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Packaging Design Engineer Jobs in Arizona (NOW HIRING)

Accroid Inc

Advanced Packaging Engineer

Phoenix, AZ · On-site

Experience with multi-die package design , silicon interposers , TSV , and advanced substrate ... Bachelor'''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics ...

Wilson Engineers

Electrical Design Engineer

Tempe, AZ

$80K - $110K/yr

We are currently seeking an experienced Electrical Design Engineer to join our Tempe, Arizona ... Minimum of five (5) years of experience producing EI&C Contract Drawing packages in AutoCAD.

Moog

Mechanical Design Engineer

Phoenix, AZ · On-site

$75K - $126K/yr

Experience with electronics packaging and design. Proficiency in SolidWorks 3D design software ... engineering role. #LI-MC1 Salary Range Transparency: Phoenix, AZ $75,000.00-$126,000.00 Annually ...

Moog

Mechanical Design Engineer

Phoenix, AZ

$75K - $120K/yr

Experience with electronics packaging and design. Proficiency in SolidWorks 3D design software ... engineering role. #LI-MC1 Salary Range Transparency: Phoenix, AZ $75,000.00-$120,000.00 Annually ...

Moog, Inc.

Mechanical Design Engineer

Phoenix, AZ · On-site

$75K - $120K/yr

Mechanical Design Engineer Reporting To: Manager, Design Engineering Work Schedule: Onsite ... that designs and packages spacecraft electronics. You will own the mechanical elements of ...

Trilon Group

Electrical Design Engineer

Tempe, AZ · On-site

$80K - $110K/yr

Electrical Design Engineer Department: Electrical/Energy Employment Type: Full Time Location: Tempe ... Minimum of five (5) years of experience producing EI&C Contract Drawing packages in AutoCAD.

Talon Analytics

Electrical Design Engineer

Tucson, AZ · On-site

We are seeking an experienced Electrical Design Engineer with a strong background in system-level ... Competitive salary and benefits package, including 401k * Opportunities for professional ...

Viasat, Inc.

MMIC Design Engineer

Tempe, AZ · On-site

$149K - $224K/yr

Collaborate with system, packaging, product, and manufacturing engineers to optimize performance and manufacturability. * Generate technical documentation, design reviews, and customer presentations.

Viasat, Inc.

MMIC Design Engineer

Tempe, AZ · On-site

$149K - $224K/yr

Collaborate with system, packaging, product, and manufacturing engineers to optimize performance and manufacturability. * Generate technical documentation, design reviews, and customer presentations.

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Showing results 21-40

All JobsPackaging Design Engineer JobsPackaging Design Engineer Jobs in Arizona

Packaging Design Engineer information

See Arizona salary details

$83.9K

$127.2K

How much do packaging design engineer jobs pay per year?

As of Aug 9, 2026, the average yearly pay for packaging design engineer in Arizona is $125,842.00, according to ZipRecruiter salary data. Most workers in this role earn between $126,700.00 and $126,700.00 per year, depending on experience, location, and employer.

What is the difference between Packaging Design Engineer vs Packaging Technician?

AspectPackaging Design EngineerPackaging Technician
CredentialsBachelor's degree in packaging engineering, industrial design, or related fieldHigh school diploma or associate degree, technical training
Work EnvironmentDesign studios, R&D labs, manufacturing settingsProduction lines, warehouse, testing facilities
Job FocusDeveloping and optimizing packaging designs, materials, and prototypesImplementing packaging processes, testing, and quality control
Industry UsageUsed by companies creating new packaging solutionsUsed in packaging assembly and quality assurance

The Packaging Design Engineer primarily focuses on creating and improving packaging designs, requiring specialized education and working in design environments. In contrast, the Packaging Technician handles the implementation, testing, and quality control of packaging in production settings. Both roles are essential in the packaging industry but differ in responsibilities and skill requirements.

What are the key skills and qualifications needed to thrive as a packaging design engineer, and why are they important?

To thrive as a Packaging Design Engineer, you need a background in engineering or industrial design, strong CAD skills, and a solid understanding of materials science. Familiarity with tools like AutoCAD, SolidWorks, and packaging testing systems, as well as knowledge of industry standards, is typically required. Creativity, problem-solving, and effective collaboration are standout soft skills in this role. These abilities ensure that packaging solutions are innovative, cost-effective, and meet safety and sustainability requirements.

What are some common challenges faced by a packaging design engineer when developing new packaging solutions?

Packaging Design Engineers often encounter challenges balancing functionality, cost, and sustainability in their designs. They must ensure that packaging protects the product during transit and storage while also considering material efficiency and environmental impact. Additionally, collaborating with cross-functional teams such as marketing, manufacturing, and logistics is crucial to align design with brand requirements and production capabilities. Tight deadlines and changing client specifications can further add to the complexity of the role.
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Packaging Design Engineer jobs near you
Infographic showing various Packaging Design Engineer job openings in Arizona as of August 2026, with employment types broken down into 1% Internship, 85% Full Time, 9% Part Time, and 5% Contract. Highlights an 84% Physical, 5% Hybrid, and 11% Remote job distribution, with an average salary of $125,842 per year, or $60.5 per hour.

Sr Staff Package Design Engineer

Renesas Electronics

Tempe, AZ

Full-time

Re-posted 2 days ago

Job description

Job Description
  • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging.
  • Develop Cu RDL with seed layer on IC wafer and FET and Backside metal deposit after grinding
  • Wafer thinning development through Taiko BG and Glass carrier bond
  • Define substrate, die interconnection through via, materials and PCB interface requirements
  • Package technologies qualification for consumer & industrial power as well as automotive power applications.
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
  •  Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps.
  • Establish production controls and monitor to ensure there is no room for quality incidents.
  • Ensure smooth transition into production & implement ramp up monitor.
  • Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
  • Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA.
  • Participate in packaging roadmap development & focus on execution.
  • Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
  • Establish & maintain package design rules
Qualifications
  • Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
  • 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
  • Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
  • Strong interpersonal and communication skills.
  • Strong analytical and presentation skills.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.