ZipRecruiter

Log In

1

Packaging Design Engineer Jobs in Arizona (NOW HIRING)

Intel

Silicon Packaging Design Engineer

Phoenix, AZ

$135K/yr

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...

Marvell

Advanced Packaging Design Engineer

Chandler, AZ

$133K/yr

Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance ...

Intel

ADCE Packaging Design Architect

Phoenix, AZ

$220K - $311K/yr

Self-motivated engineer who has strong technical background in design and electrical analysis. * Solid background in semiconductor fabrication and packaging * Strong analytical ability and problem ...

Amkor Technology

Engineer, Design

Tempe, AZ · On-site

S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test ... Amkor Technology is currently hiring an IC package Design Engineer for its Tempe, AZ location. This ...

Express Employment

Design Engineer

Phoenix, AZ

$80K - $95K/yr

Create accurate, production-ready drawing packages using SolidWorks * Collaborate with systems ... control, and engineering records * Troubleshoot and resolve design-related production or ...

Accroid Inc

Advanced Packaging Engineer

Phoenix, AZ · On-site

Experience with multi-die package design , silicon interposers , TSV , and advanced substrate ... Bachelor'''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics ...

next page

Showing results 1-20

All JobsPackaging Design Engineer JobsPackaging Design Engineer Jobs in Arizona

Packaging Design Engineer information

See Arizona salary details

$83.9K

$127.2K

How much do packaging design engineer jobs pay per year?

As of Jul 27, 2026, the average yearly pay for packaging design engineer in Arizona is $125,842.00, according to ZipRecruiter salary data. Most workers in this role earn between $126,700.00 and $126,700.00 per year, depending on experience, location, and employer.

What is the difference between Packaging Design Engineer vs Packaging Technician?

AspectPackaging Design EngineerPackaging Technician
CredentialsBachelor's degree in packaging engineering, industrial design, or related fieldHigh school diploma or associate degree, technical training
Work EnvironmentDesign studios, R&D labs, manufacturing settingsProduction lines, warehouse, testing facilities
Job FocusDeveloping and optimizing packaging designs, materials, and prototypesImplementing packaging processes, testing, and quality control
Industry UsageUsed by companies creating new packaging solutionsUsed in packaging assembly and quality assurance

The Packaging Design Engineer primarily focuses on creating and improving packaging designs, requiring specialized education and working in design environments. In contrast, the Packaging Technician handles the implementation, testing, and quality control of packaging in production settings. Both roles are essential in the packaging industry but differ in responsibilities and skill requirements.

What engineers make $500,000?

Senior engineering roles such as petroleum engineers, aerospace engineers, and certain software engineers can reach or exceed a $500,000 annual salary, often with experience, advanced skills, and in high-demand industries. Executive-level engineering positions or those in specialized fields may also achieve this compensation level.

What are the key skills and qualifications needed to thrive as a Packaging Design Engineer, and why are they important?

To thrive as a Packaging Design Engineer, you need a background in engineering or industrial design, strong CAD skills, and a solid understanding of materials science. Familiarity with tools like AutoCAD, SolidWorks, and packaging testing systems, as well as knowledge of industry standards, is typically required. Creativity, problem-solving, and effective collaboration are standout soft skills in this role. These abilities ensure that packaging solutions are innovative, cost-effective, and meet safety and sustainability requirements.

What engineers make $300,000 a year?

Senior engineering roles such as petroleum engineers, aerospace engineers, and certain software engineers can earn $300,000 or more annually, especially with extensive experience, advanced skills, and in high-demand industries. Executive-level engineering positions or those in specialized fields often have compensation packages reaching or exceeding this level.

What engineers make $200,000 a year?

Senior engineering roles such as petroleum engineers, aerospace engineers, and software engineers often have salaries reaching or exceeding $200,000 annually, especially with experience, advanced skills, and in high-demand industries. These positions typically require specialized knowledge, advanced degrees, and sometimes certifications, and may include bonuses or stock options that contribute to total compensation.

What are some common challenges faced by Packaging Design Engineers when developing new packaging solutions?

