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Packaging Design Engineer Jobs in Arizona (NOW HIRING)

Judge Group, Inc.

IC Packaging Design Engineer

Chandler, AZ · On-site

$138K/yr

We are seeking experienced IC Packaging Design Engineers to support advanced semiconductor packaging programs. The ideal candidates will possess strong expertise in package and substrate design, with ...

Intel

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$105K - $149K/yr

As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that fuels Intel ...

Intel

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$135K/yr

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...

black.ai

Substrate IC Package Design Engineer

Tempe, AZ · On-site

$130K - $160K/yr

Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by ... Work closely with global, cross-functional teams across engineering disciplines to ensure design ...

Stryker

Senior Medical Packaging Engineer

Tempe, AZ · On-site

$77K - $129K/yr

Design and develop sterile packaging components and systems, translating user needs into engineering specifications * Create and execute packaging validation and verification protocols in alignment ...

Sitka Inc.

Design Engineer

Flagstaff, AZ · On-site

Category: Engineering, Scientists & Technicians Work Arrangement: Hybrid, On-site Posting Start ... Deliver design packages which include specifications, tolerance analyses, CAD models, material sets ...

Sciprex

Design Engineer

Phoenix, AZ · On-site

Role Lead or play a leading role in the packaging, engineering design, release and launch of exterior trims of a state-of-the-art car Create cutting edge exterior systems focusing on quality ...

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All JobsPackaging Design Engineer JobsPackaging Design Engineer Jobs in Arizona

Packaging Design Engineer information

See Arizona salary details

$83.9K

$127.2K

How much do packaging design engineer jobs pay per year?

As of Sep 9, 2026, the average yearly pay for packaging design engineer in Arizona is $125,842.00, according to ZipRecruiter salary data. Most workers in this role earn between $126,700.00 and $126,700.00 per year, depending on experience, location, and employer.

What are some common challenges faced by a packaging design engineer when developing new packaging solutions?

Packaging Design Engineers often encounter challenges balancing functionality, cost, and sustainability in their designs. They must ensure that packaging protects the product during transit and storage while also considering material efficiency and environmental impact. Additionally, collaborating with cross-functional teams such as marketing, manufacturing, and logistics is crucial to align design with brand requirements and production capabilities. Tight deadlines and changing client specifications can further add to the complexity of the role.

What are the key skills and qualifications needed to thrive as a packaging design engineer, and why are they important?

To thrive as a Packaging Design Engineer, you need a background in engineering or industrial design, strong CAD skills, and a solid understanding of materials science. Familiarity with tools like AutoCAD, SolidWorks, and packaging testing systems, as well as knowledge of industry standards, is typically required. Creativity, problem-solving, and effective collaboration are standout soft skills in this role. These abilities ensure that packaging solutions are innovative, cost-effective, and meet safety and sustainability requirements.

What is the difference between Packaging Design Engineer vs Packaging Technician?

AspectPackaging Design EngineerPackaging Technician
CredentialsBachelor's degree in packaging engineering, industrial design, or related fieldHigh school diploma or associate degree, technical training
Work EnvironmentDesign studios, R&D labs, manufacturing settingsProduction lines, warehouse, testing facilities
Job FocusDeveloping and optimizing packaging designs, materials, and prototypesImplementing packaging processes, testing, and quality control
Industry UsageUsed by companies creating new packaging solutionsUsed in packaging assembly and quality assurance

The Packaging Design Engineer primarily focuses on creating and improving packaging designs, requiring specialized education and working in design environments. In contrast, the Packaging Technician handles the implementation, testing, and quality control of packaging in production settings. Both roles are essential in the packaging industry but differ in responsibilities and skill requirements.

Are packaging design engineers in demand?

Packaging design engineers are in demand due to the growth of e-commerce and consumer product industries, which require innovative and sustainable packaging solutions. They often need skills in CAD software, materials science, and knowledge of industry standards to meet increasing market needs.

How much do packaging design engineers make in the US?

Packaging Design Engineers in the US typically earn a median annual salary of around $70,000 to $90,000, depending on experience, location, and industry. Entry-level positions may start lower, while experienced engineers with specialized skills or certifications can earn over $100,000 annually.

What does a packaging design engineer do?

A packaging design engineer develops and creates packaging solutions that protect products during transportation and storage while also considering branding and user experience. They use CAD software, materials knowledge, and engineering principles to design functional, cost-effective, and sustainable packaging. The role often involves collaboration with manufacturing, marketing, and quality assurance teams to ensure designs meet specifications and standards.

What are popular job titles related to Packaging Design Engineer jobs in Arizona?

For Packaging Design Engineer jobs in Arizona, the most frequently searched job titles are:

What job categories do people searching Packaging Design Engineer jobs in Arizona look for?

The top searched job categories for Packaging Design Engineer jobs in Arizona are:

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Cities in Arizona with the most Packaging Design Engineer job openings:

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For Packaging Design Engineer jobs in AZ, the most frequently searched job titles are:

Packaging Design Engineer jobs near you
Infographic showing various Packaging Design Engineer job openings in Arizona as of August 2026, with employment types broken down into 88% Full Time, 7% Part Time, 2% Temporary, and 3% Contract. Highlights an 82% Physical, 5% Hybrid, and 13% Remote job distribution, with an average salary of $125,842 per year, or $60.5 per hour.

IC Packaging Design Engineer

Chandler, AZ • On-site

Judge Group, Inc.
Recruiting and Staffing Services • 5 - 10K employees
Learn more about Judge Group, Inc.external

$138K/yr

Other

Posted 15 days ago

Job description

Location: Chandler, AZ Salary: Negotiable Description:
Job Description:
We are seeking experienced IC Packaging Design Engineers to support advanced semiconductor packaging programs. The ideal candidates will possess strong expertise in package and substrate design, with hands-on experience in leading package design tools and a deep understanding of performance, manufacturability, and reliability considerations.
Key Responsibilities
  • Develop and implement physical design and layout solutions for advanced IC packages.
  • Perform substrate design and package layout activities while ensuring adherence to design specifications.
  • Execute signal integrity (SI) and power integrity (PI) aware package designs.
  • Optimize package designs for performance, manufacturability, yield, reliability, and cost efficiency.
  • Ensure compliance with package design rules, technology constraints, and industry standards.
  • Collaborate with cross-functional teams including silicon, system, SI/PI, manufacturing, and reliability engineering teams.
  • Support design reviews, issue resolution, and continuous process improvements throughout the product development lifecycle.

Preferred Experience
  • Candidates should demonstrate expertise in one or more of the following areas:
  • Physical package design and layout.
  • Substrate design and routing methodologies.
  • SI/PI-aware package implementation.
  • Design for manufacturability (DFM), design for reliability (DFR), and yield optimization.
  • Package design rule verification and compliance.
  • Advanced semiconductor packaging technologies, including multi-die, SiP, or high-performance package solutions.

Qualifications
  • Bachelor's or Master's degree in Electrical or Electronics Engineering.
  • Senior-Level: 10+ years of experience in IC packaging and package design.
  • Mid-Level: 4-6 years of experience with a Master's degree or 6+ years with a Bachelor's degree in IC packaging and package design.
  • Strong communication skills and the ability to work effectively in a cross-functional engineering environment.

Required Technical Skills
  • Strong hands-on experience with Siemens (Mentor) Xpedition (XPD).
  • Alternative experience with Cadence Allegro, Advanced Package Designer (APD), or SiP tools is also acceptable.
Solid understanding of semiconductor packaging technologies, package architectures, and substrate design methodologies
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