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Ic Packaging Jobs (NOW HIRING)

Apple

IC Packaging Integration Engineer

Austin, TX · On-site

We are looking for versatile and passionate IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead ...

Apple

IC Packaging Integration Engineer

Austin, TX

$181K - $318K/yr

Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with ...

Qualcomm

Staff IC Packaging Engineer

San Diego, CA · On-site

This position is part of Qualcomm's Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomm's current/future chipsets using FEA expertise ...

Apple

IC Packaging Integration Engineer

Austin, TX

$181K - $318K/yr

Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA

$98K - $104K/yr

Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing ...

Axiado

Senior IC Packaging Engineer

San Jose, CA · On-site

$122K - $168K/yr

Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup ...

Axiado

Senior IC Packaging Engineer

San Jose, CA

$122K - $168K/yr

Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup ...

Qualcomm

Principal IC Packaging Engineer

San Diego, CA · On-site

We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product ...

Apple

IC Packaging Simulation Engineer

Austin, TX · On-site

Description • In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board ...

Apple

IC Packaging Simulation Engineer

Austin, TX · On-site

Description In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ...

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All JobsIc Packaging Jobs

Ic Packaging information

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How much do ic packaging jobs pay per hour?

As of Jun 28, 2026, the average hourly pay for ic packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

Is IC a serious condition?

In the context of IC Packaging, the term 'IC' refers to integrated circuits, which are electronic components used in manufacturing. IC packaging involves protecting and connecting these circuits, and it is not related to any medical condition. Therefore, 'IC' in this job role is not a serious condition but a technical term in electronics manufacturing.

What are some common challenges faced by professionals working in IC packaging, and how can job seekers prepare for them?

Professionals in IC packaging often encounter challenges such as keeping up with rapid advancements in packaging technologies, ensuring high yield and reliability, and managing cross-functional communication between design, manufacturing, and testing teams. Job seekers can prepare by staying current with industry trends, developing strong problem-solving skills, and gaining hands-on experience with various packaging methods. Additionally, effective collaboration and a willingness to learn from both successes and setbacks are essential for long-term success in this dynamic field.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer, and why are they important?

To thrive as an IC Packaging Engineer, you typically need a background in electrical, mechanical, or materials engineering and knowledge of semiconductor packaging principles. Familiarity with design tools such as AutoCAD, ANSYS, and semiconductor process simulation software, along with relevant certifications like IPC standards, is crucial. Strong problem-solving, attention to detail, and effective teamwork skills help drive innovation and ensure high-quality outcomes. These competencies are vital for developing reliable, efficient integrated circuit packages that meet industry standards and customer requirements.

Does ibuprofen help interstitial cystitis?

As an IC packaging professional, it is important to understand that ibuprofen is a nonsteroidal anti-inflammatory drug (NSAID) used to reduce pain and inflammation. However, its effectiveness for interstitial cystitis (IC) varies, and it is not a primary treatment for IC. Patients should consult healthcare providers for appropriate management options for IC symptoms.

What is the difference between Ic Packaging vs IC Design Engineer?

AspectIC PackagingIC Design Engineer
Required CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications in packaging technologies are a plus.Requires a degree in electrical engineering, computer engineering, or related fields; often includes certifications in digital or analog design.
Work EnvironmentManufacturing facilities, R&D labs, and cleanrooms focused on physical packaging and assembly.Design labs, CAD environments, and simulation tools for circuit design and testing.
Employer & Industry UsageFound in semiconductor companies, electronics manufacturers, and R&D centers.Employed by semiconductor firms, integrated circuit companies, and design houses.

IC Packaging and IC Design Engineer roles are closely related but focus on different stages of semiconductor development. IC Packaging involves physically enclosing and protecting the chip, requiring expertise in materials and manufacturing processes. IC Design Engineers focus on creating the circuit layouts and functionalities of the chips. Both roles are essential in the semiconductor industry and often collaborate during product development.

What is IC packaging?

IC packaging refers to the process of enclosing integrated circuits (ICs) in a protective case that allows for electrical connection and heat dissipation. The package safeguards the delicate silicon chip from physical damage and environmental factors while enabling it to be mounted onto printed circuit boards (PCBs). IC packaging types vary in complexity and size, including options like DIP, QFP, BGA, and more, each suited for different applications and performance needs. The packaging also plays a critical role in determining the device's electrical performance, thermal management, and overall reliability.