Packaging Design Engineers often encounter challenges balancing functionality, cost, and sustainability in their designs. They must ensure that packaging protects the product during transit and storage while also considering material efficiency and environmental impact. Additionally, collaborating with cross-functional teams such as marketing, manufacturing, and logistics is crucial to align design with brand requirements and production capabilities. Tight deadlines and changing client specifications can further add to the complexity of the role.

What does a packaging design engineer do?

A packaging design engineer develops and creates packaging solutions that protect products during transportation and storage while meeting branding and regulatory requirements. They use CAD software, materials knowledge, and testing methods to design functional, cost-effective packaging. The role often involves collaboration with manufacturing, marketing, and quality assurance teams to ensure practical and innovative packaging designs.
What are popular job titles related to Packaging Design Engineer jobs in Arizona? For Packaging Design Engineer jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Packaging Design Engineer jobs in Arizona look for? The top searched job categories for Packaging Design Engineer jobs in Arizona are:
What cities in Arizona are hiring for Packaging Design Engineer jobs? Cities in Arizona with the most Packaging Design Engineer job openings:
What are popular job titles related to Packaging Design Engineer jobs in AZ? For Packaging Design Engineer jobs in AZ, the most frequently searched job titles are:
Packaging Design Engineer jobs near you
Infographic showing various Packaging Design Engineer job openings in Arizona as of July 2026, with employment types broken down into 95% Full Time, and 5% Contract. Highlights an 100% In-person job distribution, with an average salary of $125,842 per year, or $60.5 per hour.
Silicon Packaging Design Engineer

Silicon Packaging Design Engineer

Intel

Phoenix, AZ

$135K/yr

Full-time

Medical, Retirement, PTO

Posted 2 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers

Job description

Job Details:Job Description: 

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of computing and connectivity. As a key contributor to Intel's cutting-edge technology, you will play a pivotal role in bridging silicon and hardware design, optimizing package performance, and delivering high-impact solutions that meet performance, cost, and manufacturability goals. Your expertise will directly contribute to Intel's mission to create world-changing technology that improves lives and connects communities worldwide.
Key Responsibilities:


- Design and implement physical layout and routing of silicon interposers and embedded bridges.
- Perform substrate fit and routing studies to evaluate design tradeoffs in performance, cost, and manufacturability.
- Collaborate closely with silicon, technology development and hardware teams to optimize system-level design, including silicon-package-board integration and pinout.
- Propose design updates changes for rules and conduct internal and external reviews to ensure design feasibility.
- Analyze design data and resolve design rule checks (DRCs) to achieve optimized and manufacturable package designs.
- Utilize industry-leading electronic design automation (EDA) tools, including Virtuoso, Innovus, FusionCompiler, ICvalidator, and Calibre, to create robust package layouts.
- Document processes and design specifications in the product lifecycle management system to ensure traceability and efficient collaboration.
- Conduct reviews with partner teams to close milestone requirements

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:


- Bachelor's degree with 3+ years of experience OR Master's degree with 2+ years of experience in Electrical Engineering, Computer Engineering, or a STEM related field

Experience listed above should be in the following:

  • Proficiency in custom layout and Auto-place-and-route EDA tools including Virtuoso, Innovus, FusionCompiler, ICvalidator, and/or Calibre.
  • Experience with silicon physical layout design and development, routing interconnects, and/or review tools.

Additionally, the candidate should have at least one of the following:

  • 1+ year of experience with Analog/Mixed Signal fundamentals for signal integrity assessments and I/O fundamentals.
  • 1+ year of experience of Power Distribution and power integrity assessments.
  • 1+ year of experience of reliability requirements for interconnects.


Preferred Qualifications:

  • Familiarity with industry-leading silicon physical design methodologies and workflows.
  • Ability to effectively collaborate across multi-disciplinary teams and communicate technical concepts clearly.
  • A passion for innovation, problem-solving, and continuous improvement in a fast-paced environment.
  • Prior experience in optimizing silicon performance and conducting tradeoff studies for advanced packaging designs.

Join Intel and become an integral part of shaping tomorrow's technology today. Apply now to seize the opportunity to innovate, lead, and create meaningful impact on a global scale

Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:US, Oregon, HillsboroBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $105,650.00-200,340.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

What Intel employees say

Pay

Benefits

Hours and flexibility

Workplace

Get the full story on Breakroom

Intel logo

About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

View All Intel Jobs

Apply