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Electronics Packaging Engineer Jobs (NOW HIRING)

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This is a hands-on product development role focused on electronics packaging, enclosure design, thermal management, and electromechanical integration . The engineer will take an existing concept, BOM ...

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Essential Job Duties We are seeking an experienced semiconductor device Packaging Engineer to join ... High power electronic devices including HEMTs, FETs, and diodes * Visible spectrum optoelectronic ...

... electronics packaging, or complex testing services. * Technical Foundation: Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a deeply technical field. A ...

Engineer Sales "Technical"

Phoenix, AZ · On-site

$150K - $250K/yr

... electronics packaging, or complex testing services. * Technical Foundation: Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a deeply technical field. A ...

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Electronics Packaging Engineer information

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$41K

$88.9K

$137.5K

How much do electronics packaging engineer jobs pay per year?

As of Aug 15, 2026, the average yearly pay for electronics packaging engineer in the United States is $88,896.00, according to ZipRecruiter salary data. Most workers in this role earn between $59,500.00 and $109,500.00 per year, depending on experience, location, and employer.

What does an electronics packaging engineer do?

An electronics packaging engineer designs and develops protective enclosures and interconnections for electronic components to ensure durability, thermal management, and electrical performance. They work with CAD software, materials, and manufacturing processes to optimize product reliability and manufacturability, often collaborating with design and manufacturing teams. Knowledge of industry standards and testing methods is essential in this role.

Are electronics packaging engineers in demand?

Electronics packaging engineers are in demand due to the growth of consumer electronics, telecommunications, and semiconductor industries. They require skills in materials, thermal management, and CAD tools, and often find opportunities in manufacturing and R&D environments. The field offers steady job prospects as electronic devices continue to evolve and expand.

What are the typical daily responsibilities of an electronics packaging engineer?

An Electronics Packaging Engineer typically spends their days designing mechanical enclosures for electronic components, performing thermal and structural analyses, selecting appropriate materials, and creating detailed drawings using CAD software. They collaborate closely with electrical engineers, mechanical designers, manufacturing teams, and suppliers to ensure all aspects of the design meet performance, manufacturability, and safety requirements. Regular tasks also include reviewing prototypes, addressing manufacturability issues, and supporting the transition from design to production. This multifaceted role blends hands-on technical work with frequent teamwork and problem-solving to ensure successful electronic product launches.

What is an electronics packaging engineer?

An Electronics Packaging Engineer designs and develops the physical enclosure and interconnects for electronic components, ensuring reliability, thermal management, and signal integrity. They work with materials, manufacturing processes, and industry standards to optimize product performance and durability. Their role spans from conceptual design to production, collaborating with mechanical, electrical, and manufacturing teams.

What are the key skills and qualifications needed to thrive as an electronics packaging engineer?

A successful Electronics Packaging Engineer requires a solid background in electrical engineering, thermal management, materials science, and CAD-based design, often supported by a relevant bachelor’s or master’s degree. Familiarity with industry-standard design software such as AutoCAD, SolidWorks, and simulation tools, as well as adherence to IPC and JEDEC standards, is typically expected. Attention to detail, strong problem-solving skills, and effective collaboration with multidisciplinary teams are valuable soft skills in this field. Mastery of these competencies ensures reliable product development, compliance with industry standards, and seamless integration with manufacturing processes.

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What cities are hiring for Electronics Packaging Engineer jobs?

Cities with the most Electronics Packaging Engineer job openings:

What are the most commonly searched types of Electronics Packaging Engineer jobs?

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What states have the most Electronics Packaging Engineer jobs?

States with the most job openings for Electronics Packaging Engineer jobs include:

Infographic showing various Electronics Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 96% Full Time, 2% Contract, and 2% Nights. Highlights an 100% In-person job distribution, with an average salary of $88,896 per year, or $42.7 per hour.

