Senior IC Packaging Engineer
$122K - $168K/yr
Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup ...
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Senior IC Packaging Engineer
$122K - $168K/yr
Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup ...
Lead the architecture, design, and development of advanced semiconductor packaging solutions, including 2.5D/3D IC, System-in-Package (SiP), Flip Chip, and Wafer-Level Packaging * Lead development ...
Lead the architecture, design, and development of advanced semiconductor packaging solutions, including 2.5D/3D IC, System-in-Package (SiP), Flip Chip, and Wafer-Level Packaging * Lead development ...
Description In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ...
Description In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ...
Description • In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board ...
Description • In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board ...
Ic Packaging information
See salary details
$12.50 - $13.83
2% of jobs
$13.83 - $15.17
9% of jobs
$16.23 is the 25th percentile. Wages below this are outliers.
$15.17 - $16.50
17% of jobs
The median wage is $17.55 / hr.
$16.50 - $17.83
27% of jobs
$17.83 - $19.17
15% of jobs
$19.57 is the 75th percentile. Wages above this are outliers.
$19.17 - $20.50
15% of jobs
$20.50 - $21.83
6% of jobs
$21.83 - $23.16
4% of jobs
$23.16 - $24.50
3% of jobs
$24.50 - $25.83
1% of jobs
$25.83 - $27.16
0% of jobs
$12
$18
$27
How much do ic packaging jobs pay per hour?
As of Jul 20, 2026, the average hourly pay for ic packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.
What are some common challenges faced by professionals working in IC packaging, and how can job seekers prepare for them?
Professionals in IC packaging often encounter challenges such as keeping up with rapid advancements in packaging technologies, ensuring high yield and reliability, and managing cross-functional communication between design, manufacturing, and testing teams. Job seekers can prepare by staying current with industry trends, developing strong problem-solving skills, and gaining hands-on experience with various packaging methods. Additionally, effective collaboration and a willingness to learn from both successes and setbacks are essential for long-term success in this dynamic field.
What are the key skills and qualifications needed to thrive as an IC Packaging Engineer, and why are they important?
To thrive as an IC Packaging Engineer, you typically need a background in electrical, mechanical, or materials engineering and knowledge of semiconductor packaging principles. Familiarity with design tools such as AutoCAD, ANSYS, and semiconductor process simulation software, along with relevant certifications like IPC standards, is crucial. Strong problem-solving, attention to detail, and effective teamwork skills help drive innovation and ensure high-quality outcomes. These competencies are vital for developing reliable, efficient integrated circuit packages that meet industry standards and customer requirements.
What is the difference between Ic Packaging vs IC Design Engineer?
| Aspect | IC Packaging | IC Design Engineer |
|---|---|---|
| Required Credentials | Typically requires a degree in electrical engineering, materials science, or related fields; certifications in packaging technologies are a plus. | Requires a degree in electrical engineering, computer engineering, or related fields; often includes certifications in digital or analog design. |
| Work Environment | Manufacturing facilities, R&D labs, and cleanrooms focused on physical packaging and assembly. | Design labs, CAD environments, and simulation tools for circuit design and testing. |
| Employer & Industry Usage | Found in semiconductor companies, electronics manufacturers, and R&D centers. | Employed by semiconductor firms, integrated circuit companies, and design houses. |
IC Packaging and IC Design Engineer roles are closely related but focus on different stages of semiconductor development. IC Packaging involves physically enclosing and protecting the chip, requiring expertise in materials and manufacturing processes. IC Design Engineers focus on creating the circuit layouts and functionalities of the chips. Both roles are essential in the semiconductor industry and often collaborate during product development.
What is IC packaging?
IC packaging refers to the process of enclosing integrated circuits (ICs) in a protective case that allows for electrical connection and heat dissipation. The package safeguards the delicate silicon chip from physical damage and environmental factors while enabling it to be mounted onto printed circuit boards (PCBs). IC packaging types vary in complexity and size, including options like DIP, QFP, BGA, and more, each suited for different applications and performance needs. The packaging also plays a critical role in determining the device's electrical performance, thermal management, and overall reliability.
More about Ic Packaging jobs
What cities are hiring for Ic Packaging jobs? Cities with the most Ic Packaging job openings:
What states have the most Ic Packaging jobs? States with the most job openings for Ic Packaging jobs include:
What job categories do people searching Ic Packaging jobs look for? The top searched job categories for Ic Packaging jobs are:
Apple rating
8.1
Based on 670 frontline employees who took The Breakroom Quiz
5th of 30 rated technology retailers
Job description
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team!
Description
• You will be responsible for IC packaging development
• Work with cross-functional teams and lead SoC Package integration and architecture efforts
• Drive the industry with advanced package solutions, new material developments, and specs
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience
Preferred Qualifications
MS/PhD and 6+ years of experience in relevant industry.
We are looking for someone experienced in the semiconductor packaging and/or system integration.
Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration.
Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
Excellent problem solving with strong physics and fundamentals.
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
Basic knowledge of signal integrity/power integrity.
Ability to review schematics, package/PCB layout and designs in Allegro.
Description
• You will be responsible for IC packaging development
• Work with cross-functional teams and lead SoC Package integration and architecture efforts
• Drive the industry with advanced package solutions, new material developments, and specs
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience
Preferred Qualifications
MS/PhD and 6+ years of experience in relevant industry.
We are looking for someone experienced in the semiconductor packaging and/or system integration.
Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration.
Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
Excellent problem solving with strong physics and fundamentals.
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
Basic knowledge of signal integrity/power integrity.
Ability to review schematics, package/PCB layout and designs in Allegro.
About Apple
Sourced by ZipRecruiter
Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Cupertino, CA, US
Year founded
1976