What is IC short for?

In the context of IC Packaging, IC stands for Integrated Circuit, which is a set of electronic circuits manufactured on a small semiconductor chip. IC Packaging involves enclosing the chip in a protective case with electrical connections, requiring knowledge of semiconductor devices and manufacturing processes.

Is IC an autoimmune disease?

IC Packaging is a manufacturing process for integrated circuits and is not related to autoimmune diseases. It involves assembling semiconductor components into protective packages, requiring skills in electronics and cleanroom environments. This job does not involve medical or health-related diagnoses or treatments.
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Ic Packaging jobs near you
Infographic showing various Ic Packaging job openings in the United States as of June 2026, with employment types broken down into 97% Full Time, 1% Part Time, and 2% Contract. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Senior IC Packaging Engineer

Aziro Technologies LLC

San Jose, CA • On-site

Other

Posted 18 days ago

Job description

Job title: Senior IC Packaging Engineer

Location: San Jose, CA, USA

Duration: Full-time

Department: Design

Job Description

Client is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup environment. This role is designed for a senior technologist who combines deep hands-on expertise with system-level thinking, and who thrives in high-ambiguity, high-impact settings.

You will define and drive high-performance, low-power packaging architectures spanning 2D and RDL based fan-out (2.5D), chiplet-based designs, and heterogeneous integration, leading efforts from early technology path finding through production ramp. You will work closely with foundries, OSATs, substrate suppliers, and internal cross-functional teams to shape both product execution and long-term packaging strategy.

Key Responsibilities

  • Serve as technical authority for IC and SiP packaging across multiple products and programs.
  • Own package architecture and technology roadmap, aligned with product, cost, and scalability goals.
  • Lead chiplet-based packaging strategies, including UCIe, silicon interposers, and advanced RDL.
  • Perform and guide hands-on package design and physical layout, including critical structures for High-speed SerDes/PHY (PCIe, CXL), LPDDR5, UCIe, and Other multi-gigabit interfaces.
  • Define substrate stack-ups, materials, bump/RDL architectures, and DFM guidelines for advanced nodes.
  • Drive SI/PI, thermal, mechanical, and reliability trade-offs at the system and package levels.
  • Lead external engagement with OSATs, foundries, and key suppliers for technology development and manufacturing readiness.
  • Influence product roadmap, risk management, and investment decisions through technical insight.
  • Establish scalable design methodologies, best practices, and reusable packaging flows.

Qualifications

  • BSEE or MSEE (PhD a plus) in Electrical Engineering, or related field.
  • Minimum of 10+ years of experience with extensive IC packaging expertise for SoCs, ASICs, or memory products.
  • Deep hands-on expertise in Flip-Chip BGA (FCBGA) and System-in-Package (SiP), RDL, silicon interposers, and chiplet architectures (UCIe)
  • Strong understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies, Design-for-Manufacturing (DFM) and yield optimization
  • Demonstrated ability to operate autonomously, make high-impact decisions, and execute in a startup environment.

Required Experience

  • Technical leadership of multiple end-to-end packaging programs, from early architecture through high-volume production.
  • Proven experience with high-speed SerDes package development, including PCIe Gen5, LPDDR5 / LPDDR5X, USB 3.x or 10G interfaces
  • Experience defining die-to-die and chiplet based RDL/bump architecture.
  • Direct collaboration with OSATs, foundries, and substrate suppliers for co-development and ramp.
  • Strong cross-functional leadership across design, product, test, operations, reliability, and customer teams.
  • Clear understanding of cost, yield, schedule, and risk trade-offs at a product and portfolio level.

Tools & Preferred Skills

  • Cadence Allegro Package Designer (APD) or equivalent EDA tools.
  • Strong background in flip-chip BGA package design and layout.
  • SI/PI expertise preferred, including S-parameter extraction and PDN optimization using HFSS, SIwave, or Ansys Designer.
  • Experience building new packaging methodologies or platforms from scratch.

Apply