Process Control Engineer
Norcross, GA · On-site
Bring advanced electronics manufacturing, packaging, and assembly technologies to commercial ... The position requires a Bachelor's degree or foreign equivalent degree in Industrial Engineering ...
Norcross, GA · On-site
Bring advanced electronics manufacturing, packaging, and assembly technologies to commercial ... The position requires a Bachelor's degree or foreign equivalent degree in Industrial Engineering ...
Norcross, GA · On-site
Bring advanced electronics manufacturing, packaging, and assembly technologies to commercial ... The position requires a Bachelor's degree or foreign equivalent degree in Industrial Engineering ...
Norcross, GA · On-site
Bring advanced electronics manufacturing, packaging, and assembly technologies to commercial ... The position requires a Bachelor's degree or foreign equivalent degree in Industrial Engineering ...
Norcross, GA · On-site
Bring advanced electronics manufacturing, packaging, and assembly technologies to commercial ... The position requires a Bachelor's degree or foreign equivalent degree in Industrial Engineering ...
Experience in antenna and/or electronics packaging; * Experience with harness and interconnect design; * Experience creating engineering drawings; * Experience fabricating prototype designs;
Experience in antenna and/or electronics packaging; * Experience with harness and interconnect design; * Experience creating engineering drawings; * Experience fabricating prototype designs;
Experience in antenna and/or electronics packaging; * Experience with harness and interconnect design; * Experience creating engineering drawings; * Experience fabricating prototype designs;
Experience in antenna and/or electronics packaging; * Experience with harness and interconnect design; * Experience creating engineering drawings; * Experience fabricating prototype designs;
Experience in antenna and/or electronics packaging; * Experience with harness and interconnect design; * Experience creating engineering drawings; * Experience fabricating prototype designs;
Experience in antenna and/or electronics packaging; * Experience with harness and interconnect design; * Experience creating engineering drawings; * Experience fabricating prototype designs;
Experience in antenna and/or electronics packaging; * Experience with harness and interconnect design; * Experience creating engineering drawings; * Experience fabricating prototype designs;
Experience in antenna and/or electronics packaging; * Experience with harness and interconnect design; * Experience creating engineering drawings; * Experience fabricating prototype designs;
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
Atlanta, GA · On-site
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
Atlanta, GA · On-site
This may include high density microelectronic packaging and payload designs and electronic ... The Engineer will be expected to follow established procedures in creation of technical data ...
The position requires collaboration with RFIC designers, packaging engineers, and system teams to ... electronic systems. * Strong understanding of heat transfer principles and thermal management ...
The position requires collaboration with RFIC designers, packaging engineers, and system teams to ... electronic systems. * Strong understanding of heat transfer principles and thermal management ...
Our people are passionate about engineering innovation that improves lives and drives impactful ... C. Dean design documentation, analyzing and interpreting drawing packages to evaluate ...
Our people are passionate about engineering innovation that improves lives and drives impactful ... C. Dean design documentation, analyzing and interpreting drawing packages to evaluate ...
Atlanta, GA · On-site
The position requires collaboration with RFIC designers, packaging engineers, and system teams to ... electronic systems. * Strong understanding of heat transfer principles and thermal management ...
Atlanta, GA · On-site
The position requires collaboration with RFIC designers, packaging engineers, and system teams to ... electronic systems. * Strong understanding of heat transfer principles and thermal management ...
Atlanta, GA · On-site
The position requires collaboration with RFIC designers, packaging engineers, and system teams to ... electronic systems. * Strong understanding of heat transfer principles and thermal management ...
Quick apply
Atlanta, GA · On-site
The position requires collaboration with RFIC designers, packaging engineers, and system teams to ... electronic systems. * Strong understanding of heat transfer principles and thermal management ...
... including computer numerical controls, programmable controllers, and micro-processors ... Learn more about Lockheed Martin's comprehensive benefits package here. Do you want to be part of a ...
... including computer numerical controls, programmable controllers, and micro-processors ... Learn more about Lockheed Martin's comprehensive benefits package here. Do you want to be part of a ...
... including computer numerical controls, programmable controllers, and micro-processors ... Learn more about Lockheed Martin's comprehensive benefits package here. Do you want to be part of a ...
... including computer numerical controls, programmable controllers, and micro-processors ... Learn more about Lockheed Martin's comprehensive benefits package here. Do you want to be part of a ...
Our people are passionate about engineering innovation that improves lives and drives impactful ... C. Dean design documentation, analyzing and interpreting drawing packages to evaluate ...
Our people are passionate about engineering innovation that improves lives and drives impactful ... C. Dean design documentation, analyzing and interpreting drawing packages to evaluate ...
$39.4K - $47.9K
3% of jobs
$47.9K - $56.3K
5% of jobs
$61.7K is the 25th percentile. Wages below this are outliers.
$56.3K - $64.7K
26% of jobs
$64.7K - $73.2K
7% of jobs
The median wage is $81.6K / yr.
$73.2K - $81.6K
9% of jobs
$81.6K - $90K
9% of jobs
$90K - $98.5K
16% of jobs
$99.2K is the 75th percentile. Wages above this are outliers.
$98.5K - $106.9K
6% of jobs
$106.9K - $115.4K
7% of jobs
$115.4K - $123.8K
5% of jobs
$123.8K - $132.2K
6% of jobs
$39.4K
$85.5K
$132.2K
An Electronics Packaging Engineer typically spends their days designing mechanical enclosures for electronic components, performing thermal and structural analyses, selecting appropriate materials, and creating detailed drawings using CAD software. They collaborate closely with electrical engineers, mechanical designers, manufacturing teams, and suppliers to ensure all aspects of the design meet performance, manufacturability, and safety requirements. Regular tasks also include reviewing prototypes, addressing manufacturability issues, and supporting the transition from design to production. This multifaceted role blends hands-on technical work with frequent teamwork and problem-solving to ensure successful electronic product launches.
An Electronics Packaging Engineer designs and develops the physical enclosure and interconnects for electronic components, ensuring reliability, thermal management, and signal integrity. They work with materials, manufacturing processes, and industry standards to optimize product performance and durability. Their role spans from conceptual design to production, collaborating with mechanical, electrical, and manufacturing teams.
A successful Electronics Packaging Engineer requires a solid background in electrical engineering, thermal management, materials science, and CAD-based design, often supported by a relevant bachelor’s or master’s degree. Familiarity with industry-standard design software such as AutoCAD, SolidWorks, and simulation tools, as well as adherence to IPC and JEDEC standards, is typically expected. Attention to detail, strong problem-solving skills, and effective collaboration with multidisciplinary teams are valuable soft skills in this field. Mastery of these competencies ensures reliable product development, compliance with industry standards, and seamless integration with manufacturing processes.

Full-time
Medical, Retirement, PTO
Posted 13 days ago
8.0
Based on 24 frontline employees who took The Breakroom Quiz
36th of 100 rated chemical manufacturers
Get the full story on Breakroom
Sourced by ZipRecruiter
Manufacturing
1,001 - 5,000 Employees
Saint Paul, MN, US
1887