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Ic Packaging Engineer Jobs in Arizona (NOW HIRING)

ARM

Senior Package Layout Engineer

Chandler, AZ · On-site

$161K - $218K/yr

This Engineer will become part of a team responsible for implementing ARM's next generation of SoC ... Developing IC Package Layouts using best-known practices for High Speed Signal and High Power ...

ARM

Senior Package Layout Engineer

Chandler, AZ · Hybrid

$161K - $218K/yr

This Engineer will become part of a team responsible for implementing ARM's next generation of SoC ... Developing IC Package Layouts using best-known practices for High Speed Signal and High Power ...

Arm Limited

Senior Package Layout Engineer

Chandler, AZ · On-site

$150 - $200/hr

This Engineer will become part of a team responsible for implementing ARM's next generation of SoC ... Developing IC Package Layouts using best-known practices for High Speed Signal and High Power ...

New

Advantest

Sr Applications Engineer

Chandler, AZ · On-site

We are looking for proactive individuals with mechanical/thermal/electrical degree engineering ... Semiconductor IC package test socket development experience will have strong advantage.

Advantest

Sr Applications Engineer

Chandler, AZ · On-site

We are looking for proactive individuals with mechanical/thermal/electrical degree engineering ... Semiconductor IC package test socket development experience will have strong advantage.

mercury

Principal Electrical Engineer

Phoenix, AZ

$130K - $159K/yr

Deep knowledge of highspeed digital design, signalintegrity fundamentals, IC package stack ups and ... Experience mentoring junior engineers and leading engineering activities or small technical teams ...

Amkor Technology

Director, fcCSP Business Unit

Tempe, AZ · On-site

$150 - $200/hr

Amkor is seeking a Product Engineer/Manager preferably with experience in IC package development / business acumen, with an emphasis on fcCSP technologies across the various package types (high ...

Mercury Systems

Principal Electrical Engineer

Phoenix, AZ · On-site

$130K - $159K/yr

Deep knowledge of high-speed digital design, signal-integrity fundamentals, IC package stack ups ... Experience mentoring junior engineers and leading engineering activities or small technical teams ...

Mercury Systems

Principal Electrical Engineer

Phoenix, AZ · On-site

$130K - $159K/yr

Deep knowledge of highspeed digital design, signalintegrity fundamentals, IC package stack ups and ... Experience mentoring junior engineers and leading engineering activities or small technical teams ...

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Ic Packaging Engineer information

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How much do ic packaging engineer jobs pay per hour?

As of Sep 7, 2026, the average hourly pay for ic packaging engineer in Arizona is $39.48, according to ZipRecruiter salary data. Most workers in this role earn between $30.48 and $45.91 per hour, depending on experience, location, and employer.

What is an IC Packaging Engineer?

An IC Packaging Engineer is responsible for designing and developing semiconductor packaging solutions to ensure the performance, reliability, and manufacturability of integrated circuits (ICs). They work closely with design, manufacturing, and testing teams to create packaging that meets thermal, electrical, and mechanical requirements. Their role includes material selection, process optimization, and collaboration with suppliers to enhance packaging efficiency and cost-effectiveness.

What does an IC Packaging Engineer do?

IC Packaging Engineers typically focus on designing, developing, and testing packaging solutions for integrated circuits, working closely with cross-functional teams including design, process, and reliability engineers. Day-to-day tasks may include creating layout drawings, performing simulations, evaluating material choices, resolving technical challenges during assembly, and interacting with manufacturing partners. They are responsible for ensuring the package design meets performance, cost, and reliability requirements set by customers or the market. This role often involves regular collaboration and problem-solving to meet tight development timelines and maintain product quality.

What are the key skills and qualifications needed to thrive as an IC Packaging Engineer?

To thrive as an IC Packaging Engineer, you need a robust background in materials science, semiconductor device physics, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Proficiency in design and simulation tools like Cadence, ANSYS, and industry standards such as JEDEC, along with knowledge of thermal, electrical, and reliability testing methods, is essential. Effective communication, cross-functional teamwork, and strong problem-solving skills help you excel in project-based environments. These qualifications are critical for delivering reliable, high-performance integrated circuit packages essential to the semiconductor industry's success.

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Ic Packaging Engineer jobs near you
Infographic showing various Ic Packaging Engineer job openings in Arizona as of August 2026, with employment types broken down into 57% Full Time, 23% Part Time, and 20% Temporary. Highlights an 100% In-person job distribution, with an average salary of $82,118 per year, or $39.5 per hour.

Senior Package Layout Engineer

ARM

Chandler, AZ • On-site

$161K - $218K/yr

Full-time

Posted 5 days ago

Job description

Arm has an excellent opportunity for a Senior Package Layout Engineer in our System-in-Package team! This Engineer will become part of a team responsible for implementing ARM's next generation of SoC's in the IoT, Automotive, and Compute spaces. These designs use pioneering technologies, and you will work closely with other team members in France, US, UK, and other ARM locations to complete their implementation.
Responsibilities:
The engineer will assist in the design, development, and verification of our package designs. The candidate needs to be able work with loosely defined problems and the ability to adapt to design change is important. Your responsibilities include :
  • Developing IC Package Layouts using best-known practices for High Speed Signal and High Power Devices
  • Be able to work independently and effectively resolve complicated design problems.
  • Conduct feasibility studies to evaluate the Package build goals for size, cost, and system performance.
  • Help implement package routing, stack-up creation, reference plane and power distribution using Cadence APD or SiP tool suite.
  • Provide end user guidance and feedback on new or existing methodologies that will help improve the layout team's overall efficiency

Required Skills and Experience :
  • An Electrical Engineering degree or equivalent work experience
  • Experience with 2.5D and 3D package systems and their SI/PI requirements
  • 3-5 years of recent experience in the use of Cadence APD & Allegro toolsets
  • Facilitate standardization by being aware of the bigger picture, including methods that will drive standardization and improve efficiency throughout the department

"Nice To Have" Skills and Experience :
  • Familiarity with EDA vendor collaboration, tool evaluation, and issue resolution
  • Good verbal, written communication and presentation skills
  • Works well in a large geographically dispersed team!
  • Able to optimize design methodologies in packaging design

Salary Range:
$161,500-$218,500 per year
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.
Accommodations at Arm
At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email accommodations@arm.com . To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.
Hybrid Working at Arm
Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team's needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.
Equal Opportunities at Arm
Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don't discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.

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