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Packaging Design Engineer Jobs in Gilbert, AZ (NOW HIRING)

Intel

Silicon Packaging Design Engineer

Phoenix, AZ

$135K/yr

We are seeking an experienced Silicon Packaging Design Engineer with a strong background in board design and package-board integration to drive the end-to-end development of test boards supporting ...

Intel

Silicon Packaging Design Engineer

Phoenix, AZ

$135K/yr

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...

Marvell

Advanced Packaging Design Engineer

Chandler, AZ · On-site

$133K/yr

Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance ...

Express Employment

Design Engineer

Phoenix, AZ

$80K - $95K/yr

Create accurate, production-ready drawing packages using SolidWorks * Collaborate with systems ... control, and engineering records * Troubleshoot and resolve design-related production or ...

Accroid Inc

Advanced Packaging Engineer

Phoenix, AZ · On-site

Experience with multi-die package design , silicon interposers , TSV , and advanced substrate ... Bachelor'''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics ...

Wilson Engineers

Electrical Design Engineer

Tempe, AZ

$80K - $110K/yr

We are currently seeking an experienced Electrical Design Engineer to join our Tempe, Arizona ... Minimum of five (5) years of experience producing EI&C Contract Drawing packages in AutoCAD.

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All JobsPackaging Design Engineer JobsPackaging Design Engineer Jobs in Gilbert, AZ

Packaging Design Engineer information

See Gilbert, AZ salary details

$89.7K

$136.1K

How much do packaging design engineer jobs pay per year?

As of Aug 7, 2026, the average yearly pay for packaging design engineer in Gilbert, AZ is $134,609.00, according to ZipRecruiter salary data. Most workers in this role earn between $135,600.00 and $135,600.00 per year, depending on experience, location, and employer.

What is the difference between Packaging Design Engineer vs Packaging Technician?

AspectPackaging Design EngineerPackaging Technician
CredentialsBachelor's degree in packaging engineering, industrial design, or related fieldHigh school diploma or associate degree, technical training
Work EnvironmentDesign studios, R&D labs, manufacturing settingsProduction lines, warehouse, testing facilities
Job FocusDeveloping and optimizing packaging designs, materials, and prototypesImplementing packaging processes, testing, and quality control
Industry UsageUsed by companies creating new packaging solutionsUsed in packaging assembly and quality assurance

The Packaging Design Engineer primarily focuses on creating and improving packaging designs, requiring specialized education and working in design environments. In contrast, the Packaging Technician handles the implementation, testing, and quality control of packaging in production settings. Both roles are essential in the packaging industry but differ in responsibilities and skill requirements.

What are the key skills and qualifications needed to thrive as a packaging design engineer, and why are they important?

To thrive as a Packaging Design Engineer, you need a background in engineering or industrial design, strong CAD skills, and a solid understanding of materials science. Familiarity with tools like AutoCAD, SolidWorks, and packaging testing systems, as well as knowledge of industry standards, is typically required. Creativity, problem-solving, and effective collaboration are standout soft skills in this role. These abilities ensure that packaging solutions are innovative, cost-effective, and meet safety and sustainability requirements.

What are some common challenges faced by a packaging design engineer when developing new packaging solutions?

Packaging Design Engineers often encounter challenges balancing functionality, cost, and sustainability in their designs. They must ensure that packaging protects the product during transit and storage while also considering material efficiency and environmental impact. Additionally, collaborating with cross-functional teams such as marketing, manufacturing, and logistics is crucial to align design with brand requirements and production capabilities. Tight deadlines and changing client specifications can further add to the complexity of the role.
What are popular job titles related to Packaging Design Engineer jobs in Gilbert, AZ? For Packaging Design Engineer jobs in Gilbert, AZ, the most frequently searched job titles are:
What job categories do people searching Packaging Design Engineer jobs in Gilbert, AZ look for? The top searched job categories for Packaging Design Engineer jobs in Gilbert, AZ are:
Packaging Design Engineer jobs near you
Infographic showing various Packaging Design Engineer job openings in Gilbert, AZ as of August 2026, with employment types broken down into 1% Internship, 84% Full Time, 8% Part Time, and 7% Contract. Highlights an 82% Physical, 7% Hybrid, and 11% Remote job distribution, with an average salary of $134,609 per year, or $64.7 per hour.

IC Packaging Design Engineer

Comprehensive Resources Inc.

Chandler, AZ • On-site

$138K/yr

Other

Posted 6 days ago

Job description

Job Title: IC Packaging Design Engineer

Location: Chandler, AZ or Hillsboro, OR (100% Onsite)

Duration: Long-Term Contract (12+ Months)

Employment Type: C2C / W2

Openings: 4

Job Description

We are seeking experienced IC Packaging Design Engineers with strong expertise in package substrate design and advanced package layout. The ideal candidate should have hands-on experience with Siemens (Mentor) Xpedition (XPD) or Cadence Allegro Advanced Package Designer (APD/SiP) and a solid understanding of IC package design methodologies.

Required Qualifications
  • Bachelor's or Master's degree in Electrical/Electronics Engineering.
  • Senior Level: 10+ years of IC Packaging / Package Design experience.
  • Mid Level: 4-6+ years (MS) or 6+ years (BS) of relevant experience.
  • Strong hands-on experience with Siemens (Mentor) Xpedition (XPD) (Preferred).
  • Experience with Cadence Allegro APD / SiP is also acceptable.
  • Strong understanding of package substrate design and layout.

Required Skills
  • IC Package Physical Design & Layout
  • Substrate Design & Layout
  • SI/PI Aware Design Implementation
  • Design Rule Compliance (DRC)
  • Design for Performance, Manufacturability, Yield & Reliability
  • Package Floor Planning
  • High-Speed Signal Routing
  • Package Stack-up Design
  • Cross-functional collaboration with SI/PI, Mechanical, and Manufacturing teams

Preferred Skills
  • FCBGA, FCCSP, SiP, or Advanced Packaging experience
  • High-speed interfaces such as PCIe, DDR, HBM, or SerDes
  • Strong problem-solving and debugging skills

Please send your updated resume to:

C2C & W2 candidates are welcome.

Apply