Subject Matter Expert Electronics Design and Analysis Engineer (Electronic Packaging Design)

Boeing Company

El Segundo, CA • On-site

Other

Medical, Life, Retirement

Posted 2 days ago

New


Boeing rating

8.5

Company rating: 8.5 out of 10

Based on 612 frontline employees who took The Breakroom Quiz

33rd of 540 rated manufacturers


Job description

Subject Matter Expert Electronics Design and Analysis Engineer (Electronic Packaging Design)
Company:
The Boeing Company
Boeing Space, Intelligence & Weapons Systems is currently hiring a Subject Matter Expert Level Space Electronics Packaging and Mechanical Product Design and Analysis Engineer to join us as part of our Electronics Packaging and Product Design Team located in El Segundo, CA.
We are seeking exceptional Mechanical Engineers with a passion for innovation to join our team and become part of something truly remarkable. As a Space Electronics Packaging Design and Analysis Engineer, you will play a pivotal role in shaping the future of space exploration with us.
We offer an unparalleled opportunity to be part of a team that conducts full in-house cradle-to-grave work, providing you with a unique and fulfilling experience. From the moment you step through our doors, you will have the chance to contribute to every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis.
You will be at the forefront of satellite missions, unlocking new frontiers in space exploration. In addition, you will have the opportunity to work on projects involving multichip modules, microelectronics, electronic systems, and much more. The breadth of our work while working alongside world-class engineers and mentors, will inspire and guide you and challenge you to expand your skillset and delve into fascinating new areas, making every day a thrilling adventure.
To further enhance your experience, our on-site satellite factory is at your disposal, enabling you to unleash your creativity and expertise while delivering solutions at the highest level of excellence. This proximity allows for seamless collaboration with satellite engineers, giving you firsthand knowledge of the intricacies and complexities of satellite missions. By working closely with experts in the field, you will contribute to the seamless integration of our electronics packaging solutions, ensuring they meet the rigorous demands of the space environment.
Develop your technical competence as well as your leadership skills at a company with huge potential for long-term career growth. We're highly supportive of innovative thinking, we respect and acknowledge hard work, we recognize maturity and integrity, and we reward bottom-line achievement. #TheFutureIsBuiltHere
Position Responsibilities:
  • Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements.
  • Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements.
  • Performs detailed structural and thermal analysis using hand calculations and analysis tools.
  • Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level.
  • Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs).
  • Validates designs through various methods of review, testing and analysis.
  • Develops, deploys and supports new processes and process improvement to enable efficient performance of engineering tasks to reduce cycle time and drive product improvements.
  • Conducts Root Cause and Corrective Action to investigate failures and go-forward plans.
  • Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements.
  • Supports Supplier Management with make/buy recommendations and other technical services of limited scope.
  • Investigates emerging technologies to develop concepts for future product designs to meet projected requirements.

This position is expected to be 100% onsite. The selected candidate will be required to work onsite in El Segundo, CA.
This worksite participates in Boeing's optional 9/80 schedule rotation. 9/80 is a rotation in which employees can work 9-hour shifts, 8 days per pay period (bi-weekly) and receive every other Friday off.
Basic Qualifications (Required Skills/Experience):
  • This position requires the ability to obtain a US Security Clearance for which the US Government requires ship as a condition of employment. A final U.S. Secret Clearance Post-Start is required.
  • Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
  • 9+ years experience using Computer-Aided Design (CAD) tools
  • Either: Experience with thermal, structural, dynamics, and/or vibration analysis and tools -OR- Experience with Printed Circuit Boards (PCB) design or assembly

Preferred Qualifications (Desired Skills/Experience):
  • An active Secret clearance
  • Experience within aerospace or related industry or with space electronics
  • Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics
  • Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers
  • Skill and ability to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources
  • 3+ years experience leading teams on complex projects
  • Level 4: 9 or more years' related work experience or an equivalent combination of technical education and experience

Conflict of Interest:
Successful candidates for this job must satisfy the Company's Conflict of Interest (COI) assessment process.
Drug Free Workplace:
Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.
Relocation: This position offers relocation based on candidate eligibility. Note: Basic relocation will be offered for eligible internal candidates.
Pay & Benefits:
At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.
The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.
The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.
Pay is based upon candidate experience and qualifications, as well as market and business considerations.
Summary Pay Range (Subject Matter Expert - Level 4): $146,200- $197,800
Language Requirements:
Not Applicable
Education:
Bachelor's Degree or Equivalent
Relocation:
This position offers relocation based on candidate eligibility.
Export Control Requirement:
This position must meet U.S. export control compliance requirements. To meet U.S. export control compliance requirements, a "U.S. Person" as defined by 22 C.F.R. 120.62 is required. "U.S. Person" includes U.S. Citizen, U.S. National, lawful permanent resident, refugee, or asylee.
Safety Sensitive:
This is not a Safety Sensitive Position.
Security Clearance:
This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret Clearance Post-Start is required.
Visa Sponsorship:
Employer will not sponsor applicants for employment visa status.
Contingent Upon Award Program
This position is not contingent upon program award
Shift:
Shift 1 (United States of America)
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Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.
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