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Packaging Design Engineer Jobs in Arizona (NOW HIRING)

IC Packaging Design Engineer

Chandler, AZ · On-site

$138K/yr

IC Packaging Design Engineer (Contract) Location: Chandler, Arizona or Hillsboro, Oregon (Onsite) Employment Type: Long-Term Contract About the Role We are seeking experienced IC Packaging Design ...

The Role and Impact As a Silicon Packaging Design Engineer, you will play a critical role in the development of advanced substrate designs that drive Intel's innovation and technological leadership.

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...

Self-motivated engineer who has strong technical background in design and electrical analysis. * Solid background in semiconductor fabrication and packaging * Strong analytical ability and problem ...

Package Design Engineer

Chandler, AZ · On-site

$133K/yr

Your Team, Your Impact Advanced Packaging Physical Design for Photonic Fabric BU What You Can Expect * Package Design: * Lead Si/package/PCB/system co-design work collaborating with downstream system ...

Bachelor's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics ... Expertise in advanced packaging architectures such as EMIB and Foveros. * 5+ years of strong ...

Design and develop sterile packaging components and systems, translating user needs into engineering specifications * Create and execute packaging validation and verification protocols in alignment ...

S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test ... Amkor Technology is currently hiring an IC package Design Engineer for its Tempe, AZ location. This ...

You will be responsible for preparing custom engineering packages, providing technical support ... This role blends engineering design, project coordination, technical communication, and product ...

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Packaging Design Engineer information

See Arizona salary details

$83.9K

$127.2K

How much do packaging design engineer jobs pay per year?

As of Jul 6, 2026, the average yearly pay for packaging design engineer in Arizona is $125,842.00, according to ZipRecruiter salary data. Most workers in this role earn between $126,700.00 and $126,700.00 per year, depending on experience, location, and employer.

What is the difference between Packaging Design Engineer vs Packaging Technician?

AspectPackaging Design EngineerPackaging Technician
CredentialsBachelor's degree in packaging engineering, industrial design, or related fieldHigh school diploma or associate degree, technical training
Work EnvironmentDesign studios, R&D labs, manufacturing settingsProduction lines, warehouse, testing facilities
Job FocusDeveloping and optimizing packaging designs, materials, and prototypesImplementing packaging processes, testing, and quality control
Industry UsageUsed by companies creating new packaging solutionsUsed in packaging assembly and quality assurance

The Packaging Design Engineer primarily focuses on creating and improving packaging designs, requiring specialized education and working in design environments. In contrast, the Packaging Technician handles the implementation, testing, and quality control of packaging in production settings. Both roles are essential in the packaging industry but differ in responsibilities and skill requirements.

What engineers make $500,000?

Senior engineering roles such as petroleum engineers, aerospace engineers, and certain software engineers can reach or exceed a $500,000 annual salary, often with experience, advanced skills, and in high-demand industries. Executive-level engineering positions or those in specialized fields may also achieve this compensation level.

What are the key skills and qualifications needed to thrive as a Packaging Design Engineer, and why are they important?

To thrive as a Packaging Design Engineer, you need a background in engineering or industrial design, strong CAD skills, and a solid understanding of materials science. Familiarity with tools like AutoCAD, SolidWorks, and packaging testing systems, as well as knowledge of industry standards, is typically required. Creativity, problem-solving, and effective collaboration are standout soft skills in this role. These abilities ensure that packaging solutions are innovative, cost-effective, and meet safety and sustainability requirements.

What engineers make $300,000 a year?

Senior engineering roles such as petroleum engineers, aerospace engineers, and certain software engineers can earn $300,000 or more annually, especially with extensive experience, advanced skills, and in high-demand industries. Executive-level engineering positions or those in specialized fields often have compensation packages reaching or exceeding this level.

What engineers make $200,000 a year?

Senior engineering roles such as petroleum engineers, aerospace engineers, and software engineers often have salaries reaching or exceeding $200,000 annually, especially with experience, advanced skills, and in high-demand industries. These positions typically require specialized knowledge, advanced degrees, and sometimes certifications, and may include bonuses or stock options that contribute to total compensation.

What are some common challenges faced by Packaging Design Engineers when developing new packaging solutions?

Packaging Design Engineers often encounter challenges balancing functionality, cost, and sustainability in their designs. They must ensure that packaging protects the product during transit and storage while also considering material efficiency and environmental impact. Additionally, collaborating with cross-functional teams such as marketing, manufacturing, and logistics is crucial to align design with brand requirements and production capabilities. Tight deadlines and changing client specifications can further add to the complexity of the role.

What does a packaging design engineer do?

A packaging design engineer develops and creates packaging solutions that protect products during transportation and storage while meeting branding and regulatory requirements. They use CAD software, materials knowledge, and testing methods to design functional, cost-effective packaging. The role often involves collaboration with manufacturing, marketing, and quality assurance teams to ensure practical and innovative packaging designs.
What job categories do people searching Packaging Design Engineer jobs in Arizona look for? The top searched job categories for Packaging Design Engineer jobs in Arizona are:
What cities in Arizona are hiring for Packaging Design Engineer jobs? Cities in Arizona with the most Packaging Design Engineer job openings:
What are popular job titles related to Packaging Design Engineer jobs in AZ? For Packaging Design Engineer jobs in AZ, the most frequently searched job titles are:
Infographic showing various Packaging Design Engineer job openings in Arizona as of July 2026, with employment types broken down into 89% Full Time, 8% Part Time, and 3% Contract. Highlights an 87% Physical, 3% Hybrid, and 10% Remote job distribution, with an average salary of $125,842 per year, or $60.5 per hour.

IC Packaging Design Engineer

Galent

Chandler, AZ • On-site

$138K/yr

Other

Posted 4 days ago


Job description

Role: IC Packaging Design Engineer (Contract)

Location: Chandler, Arizona or Hillsboro, Oregon (Onsite)
Employment Type: Long-Term Contract

Job Description:

About the Role

We are seeking experienced IC Packaging Design Engineers to support advanced semiconductor packaging programs. The ideal candidates will possess strong expertise in package and substrate design, with hands-on experience in leading package design tools and a deep understanding of performance, manufacturability, and reliability considerations.

Required Technical Skills

  • Strong hands-on experience with Siemens (Mentor) Xpedition (XPD).
  • Alternative experience with Cadence Allegro, Advanced Package Designer (APD), or SiP tools is also acceptable.
  • Solid understanding of semiconductor packaging technologies, package architectures, and substrate design methodologies.

Key Responsibilities

  • Develop and implement physical design and layout solutions for advanced IC packages.
  • Perform substrate design and package layout activities while ensuring adherence to design specifications.
  • Execute signal integrity (SI) and power integrity (PI) aware package designs.
  • Optimize package designs for performance, manufacturability, yield, reliability, and cost efficiency.
  • Ensure compliance with package design rules, technology constraints, and industry standards.
  • Collaborate with cross-functional teams including silicon, system, SI/PI, manufacturing, and reliability engineering teams.
  • Support design reviews, issue resolution, and continuous process improvements throughout the product development lifecycle.

Preferred Experience

Candidates should demonstrate expertise in one or more of the following areas:

  • Physical package design and layout.
  • Substrate design and routing methodologies.
  • SI/PI-aware package implementation.
  • Design for manufacturability (DFM), design for reliability (DFR), and yield optimization.
  • Package design rule verification and compliance.
  • Advanced semiconductor packaging technologies, including multi-die, SiP, or high-performance package solutions.

We are an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, sexual orientation, or gender identity), national origin, citizenship status, age, disability, genetic information, protected veteran status, or any other characteristic protected by applicable law.