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Packaging Design Engineer Jobs in Arizona (NOW HIRING)

Role · Lead or play a leading role in the packaging, engineering design, release and launch of exterior trims of a state-of-the-art car · Create cutting edge exterior systems focusing on quality ...

Electrical Design Engineer

Tempe, AZ · On-site

$80K - $110K/yr

We are currently seeking an experienced Electrical Design Engineer to join our Tempe, Arizona ... Minimum of five (5) years of experience producing EI&C Contract Drawing packages in AutoCAD.

Mechanical Design Engineer Location: Tucson, AZ Zip Code: 85756 Duration: 12 Months Pay Rate: $92 ... Belcan provides a competitive pay and benefits package. We consider several factors when extending ...

Experience with electronics packaging and design. Proficiency in SolidWorks 3D design software ... engineering role. #LI-MC1 Salary Range Transparency: Phoenix, AZ $75,000.00-$120,000.00 Annually ...

Digital Design Engineer

Tucson, AZ · On-site

$97.16/hr

Digital Design Engineer Location: Tucson, AZ Zip Code: 85756 Duration: 12 Months Pay Rate: $97.16 ... Belcan provides a competitive pay and benefits package. We consider several factors when extending ...

Mechanical Design Engineer

Phoenix, AZ · On-site

$75K - $120K/yr

Mechanical Design Engineer Reporting To: Manager, Design Engineering Work Schedule: Onsite ... that designs and packages spacecraft electronics. You will own the mechanical elements of ...

We are seeking an experienced Electrical Design Engineer with a strong background in system-level ... Competitive salary and benefits package, including 401k * Opportunities for professional ...

Electrical Design Engineer

Tempe, AZ · On-site

$80K - $110K/yr

Electrical Design Engineer Department: Electrical/Energy Employment Type: Full Time Location: Tempe ... Minimum of five (5) years of experience producing EI&C Contract Drawing packages in AutoCAD.

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Mechanical Design Engineer

Mesa, AZ · On-site

$90K - $115K/yr

Key Responsibilities Electro-Mechanical & Thermal Packaging * 3D CAD & Enclosure Design: Lead ... Work closely with electrical engineers to integrate custom PCBs, wiring harnesses, lenses, and ...

Manages the design schedule and milestone deliverable process, coordinating across internal engineering resources, delegated design subconsultants, and parallel design teams to ensure design packages ...

Electrical Design Engineer

Tempe, AZ · On-site

$90K - $138K/yr

... package designed to support employees and their families while providing long-term career growth ... Participate in engineering design reviews and continuous product improvements Manufacturing ...

Mechanical Design Engineer

Tempe, AZ · On-site

$85K - $130K/yr

Position Overview GTI is seeking a Mechanical Engineer to support the design and development of ... package designed to support employees and their families while providing long-term career growth ...

We are currently seeking an experienced Electrical Design Engineer to join our Tempe, Arizona ... Minimum of five (5) years of experience producing EI&C Contract Drawing packages in AutoCAD. The ...

Showing results 21-40

Packaging Design Engineer information

See Arizona salary details

$83.9K

$127.2K

How much do packaging design engineer jobs pay per year?

As of Sep 9, 2026, the average yearly pay for packaging design engineer in Arizona is $125,842.00, according to ZipRecruiter salary data. Most workers in this role earn between $126,700.00 and $126,700.00 per year, depending on experience, location, and employer.

What are some common challenges faced by a packaging design engineer when developing new packaging solutions?

Packaging Design Engineers often encounter challenges balancing functionality, cost, and sustainability in their designs. They must ensure that packaging protects the product during transit and storage while also considering material efficiency and environmental impact. Additionally, collaborating with cross-functional teams such as marketing, manufacturing, and logistics is crucial to align design with brand requirements and production capabilities. Tight deadlines and changing client specifications can further add to the complexity of the role.

What are the key skills and qualifications needed to thrive as a packaging design engineer, and why are they important?

To thrive as a Packaging Design Engineer, you need a background in engineering or industrial design, strong CAD skills, and a solid understanding of materials science. Familiarity with tools like AutoCAD, SolidWorks, and packaging testing systems, as well as knowledge of industry standards, is typically required. Creativity, problem-solving, and effective collaboration are standout soft skills in this role. These abilities ensure that packaging solutions are innovative, cost-effective, and meet safety and sustainability requirements.

What is the difference between Packaging Design Engineer vs Packaging Technician?

AspectPackaging Design EngineerPackaging Technician
CredentialsBachelor's degree in packaging engineering, industrial design, or related fieldHigh school diploma or associate degree, technical training
Work EnvironmentDesign studios, R&D labs, manufacturing settingsProduction lines, warehouse, testing facilities
Job FocusDeveloping and optimizing packaging designs, materials, and prototypesImplementing packaging processes, testing, and quality control
Industry UsageUsed by companies creating new packaging solutionsUsed in packaging assembly and quality assurance

The Packaging Design Engineer primarily focuses on creating and improving packaging designs, requiring specialized education and working in design environments. In contrast, the Packaging Technician handles the implementation, testing, and quality control of packaging in production settings. Both roles are essential in the packaging industry but differ in responsibilities and skill requirements.

Are packaging design engineers in demand?

Packaging design engineers are in demand due to the growth of e-commerce and consumer product industries, which require innovative and sustainable packaging solutions. They often need skills in CAD software, materials science, and knowledge of industry standards to meet increasing market needs.

How much do packaging design engineers make in the US?

Packaging Design Engineers in the US typically earn a median annual salary of around $70,000 to $90,000, depending on experience, location, and industry. Entry-level positions may start lower, while experienced engineers with specialized skills or certifications can earn over $100,000 annually.

What does a packaging design engineer do?

A packaging design engineer develops and creates packaging solutions that protect products during transportation and storage while also considering branding and user experience. They use CAD software, materials knowledge, and engineering principles to design functional, cost-effective, and sustainable packaging. The role often involves collaboration with manufacturing, marketing, and quality assurance teams to ensure designs meet specifications and standards.

What are popular job titles related to Packaging Design Engineer jobs in Arizona?

For Packaging Design Engineer jobs in Arizona, the most frequently searched job titles are:

What cities in Arizona are hiring for Packaging Design Engineer jobs?

Cities in Arizona with the most Packaging Design Engineer job openings:

What are popular job titles related to Packaging Design Engineer jobs in AZ?

For Packaging Design Engineer jobs in AZ, the most frequently searched job titles are:

Infographic showing various Packaging Design Engineer job openings in Arizona as of August 2026, with employment types broken down into 88% Full Time, 7% Part Time, 2% Temporary, and 3% Contract. Highlights an 82% Physical, 5% Hybrid, and 13% Remote job distribution, with an average salary of $125,842 per year, or $60.5 per hour.

Senior Staff Package Design Engineer

Tempe, AZ

Full-time

Posted 14 days ago


Job description

Job Description
  • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging. 
  • Package technologies qualification for consumer & industrial power as well as automotive power applications.  
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).  
  • Work with OSAT/CM  to develop, run DOE to optimize processes and establish process spec. 
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame. 
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps.  
  • Establish production controls and monitor to ensure there is no room for quality incidents.  
  • Ensure smooth transition into production & implement ramp up monitor.   
  • Work with OSAT/CM  to monitor and resolve process issues early in the production stage  to ensure only parts with superior quality shipped to customer.  
  • Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA. 
  • Participate in packaging roadmap development & focus on execution.  
  • Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses. 
  • Establish & maintain package design rules.   
Qualifications

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.  
• 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.  
• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.  
• Strong interpersonal and communication skills.  
• Strong analytical and presentation skills.


Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.