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Ic Packaging Jobs (NOW HIRING)

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing ...

Broadcom, Inc.

IC Package Design / Development

San Jose, CA · On-site

$108K - $192K/yr

IC Package Design / Development Role Overview We are seeking an experienced IC Packaging Engineer ... Own packaging deliverables from concept through substrate design, development, qualification, and ...

Broadcom

IC Package Design / Development

San Jose, CA

$108K - $192K/yr

IC Package Design / Development Role Overview We are seeking an experienced IC Packaging Engineer ... Own packaging deliverables from concept through substrate design, development, qualification, and ...

Broadcom

IC Package Design / Development

Irvine, CA

$108K - $192K/yr

IC Package Design / Development Role Overview We are seeking an experienced IC Packaging Engineer ... Own packaging deliverables from concept through substrate design, development, qualification, and ...

Apple

Packaging Assembly Engineer

Austin, TX · On-site

We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip ...

Apple

IC Packaging Simulation Engineer

Austin, TX

$126K - $220K/yr

Description • In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board ...

Apple

IC Packaging Simulation Engineer

Austin, TX

$181K - $318K/yr

Description In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ...

Apple

IC Packaging Simulation Engineer

Austin, TX

$181K - $318K/yr

Description In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ...

Apple

IC Packaging Simulation Engineer

Austin, TX

$126K - $220K/yr

Description • In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board ...

Etched

IC Package Engineer

Cupertino, CA

$2.0K/mo

Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

Leverage advanced packaging technologies, with expertise in CoWoS (Chip-on-Wafer-on-Substrate) and heterogeneous integration techniques, to design both open and closed packages, incorporating ...

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All JobsIc Packaging Jobs

Ic Packaging information

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How much do ic packaging jobs pay per hour?

As of Jun 28, 2026, the average hourly pay for ic packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

Is IC a serious condition?

In the context of IC Packaging, the term 'IC' refers to integrated circuits, which are electronic components used in manufacturing. IC packaging involves protecting and connecting these circuits, and it is not related to any medical condition. Therefore, 'IC' in this job role is not a serious condition but a technical term in electronics manufacturing.

What are some common challenges faced by professionals working in IC packaging, and how can job seekers prepare for them?

Professionals in IC packaging often encounter challenges such as keeping up with rapid advancements in packaging technologies, ensuring high yield and reliability, and managing cross-functional communication between design, manufacturing, and testing teams. Job seekers can prepare by staying current with industry trends, developing strong problem-solving skills, and gaining hands-on experience with various packaging methods. Additionally, effective collaboration and a willingness to learn from both successes and setbacks are essential for long-term success in this dynamic field.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer, and why are they important?

To thrive as an IC Packaging Engineer, you typically need a background in electrical, mechanical, or materials engineering and knowledge of semiconductor packaging principles. Familiarity with design tools such as AutoCAD, ANSYS, and semiconductor process simulation software, along with relevant certifications like IPC standards, is crucial. Strong problem-solving, attention to detail, and effective teamwork skills help drive innovation and ensure high-quality outcomes. These competencies are vital for developing reliable, efficient integrated circuit packages that meet industry standards and customer requirements.

Does ibuprofen help interstitial cystitis?

As an IC packaging professional, it is important to understand that ibuprofen is a nonsteroidal anti-inflammatory drug (NSAID) used to reduce pain and inflammation. However, its effectiveness for interstitial cystitis (IC) varies, and it is not a primary treatment for IC. Patients should consult healthcare providers for appropriate management options for IC symptoms.

What is the difference between Ic Packaging vs IC Design Engineer?

AspectIC PackagingIC Design Engineer
Required CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications in packaging technologies are a plus.Requires a degree in electrical engineering, computer engineering, or related fields; often includes certifications in digital or analog design.
Work EnvironmentManufacturing facilities, R&D labs, and cleanrooms focused on physical packaging and assembly.Design labs, CAD environments, and simulation tools for circuit design and testing.
Employer & Industry UsageFound in semiconductor companies, electronics manufacturers, and R&D centers.Employed by semiconductor firms, integrated circuit companies, and design houses.

IC Packaging and IC Design Engineer roles are closely related but focus on different stages of semiconductor development. IC Packaging involves physically enclosing and protecting the chip, requiring expertise in materials and manufacturing processes. IC Design Engineers focus on creating the circuit layouts and functionalities of the chips. Both roles are essential in the semiconductor industry and often collaborate during product development.

What is IC packaging?

IC packaging refers to the process of enclosing integrated circuits (ICs) in a protective case that allows for electrical connection and heat dissipation. The package safeguards the delicate silicon chip from physical damage and environmental factors while enabling it to be mounted onto printed circuit boards (PCBs). IC packaging types vary in complexity and size, including options like DIP, QFP, BGA, and more, each suited for different applications and performance needs. The packaging also plays a critical role in determining the device's electrical performance, thermal management, and overall reliability.

What is IC short for?

In the context of IC Packaging, IC stands for Integrated Circuit, which is a set of electronic circuits manufactured on a small semiconductor chip. IC Packaging involves enclosing the chip in a protective case with electrical connections, requiring knowledge of semiconductor devices and manufacturing processes.

Is IC an autoimmune disease?

IC Packaging is a manufacturing process for integrated circuits and is not related to autoimmune diseases. It involves assembling semiconductor components into protective packages, requiring skills in electronics and cleanroom environments. This job does not involve medical or health-related diagnoses or treatments.
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Ic Packaging jobs near you
Infographic showing various Ic Packaging job openings in the United States as of June 2026, with employment types broken down into 97% Full Time, 1% Part Time, and 2% Contract. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Senior IC Packaging Designer

Falcomm

Atlanta, GA • On-site

$98K - $104K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 18 days ago

Job description

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless systems? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver cutting-edge wireless solutions that push the boundaries of performance, efficiency, and integration.

Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III-V MMICs devices into production-ready packages.

Responsibilities:
  • Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages.
  • Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools.
  • Work with signal integrity, EM, and thermal simulation teams to validate package performance.
  • Generate package documentation, fabrication drawings, and assembly specifications.
  • Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield.
  • Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss.
  • Support package integration with PCB design teams to ensure optimal RF performance at the system level.
  • Coordinate with fabrication and assembly partners.

Requirements

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
  • 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition.
  • Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging.
  • Must be willing to work full-time, onsite, in Atlanta, GA.
Preferred Skills:
  • Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high-speed interface requirements such as DDR or PCIe.
  • Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre.
  • Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows.
  • Ability to build accurate 3-D models of packages using Ansys Electronics Desktop and EM-simulate them in HFSS and run thermal simulations on them with Icepak

Benefits

  • Competitive Salary and Equity Package
  • Comprehensive Health, Dental, and Vision Insurance
  • 401(k) Retirement Plan
  • Paid Time Off (PTO) and Sick Leave

Disclosure:

  • Falcomm is an Equal Opportunity Employer; employment with Falcomm is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
  • Applicants wishing to view a copy of Falcomm’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify Falcomm.
  • To conform to U.S. Government export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State.